尖端材料國際碩士學位學程

研究成果

篩選
Conference contribution
2014

Removed organic solderability preservative (OSPs) by Ar/O2 microwave plasma to improve solder joint in thermal compression flip chip bonding

Peng, J. W., Chen, Y. S., Chen, Y., Liang, J. L., Lin, K. L. & Lee, Y. L., 2014 九月 11, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 1584-1589 6 p. 689750. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Chen, Y. F., Yang, P. F., Huang, L. & Lin, K-L., 2014 九月 11, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 419-424 6 p. 6897319. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

5 引文 斯高帕斯(Scopus)

The IMC formation and progress in the copper pillar Cu/Sn1.8Ag /OSP-Cu microbump structure upon current stressing

Chen, C. W., Lin, K-L., Chiu, Y. T., Kao, C. L., Lee, C. W. & Yang, P. F., 2014 一月 30, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., p. 518-521 4 p. 7028325. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

研究成果: Conference contribution

The physics of Cu pillar bump interconnect under electromigration stress testing

Hsiao, Y. H., Chen, C. F., Yang, P. F., Lee, C. C., Liu, M. C., Lin, K-L., Chen, C. W. & Factor, B. J., 2014 十一月 18, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 6962759. (Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)
2013

Characteristics and bioactivity of CaP porous coating with bio-inspired dopamine

Liu, Y. T., Kung, K. C., Lee, T. M. & Lui, T. S., 2013 一月 1, Bioceramics 24. 1 編輯 p. 233-236 4 p. (Key Engineering Materials; 卷 529-530, 編號 1).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Effect of Boron Content on Glass Forming Ability of Fe-B-Y-Nb Alloys

Lin, F. W., Kuo, J-C. & Chen, I. G., 2013 六月 30, The 20th International Symposium on Metastable, Amorphous and Nanostructured Materials. Torino, Italy

研究成果: Conference contribution

Effect of grain size and basal texture on tensile properties and fracture characteristics of extruded AZ31 alloy

Chen, H. C., Lui, T-S. & Chen, L. H., 2013 四月 16, Magnesium Technology 2013 - Held During the TMS 2013 Annual Meeting and Exhibition. p. 83-87 5 p. (Magnesium Technology).

研究成果: Conference contribution

Effects of inkjet printing parameters on conductive line patterns for flexible electronics applications

Tsai, H. L., Hwang, W. S., Liu, Y. F., Wu, J. T. & Hsu, L-C., 2013, Technical Proceedings of the 2013 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2013. 卷 2. p. 256-259 4 p.

研究成果: Conference contribution

HMT-induced and NaOH assisted hydrothermal synthesis of ZnO single crystal nanorods

Hsu, K. C., Liao, J-D. & Fu, Y. S., 2013 三月 19, Information, Communication and Engineering. p. 413-418 6 p. (Applied Mechanics and Materials; 卷 311).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Hydrogen adsorption on mesoporous silica microtubules fabricated through the self-assembly of alpha-cyclodextrin and pluronic F127 surfactant

Deulkar, S. H., Lai, W. H. & Huang, J. L., 2013 一月 1, IEEE Nanotechnology Materials and Devices Conference, IEEE NMDC 2013. IEEE Computer Society, p. 53-58 6 p. 6707453. (IEEE Nanotechnology Materials and Devices Conference, IEEE NMDC 2013).

研究成果: Conference contribution

Improving the performances of hydrodynamic journal bearings by anisotropic slip boundary

Chen, C. Y., Jao, H. C., Chen, M. D. & Li, W-L., 2013 一月 1, 5th World Tribology Congress, WTC 2013. Politecnico di Torino (DIMEAS), p. 1125-1127 3 p. (5th World Tribology Congress, WTC 2013; 卷 2).

研究成果: Conference contribution

Nanowire based solar cell on multilayer transparent conducting films

Sahu, D. R., Huang, J-L. & Mathur, S., 2013 四月 8, Nanostructured Materials and Nanotechnology V - A Collection of Papers Presented at the 36th International Conference on Advanced Ceramics and Composites, ICACC 2012. 7 編輯 p. 45-53 9 p. (Ceramic Engineering and Science Proceedings; 卷 33, 編號 7).

