尖端材料國際碩士學位學程

研究成果

篩選
Conference contribution
2019

Adaptive sliding mode control for synchronization of unified hyperchaotic systems

Li, W. L., Liang, W. L. & Chang, K. M., 2019 八月, 2019 24th International Conference on Methods and Models in Automation and Robotics, MMAR 2019. Institute of Electrical and Electronics Engineers Inc., p. 93-98 6 p. 8864640. (2019 24th International Conference on Methods and Models in Automation and Robotics, MMAR 2019).

研究成果: Conference contribution

2018

Application of Electron Channeling Contrast Image on Analysis of Dislocation Structures Induced by Indentation in Nickel Single Crystal

Huang, F. Y. & Kuo, J-C., 2018 九月 9, 19th International Microscopy Congress 2018 (IMC19). Sydney, Australia

研究成果: Conference contribution

Effect of micro-plasma parameters to different kind of solutions for biomedical applications

Hien, N. T. M., Linh, H. Q., Thuy, N. N. S. & Liao, J-D., 2018 一月 1, 6th International Conference on the Development of Biomedical Engineering in Vietnam, BME6. Vo Van, T., Nguyen Le, T. A. & Nguyen Duc, T. (編輯). Springer Verlag, p. 259-262 4 p. (IFMBE Proceedings; 卷 63).

研究成果: Conference contribution

Effect of process parameters on dimension of single-track ss316l deposited by direct energy deposition

Chen, Y. T. & Kuo, J-C., 2018 八月 27, 30th International Conference on Materials Chemistry & Science. Toronto, Canada

研究成果: Conference contribution

Improved contact lens injection molding production by 3D printed conformal cooling channels

Lin, Y. F., Wu, J. R., Liu, B. H., Wei, W. C. J., Wang, A. B. & Luo, R. C., 2018 二月 1, SII 2017 - 2017 IEEE/SICE International Symposium on System Integration. Institute of Electrical and Electronics Engineers Inc., p. 89-94 6 p. (SII 2017 - 2017 IEEE/SICE International Symposium on System Integration; 卷 2018-January).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Texture simulation of cold-rolled F.C.C. metals by using taylor model

Hsiao, S. C. & Kuo, J-C., 2018 八月 27, 30th International Conference on Materials Chemistry & Science. Toronto, Canada

研究成果: Conference contribution

The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

Lin, T. C., Kung, H. Y., Lee, S. H., Chen, M. H., Chiu, Y. T. & Lin, K. L., 2018 六月 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 226-229 4 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)
2017

Application of Electron Channeling Contrast Imaging-Investigation of dislocations in deformed bcc metal

Wu, T. Y. & Kuo, J-C., 2017 十一月 5, IUMRS International Conference in Asia (IUMRS-ICA 2017) in Symposium E3 of Advanced Steels. Taipei, Taiwan

研究成果: Conference contribution

Effect of Atomic Number on Spatial Resolution of Transmission Electron Backscatter Diffraction

Kuo, C. W. & Kuo, J-C., 2017 八月 4, The 2nd International Conference on Advanced Functional Materials. Los Angeles, USA

研究成果: Conference contribution

Effect of doping element on the interfacial reaction behavior of Ag alloy wires bonding on Al pad after HTST and TCT tests

Lin, Y. W., Su, M. C., Huang, W. H., Chiu, Y. T., Shih, T. P. & Lin, K. L., 2017 二月 21, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., p. 613-619 7 p. 7861553. (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Effect of Mg Addition on the Grain Growth Behavior of Austenite in SS400

Lai, C. T., Wu, H. Y., Huang, F. Y., Hsiao, Z. W., Su, Y. H. F., Kuo, J-C. & Lai, H. H., 2017 十一月 5, IUMRS International Conference in Asia (IUMRS-ICA 2017). Taipei, Taiwan

研究成果: Conference contribution

Effect of microstructure on ionic conduction of Composite Electrolytes consisting of doped ceria and carbonates

Fung, K. Z., Ni, C. T., Tsai, S. Y. & Tang, J. Y., 2017 五月 30, ECS Transactions. Kawada, T. & Singhal, S. C. (編輯). 1 編輯 Electrochemical Society Inc., p. 371-376 6 p. (ECS Transactions; 卷 78, 編號 1).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Effect of Stacking Fault Energy on Cold-Rolling Texture and Microstructure of FCC Metals

Kuo, J-C., Hsiao, Z. W. & Chen, H. J., 2017 三月 22, BIT’s 5th Annual Conference of AnalytiX-2017. Fukuoka, Japan

研究成果: Conference contribution

Electrochromic device with functions of rapid switching duty cycle and infrared suppression

Chu, C. H., Wu, H. W., Huang, J. L. & Chiu, C. T., 2017 七月 21, Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017. Meen, T-H., Lam, A. D. K-T. & Prior, S. D. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 349-352 4 p. 7988424. (Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017).

