尖端材料國際碩士學位學程

研究成果

篩選
Conference contribution
Conference contribution

The investigations of InAs quantum dots overgrown on in 0.1Ga0.9As surfactant layer and 10° off-angle (100) GaAs substrate

Tang, S. F., Hsu, M. Y., Chiang, C. D., Su, C. C., Liu, C. P. & Fang, Y. C., 2008 三月 31, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV. 68001E. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 6800).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating

Kuo, Y. L. & Lin, K-L., 2011 十二月 1, APM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials. p. 193-198 6 p. 6105698. (Proceedings - International Symposium on Advanced Packaging Materials).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

The magnetic anisotropy properties of Ga0.93Mn0.07As by low-temperature annealing

Lee, W., Chen, Y-F., Huang, J-L., Huang, B., Kuo, C., Chin, T. & Ku, H., 2006 十二月 1, INTERMAG 2006 - IEEE International Magnetics Conference. 1 p. 4261600. (INTERMAG 2006 - IEEE International Magnetics Conference).

研究成果: Conference contribution

The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

Niu, X. & Lin, K. L., 2017 九月 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 80-88 9 p. 8046412. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

研究成果: Conference contribution

The microstructure and fracture behavior of Sn-3Ag-o.5Cu solder joints

Wang, T. S., Liu, S. C., Huang, Y. L., Lin, K-L. & Lai, Y. S., 2008 十二月 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 293-296 4 p. 4784286. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

研究成果: Conference contribution

The physics of Cu pillar bump interconnect under electromigration stress testing

Hsiao, Y. H., Chen, C. F., Yang, P. F., Lee, C. C., Liu, M. C., Lin, K-L., Chen, C. W. & Factor, B. J., 2014 十一月 18, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 6962759. (Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

The preferential growth of η-Cu6Sn5 on (111) uni-directional Cu pads

Lin, H. W., Lu, J. L., Liu, C. M., Chen, C., Tu, K. N., Chen, D. & Kuo, J-C., 2012 十二月 1, 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2012 - Proceedings. p. 90-93 4 p. 6420285. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

The primary results of the N2/Ar micro-plasma exposure on second degree wound healing

Ngo, M. H., Shao, P. L. & Liao, J. D., 2015 一月 1, 5th International Conference on Biomedical Engineering in Vietnam. Toi, V. V. & Phuong, T. H. L. (編輯). Springer Verlag, p. 151-154 4 p. (IFMBE Proceedings; 卷 46).

研究成果: Conference contribution

The properties of Ti-doped ZnO films before and after annealing in the different atmosphere

Lin, S. S. & Huang, J-L., 2006 一月 1, Heat Treatment of Materials, AHTM ' 05 - Proceedings of the 3rd Asian Conference on Heat Treatment of Materials. Trans Tech Publications Ltd, p. 571-576 6 p. (Solid State Phenomena; 卷 118).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

The striated deformation of Sn solders under high frequency resonant vibration

Chuang, C. M., Lui, T. S. & Chen, L. H., 2001 一月 1, Advances in Electronic Materials and Packaging 2001. Lee, S. B. & Paik, K. W. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 328-334 7 p. 984005. (Advances in Electronic Materials and Packaging 2001).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

The wetting interaction between electroless NiP deposit/Cu substrate and SnAg solder

Hsieh, P. & Lin, K-L., 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. p. 29-32 4 p. 6117224

研究成果: Conference contribution

Use of nanoindentation for investigating the nanostructure of dentin tissue

Wu, B. H., Chung, C. J., Han, C. F., Chen, T. Y. F., Chuang, S. F., Li, W. L. & Lin, J. F., 2011 十二月 1, Mechanics of Biological Systems and Materials - Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics. p. 153-158 6 p. (Conference Proceedings of the Society for Experimental Mechanics Series; 卷 2).

研究成果: Conference contribution

Using the simplified 3D DIC method to measure the deformation of 3D surface

Tung, S. H., Kuo, J-C., Shih, M. H. & Sung, W. P., 2012 一月 1, Frontiers of Manufacturing and Design Science II. p. 3945-3949 5 p. (Applied Mechanics and Materials; 卷 121-126).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

VGCF/carbon composites for plasma-facing materials

Lake, M. L. & Ting, J. M., 1993 十二月 1, Proceedings of SPIE - The International Society for Optical Engineering. Khounsary, A. M. (編輯). Publ by Society of Photo-Optical Instrumentation Engineers, p. 196-205 10 p. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 1997).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation

Tseng, Y. W., Hung, F-Y. & Lui, T-S., 2016 一月 25, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 7390675. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)