研究成果: Conference contribution

Preparation and characterization of cubic and rod-shaped indium tin oxide powders using the hydrothermal process

Hsu, K. C., Liao, J-D., Xie, Z. Z. & Fu, Y. S., 2013 三月 19, Information, Communication and Engineering. p. 430-434 5 p. (Applied Mechanics and Materials; 卷 311).

研究成果: Conference contribution

Recrystallization of Ag and Ag-La alloy wire in wire bonding process

Hsueh, H. W., Hung, F-Y. & Lui, T-S., 2013 十月 29, Materials and Measurement. p. 151-157 7 p. (Advanced Materials Research; 卷 804).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Tensile mechanical properties and brittle effect of austempered Cr-Mo alloy steel

Chen, C. Y., Hung, F-Y., Lui, T-S. & Chen, L. H., 2013 四月 26, 4th International Symposium on High-Temperature Metallurgical Processing - Held During the TMS 2013 Annual Meeting and Exhibition. p. 299-306 8 p. (TMS Annual Meeting).

研究成果: Conference contribution

The growth and segregation of intermetallic compounds in the bulk of flip chip Sn2.4Ag solder joint under electrical current stressing

Wang, W. C., Lin, K-L., Chiu, Y. T. & Lai, Y. S., 2013 九月 9, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. p. 1600-1605 6 p. 6575785. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)
2012

Annealing effect and tensile interface fracture mechanism of pure silver bonding wires

Hsueh, H. W., Hung, F. Y., Lui, T. S. & Chen, L. H., 2012 五月 15, Extraction and Processing Division - 2012 EPD Congress - Held During the TMS 2012 Annual Meeting and Exhibition. p. 145-152 8 p. (TMS Annual Meeting).

研究成果: Conference contribution

Application of digital image correlation (DIC) on magnetostriction of Fe-Pd alloy

Chiue, J. Y., Lin, H. P. & Kuo, J. C., 2012 一月 30, THERMEC 2011. p. 1937-1942 6 p. (Materials Science Forum; 卷 706-709).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

A study of microstructural stability of friction stir welded joints of Al-Mg alloys during subsequent thermal exposure

Lin, C. Y., Lui, T-S. & Chen, L. H., 2012 五月 16, Light Metals 2012 - Proceedings of the Technical Sessions Presented by the TMS Aluminum Committee at the TMS 2012 Annual Meeting and Exhibition. p. 527-532 6 p. (TMS Light Metals).

研究成果: Conference contribution

Building materials effects of al content and physical properties on the electromagnetic interference shielding of sn based coating thin layers

Hung, F. S., Hung, F-Y., Chiang, C. M. & Lui, T-S., 2012 一月 1, Intelligent Materials, Applied Mechanics and Design Science, IMAMD2011. 3 編輯 p. 142-151 10 p. (Applied Mechanics and Materials; 卷 142, 編號 3).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Charge-discharge mechanism of MgC powders and Mg-Li Alloy thin film materials

Chen, Y. T., Hung, F. Y., Lui, T. S., Xiao, R. S., Tseng, Y. W. & Wang, C. H., 2012 五月 15, Magnesium Technology 2012 - Held During TMS 2012 Annual Meeting and Exhibition. p. 493-497 5 p. (Magnesium Technology).

研究成果: Conference contribution

Effect of low-intensity pulsed ultrasound on the nano-mechanical properties of cholesterol-manipulated cells

Lai, W. H., Liao, J. D. & Wang, S. H., 2012 十二月 1, 2012 IEEE International Ultrasonics Symposium, IUS 2012. p. 600-603 4 p. 6562337. (IEEE International Ultrasonics Symposium, IUS).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Effect of Pulse Plating Frequency on Microstructure of Electrodeposited Copper Film

Huang, F. Y., Lin, H. P. & Kuo, J-C., 2012 十月 21, 16th APCCC. Taiwan

研究成果: Conference contribution

Effect of silicon particles on the tensile properties of heat resistant Al-Si-Cu-Ni-Mg alloy pertaining to different tensile temperature

Chuang, H. C., Lui, T-S. & Chen, L. H., 2012, Light Metals 2012 - Proceedings of the Technical Sessions Presented by the TMS Aluminum Committee at the TMS 2012 Annual Meeting and Exhibition. p. 461-466 6 p.