研究成果: Conference contribution

Improved electrical performance of organic thin-film transistors with modified high-K dielectrics

Wu, F. C., Yeh, B. L., Chou, T. H., Chen, J. S., Tsai, M. R., Cheng, H. L. & Chou, W. Y., 2017 八月 8, AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 183-186 4 p. 8006115. (AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings).

研究成果: Conference contribution

In situ synchrotron X-ray diffraction study on the rehydrogenation behavior of MgH2 -LiAlH4 composites

Lin, I. C. & Tsai, W. T., 2017 七月 21, Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017. Meen, T-H., Lam, A. D. K-T. & Prior, S. D. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 1918-1921 4 p. 7988326. (Proceedings of the 2017 IEEE International Conference on Applied System Innovation: Applied System Innovation for Modern Technology, ICASI 2017).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Light-bias interaction of zinc-Tin oxide (ZTO) thin film transistor for charge-Trapping memory application

Chen, J-S., Li, J. T., Liu, L. C., Ke, P. H. & Jeng, J. S., 2017 八月 8, AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 62-65 4 p. 8006077. (AM-FPD 2017 - 24th International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, Proceedings).

研究成果: Conference contribution

Microstructure and Deformation Characteristics of MnS in 1215MS Steel at 1050°C

Huang, F. Y., Su, Y. H. F. & Kuo, J-C., 2017 五月 29, International Conference on Mining, Material, and Metallurgical Engineering (ICMMME). Tokyo, Japan

研究成果: Conference contribution

The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

Niu, X. & Lin, K. L., 2017 九月 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 80-88 9 p. 8046412. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

研究成果: Conference contribution

2016

3D printing of low melting temperature alloys by fused deposition modeling

Hsieh, P. C., Tsai, C. H., Liu, B. H., Wei, W. C. J., Wang, A. B. & Luo, R. C., 2016 五月 19, Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., p. 1138-1142 5 p. 7474915. (Proceedings of the IEEE International Conference on Industrial Technology; 卷 2016-May).

研究成果: Conference contribution

6 引文 斯高帕斯(Scopus)

Ceramic feedstocks for additive manufacturing

Fan, N. C., Wei, W. C. J., Liu, B. H., Wang, A. B. & Luo, R. C., 2016 五月 19, Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., p. 1147-1151 5 p. 7474917. (Proceedings of the IEEE International Conference on Industrial Technology; 卷 2016-May).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Cu-based alloys for 3DP by melt extrusion process

Chou, C. S., Wei, W. C. J., Liu, B. H., Wang, A. B. & Luo, R. C., 2016 五月 19, Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., p. 1152-1157 6 p. 7474918. (Proceedings of the IEEE International Conference on Industrial Technology; 卷 2016-May).

研究成果: Conference contribution

Design and test of additive manufacturing for coating thermoplastic PEEK material

Liu, C. Y., Hsieh, Y. W., Sun, T. J., Zeng, J. W., Wang, A. B., Lee, N. T., Chau, S. W., Wei, W. C., Liu, B. H. & Luo, R. C., 2016 五月 19, Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., p. 1158-1162 5 p. 7474919. (Proceedings of the IEEE International Conference on Industrial Technology; 卷 2016-May).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper

Shia, Z. W., Kuo, C. W., Kuo, T. Y. & Kuo, J-C., 2016 八月 1, International Conference & Exhibition on Advanced & Nano Materials (ICANM). Montreal, Quebec, Canada

研究成果: Conference contribution

Electrical tensile test

Hsueh, H. W., Hung, F. Y., Lui, T. S. & Chen, L. H., 2016 一月 25, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 7390694. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).

研究成果: Conference contribution

Enabling high aspect ratio nano-hole metal filling by employing supercritical carbon dioxide electrochemical deposition

Tsai, W. T., Yang, J. J. & Cheng, C. L., 2016 一月 1, Proceedings of the World Congress on Recent Advances in Nanotechnology, RAN 2016. Avestia Publishing, (World Congress on Recent Advances in Nanotechnology).

研究成果: Conference contribution

Glass and hot extrusion by ME module for 3D additive manufacturing

Wang, P. W., Chou, C. S., Wei, W. C. J., Liu, B. H., Liu, A., Wang, A. B. & Luo, R. C., 2016 五月 19, Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016. Institute of Electrical and Electronics Engineers Inc., p. 1167-1171 5 p. 7474920. (Proceedings of the IEEE International Conference on Industrial Technology; 卷 2016-May).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Optimization of micro-plasma parameters for wound healing

Hien, N. T. M., Linh, H. Q. & Liao, J-D., 2016 十二月 12, BME-HUST 2016 - 3rd International Conference on Biomedical Engineering. Institute of Electrical and Electronics Engineers Inc., p. 146-149 4 p. 7782095. (BME-HUST 2016 - 3rd International Conference on Biomedical Engineering).