研究成果: Conference contribution

Effect of tool rotational speed on the microstructures and tensile properties of 7075 aluminum alloy via Friction Stir Process (FSP)

Ku, M. H., Hung, F-Y., Lui, T-S. & Chen, L. H., 2012 五月 16, Light Metals 2012 - Proceedings of the Technical Sessions Presented by the TMS Aluminum Committee at the TMS 2012 Annual Meeting and Exhibition. p. 475-480 6 p. (TMS Light Metals).

研究成果: Conference contribution

Effects of electric double layer on pure squeeze motion of circular contacts - An elastohydrodynamic lubrication model

Chu, L. M., Li, W-L., Hsu, H. C. & Tsai, J. S., 2012 四月 2, Nanotechnology and Advanced Materials. p. 497-502 6 p. (Advanced Materials Research; 卷 486).

研究成果: Conference contribution

Effects of friction stir process on the tensile properties of AZ61 magnesium alloy at room temperature to 200°C

Chen, H. C., Lui, T-S., Chen, L. H. & Hung, F-Y., 2012 五月 15, Magnesium Technology 2012 - Held During TMS 2012 Annual Meeting and Exhibition. p. 525-529 5 p. (Magnesium Technology).

研究成果: Conference contribution

Influence of strontium on in vitro bioactivity of heat-treated porous Ca-P ceramics on titanium for biomedical applications

Kung, K. C., Lee, T. M. & Lui, T. S., 2012 一月 1, Bioceramics 23. p. 453-457 5 p. (Key Engineering Materials; 卷 493-494).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Innovation and annealed effect of Sn-Al and Sn-Cu compositethin films on the electromagnetic interference shielding for the green materials

Hung, F. S., Hung, F-Y., Chiang, C. M. & Lui, T-S., 2012 一月 1, Renewable and Sustainable Energy. p. 547-554 8 p. (Advanced Materials Research; 卷 347-353).

研究成果: Conference contribution

Magnetron sputtering of tantalum oxide thin electrolyte film for electrochromic applications

Liu, C. C., Liu, K. I., Lin, H. T. & Huang, J-L., 2012 六月 29, High-Performance Ceramics VII. p. 1604-1608 5 p. (Key Engineering Materials; 卷 512-515).

研究成果: Conference contribution

Phase transformation of Cu@Ag core-shell nanoparticles upon heating

Tsai, C. H., Chen, S. Y., Song, J. M., Chen, I-G. & Lee, H. Y., 2012 十二月 1, 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012. 6523432. (2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012).

研究成果: Conference contribution

The crystallization characteristics and photoluminescence properties of ZnO/Ag nanoflower arrays

Hu, Z. S., Hung, F. Y., Chang, S. J. & Chen, K. J., 2012 十一月 19, Technical Digest - 25th International Vacuum Nanoelectronics Conference, IVNC 2012Om. p. 176-180 5 p. 6316893. (Technical Digest - 25th International Vacuum Nanoelectronics Conference, IVNC 2012).

研究成果: Conference contribution

The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test

Yeh, F. J., Chiu, T. C. & Lin, K-L., 2012, 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 6507860

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads

Lin, H. W., Lu, J. L., Liu, C. M., Chen, C., Tu, K. N., Chen, D. & Kuo, J-C., 2012 十二月 1, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings. p. 90-93 4 p. 6420285. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Using the simplified 3D DIC method to measure the deformation of 3D surface

Tung, S. H., Kuo, J-C., Shih, M. H. & Sung, W. P., 2012 一月 1, Frontiers of Manufacturing and Design Science II. p. 3945-3949 5 p. (Applied Mechanics and Materials; 卷 121-126).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)
2011

Application of the digital image correlation method to micro hole drilling

Tung, S. H., Shih, M. H. & Kuo, J. C., 2011 十二月 1, Proceedings of the 13th International Conference on Civil, Structural and Environmental Engineering Computing. (Proceedings of the 13th International Conference on Civil, Structural and Environmental Engineering Computing).