研究成果: Conference contribution

Rapid SNP Genotyping of TMIGD1 Gene in Tsaiya Duck Using Lateral-flow Immunoassay with Primer Extension and Nano-gold

Lin, C. W., Kuo, J-C. & Huang, H. L., 2016 七月 25, 10th Asia-Pacific Biotech Congress. Bangkok, Thailand

研究成果: Conference contribution

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Yang, P. F., Huang, L., Hung, C. P., Uegaki, S. & Lin, K-L., 2016 六月 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 497-501 5 p. 7486877. (2016 International Conference on Electronics Packaging, ICEP 2016).

研究成果: Conference contribution

9 引文 斯高帕斯(Scopus)

Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation

Tseng, Y. W., Hung, F-Y. & Lui, T-S., 2016 一月 25, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 7390675. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2015

Application of transmission-EBSD on Copper nanotwin Structure

Shih, J. W., Chen, D. & Kuo, J-C., 2015 七月 8, International Workshop on Advanced and In-situ Microscopies of Functional Nanomaterials and Devices. Hamburg, German

研究成果: Conference contribution

Conductivity enhancement and thin-film processing of Li4Ti5O12(LTO) Spinel for Li battery applications

Tsai, S. Y., Fung, K. Z. & Ni, C. T., 2015 一月 1, Batteries. Fergus, J. W. (編輯). 2 編輯 Electrochemical Society Inc., p. 37-43 7 p. (ECS Transactions; 卷 68, 編號 2).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Dependence of electrical properties on thermal reduction of protecting oxides for SOFC interconnect applications

Tsai, S. Y., Fung, K. Z., Ni, C. T. & Ho, H. C., 2015 一月 1, Solid Oxide Fuel Cells 14, SOFC 2015. Eguchi, K. & Singhal, S. C. (編輯). 1 編輯 Electrochemical Society Inc., p. 1641-1647 7 p. (ECS Transactions; 卷 68, 編號 1).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Effect of different properties of Cu(In1-xGax)Se2 thin films synthesized by femtosecond and nanosecond pulsed laser deposition

Tsai, M. G., Chen, C. C., Chen, Y. J., Chen, I. G., Qi, X., Huang, J. C., Lin, C. Y. & Cheng, C. W., 2015 一月 1, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XX. Roth, S., Xu, X., Nakata, Y. & Neuenschwander, B. (編輯). SPIE, 935019. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 9350).

研究成果: Conference contribution

Effects of surface forces on pure squeeze elastohydrodynamic lubrication motion of circular contacts with coated layer

Chu, L. M., Li, W-L., Chen, Q. D., Yu, C. C. & Yeh, C. Y., 2015 一月 1, Tribology Engineering. Horng, J-H., Wei, C-C. & Hwang, Y-L. (編輯). Trans Tech Publications Ltd, p. 104-109 6 p. (Key Engineering Materials; 卷 642).

研究成果: Conference contribution

Fabrication of arrays of (100) Cu under-bump-metallization for 3D IC packaging

Chiu, W. L., Lu, C. L., Lin, H. W., Liu, C. M., Huang, Y. S., Lu, T. L., Liu, T. C., Hsiao, H. Y., Chen, C., Kuo, J-C. & Tu, K. N., 2015 五月 20, ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., p. 518-522 5 p. 7111069. (ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference).

研究成果: Conference contribution

Stability of Bi2O3-based ionic conductor and its application on composite cathode

Tsai, S. Y., Fung, K. Z., Ni, C. T. & Chang, Y. F., 2015 一月 1, Solid Oxide Fuel Cells 14, SOFC 2015. Singhal, S. C. & Eguchi, K. (編輯). 1 編輯 Electrochemical Society Inc., p. 867-874 8 p. (ECS Transactions; 卷 68, 編號 1).

研究成果: Conference contribution

5 引文 斯高帕斯(Scopus)

Static analysis of spiral-grooved gas film face seal in microsystem

Nguyen, C. C., Jao, H. C. & Li, W. L., 2015 一月 1, 2015 IFToMM World Congress Proceedings, IFToMM 2015. National Taiwan University, (2015 IFToMM World Congress Proceedings, IFToMM 2015).