研究成果: Conference contribution

A study of the nucleation and growth of silver nanowires on titanium dioxide

Chen, H. T., Tung, H. T., Song, J. M., Chen, I-G. & Lee, H. Y., 2011 十二月 1, 2011 11th IEEE International Conference on Nanotechnology, NANO 2011. p. 1080-1083 4 p. 6144357. (Proceedings of the IEEE Conference on Nanotechnology).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Effect of Accelerating Voltage and Probe Current on EBSD Spatial Resolutions

Chen, D. & Kuo, J-C., 2011 五月 22, 5th Congress of the International Union of Microbeam Analysis Societies (IUMAS-V). Seoul Olympic Parktel, Seoul, Korea

研究成果: Conference contribution

Effect of Annealing Temperature on Microstructures and Magnetic Properties for Ferromagnetic Shape Memory Fe-Pd Alloys

Hsu, C-W., Ng, Y. & Kuo, J-C., 2011 九月 19, IUMRS-ICA 2011暨100年中國材料科學學會年會. Taipei, Taiwan

研究成果: Conference contribution

Effect of Li doping on high color purity CaTiO3: Eu red phosphor for solid-state lighting

Wu, Y. F., Nien, Y. T., Wang, Y. J. & Chen, I. G., 2011 十二月 1, Society for Information Display - 18th International Display Workshops 2011, IDW'11. p. 1433-1436 4 p. (Proceedings of the International Display Workshops; 卷 3).

研究成果: Conference contribution

Effect of Pulse Plating Frequency on Electrical and Mechanical Properties of Electrodeposited Copper Films

Lin, Y-W., Chen, J-J. & Kuo, J-C., 2011 九月 19, IUMRS-ICA 2011暨100年中國材料科學學會年會. Taipei, Taiwan

研究成果: Conference contribution

Effect of Pulse Plating Frequency on Properties of Electrodeposited Copper Films

Lin, Y-W., Chen, D. & Kuo, J-C., 2011 十一月 20, International Thin Films Conference TACT 2011. Kenting, Taiwan

研究成果: Conference contribution

Electrical properties of a single p-type ZnO nanowire by Ga implantation with FIB

Chu, W. H. & Liu, C-P., 2011 九月 26, 4th IEEE International NanoElectronics Conference, INEC 2011. 5991791. (Proceedings - International NanoElectronics Conference, INEC).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints

Deng, W. J., Lin, K-L., Chiu, Y. T. & Lai, Y. S., 2011 七月 21, 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011. p. 114-117 4 p. 5898500. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

7 引文 斯高帕斯(Scopus)

Evaluation of rotational speed and post annealing effect on the microstructural homogeneity of friction stir processed 5083 aluminum alloy

Lin, C. Y., Lui, T. S. & Chen, L. H., 2011 一月 1, Friction Stir Welding and Processing VI - Held During the TMS 2011 Annual Meeting and Exhibition. Minerals, Metals and Materials Society, p. 315-321 7 p. (TMS Annual Meeting).

研究成果: Conference contribution

High Surface-Enhanced Raman Scattering (SERS) sensitivity of R6G by fabrication of silver nanoparticles over GaN nanowires

Dar, N., Wang, W. J., Lee, K. H. & Chen, I-G., 2011 十二月 1, 2011 11th IEEE International Conference on Nanotechnology, NANO 2011. p. 297-300 4 p. 6144370. (Proceedings of the IEEE Conference on Nanotechnology).

研究成果: Conference contribution

6 引文 斯高帕斯(Scopus)

Low-stress transfer of graphene and its tuneable resistance by remote plasma treatments in hydrogen

Chen, W., Tu, C. H., Liang, K. C., Liu, C. Y., Liu, C. P. & Tzeng, Y., 2011 十二月 1, 2011 11th IEEE International Conference on Nanotechnology, NANO 2011. p. 1093-1096 4 p. 6144398. (Proceedings of the IEEE Conference on Nanotechnology).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

Modeling Phase Transformation in Hot Rolled Low Carbon Steel

Su, B., Luo, S-J., Pan, Y-T. & Kuo, J-C., 2011 九月 19, IUMRS-ICA 2011暨100年中國材料科學學會年會. Taipei, Taiwan

研究成果: Conference contribution

Nano-structure and nano-mechanical properties of human teeth

Chung, C. J., Wu, B. H., Lin, J. F., Han, C. F., Chuang, S. F. & Li, W. L., 2011 十月 4, NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. p. 593-596 4 p. 6017425. (NEMS 2011 - 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems).

研究成果: Conference contribution