研究成果: Conference contribution

Study of AZO thin films under different annealing atmosphere on structural, optical and electrical properties by RF magnetron sputtering

Lin, Y. M., Chu, C. H., Wu, H. W. & Huang, J-L., 2015 一月 1, IMECS 2015 - International MultiConference of Engineers and Computer Scientists 2015. Feng, D. D., Ao, S. I., Douglas, C., Ao, S. I., Douglas, C., Lee, J-A., Ao, S. I. & Castillo, O. (編輯). Newswood Limited, p. 807-810 4 p. (Lecture Notes in Engineering and Computer Science; 卷 2).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

The primary results of the N2/Ar micro-plasma exposure on second degree wound healing

Ngo, M. H., Shao, P. L. & Liao, J. D., 2015 一月 1, 5th International Conference on Biomedical Engineering in Vietnam. Toi, V. V. & Phuong, T. H. L. (編輯). Springer Verlag, p. 151-154 4 p. (IFMBE Proceedings; 卷 46).

研究成果: Conference contribution

2014

Effect of Deformation on Crystallographic Texture in Cold-Rolled FePd Alloy

Lin, H. P. & Kuo, J-C., 2014 八月 24, 17th International Conference on Textures of Materials (ICOTOM-17). Dresden, German

研究成果: Conference contribution

Effects of temperature on surface accumulation and release of silica nanoparticles in an epoxy nanocoating exposed to UV radiation

Tien, C. C., Chang, C. H., Liu, B. H., Stanley, D., Rabb, S. A., Yu, L. L., Nguyen, T. & Sung, L., 2014 一月 1, Technical Proceedings of the 2014 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2014. Nano Science and Technology Institute, p. 101-104 4 p. (Technical Proceedings of the 2014 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2014; 卷 3).

研究成果: Conference contribution

Improve efficiency of organic solar cell by adding dispersed Zno nanoparticles

Lu, Y. M., Wu, Y. F. & Hsu, L. C., 2014 一月 9, Materials, Mechanical and Manufacturing Engineering. p. 43-51 9 p. (Advanced Materials Research; 卷 842).

研究成果: Conference contribution

Influence of working pressure on structural and optoelectronic properties of Al-doped ZnO thin films

Chu, C. H., Wu, H. W. & Huang, J. L., 2014 一月 1, Proceedings - 2014 International Symposium on Computer, Consumer and Control, IS3C 2014. IEEE Computer Society, p. 569-572 4 p. 6845947. (Proceedings - 2014 International Symposium on Computer, Consumer and Control, IS3C 2014).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Intermetallic compound growth mechanism and failure modes of flip chip solder bump with different UBM structure during electromigration

Zou, Y. S., Hsiao, Y. H. & Lin, K-L., 2014 一月 30, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., p. 155-158 4 p. 7028311. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Investigation of ceria truncated nano-tetrahedron island, triangular plate stack structure, and columns made by using electron beam deposition

Wu, M. H., Huang, J. L., Kuo, J. C. & Lii, D. F., 2014 一月 1, Proceedings of the 2nd International Conference on Intelligent Technologies and Engineering Systems, ICITES 2013. Chen, C-Y., Yang, C-F. & Juang, J. (編輯). Springer Verlag, p. 323-329 7 p. (Lecture Notes in Electrical Engineering; 卷 293).

研究成果: Conference contribution

Nanostructured LiCoO2 cathode by hydrothermal process

Fung, K. Z., Ni, C. T., Tsai, S. Y., Chen, M. H., Orliukas, A. F. & Bajars, G., 2014 一月 1, Ceramic Materials for Energy Applications IV: Ceramic Engineering and Science Proceedings. Lin, H-T., Katoh, Y. & Matyas, J. (編輯). 7 編輯 American Ceramic Society, p. 23-34 12 p. (Ceramic Engineering and Science Proceedings; 卷 35, 編號 7).

研究成果: Conference contribution

Nanostructured LiCoO2 cathode by hydrothermal process

Fung, K. Z., Ni, C. T., Tsai, S. Y., Chen, M. H., Orliukas, A. F. & Bajars, G., 2014 一月 1, Ceramic Materials for Energy Applications IV: Ceramic Engineering and Science Proceedings. Lin, H-T., Katoh, Y. & Matyas, J. (編輯). 7 編輯 American Ceramic Society, p. 23-34 12 p. (Ceramic Engineering and Science Proceedings; 卷 35, 編號 7).

研究成果: Conference contribution

Preparation and characterization of cubic and rod-shapedindium tin oxide powdersusing thehydrothermal process

Hsu, K. C., Liao, J. D., Xie, Z. Z. & Fu, Y. S., 2014 一月 1, Applied Science and Precision Engineering Innovation. p. 64-68 5 p. (Applied Mechanics and Materials; 卷 479-480).

研究成果: Conference contribution