尖端材料國際碩士學位學程

研究成果 1982 2020

篩選
Conference contribution
2008

The microstructure and fracture behavior of Sn-3Ag-o.5Cu solder joints

Wang, T. S., Liu, S. C., Huang, Y. L., Lin, K-L. & Lai, Y. S., 2008 十二月 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 293-296 4 p. 4784286. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

研究成果: Conference contribution

Soldering alloys
Fracture energy
Ductile fracture
Microstructure
Intermetallics
2007
18 引文 (Scopus)

Advanced CD-AFM probe tip shape characterization for metrology accuracy and throughput

Liu, B. H., Osborne, J. R., Osborn, M. & Dahlen, G. A., 2007 十月 15, Metrology, Inspection, and Process Control for Microlithography XXI. PART 3 編輯 65183K. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 6518, 編號 PART 3).

研究成果: Conference contribution

Atomic Force Microscopy
Critical Dimension
Metrology
metrology
Atomic force microscopy

A neural network model in LaNixAl1-xO3 catalyst for methane reforming in SOFC

Ciou, S. J., Jhang, Y. W., Lai, Y. J., Fung, K-Z., Hung, M. H. & Chiang, K-W., 2007 十二月 1, ECS Transactions - 10th International Symposium on Solid Oxide Fuel Cells, SOFC-X. 1 PART 2 編輯 p. 1929-1937 9 p. (ECS Transactions; 卷 7, 編號 1 PART 2).

研究成果: Conference contribution

Reforming reactions
Solid oxide fuel cells (SOFC)
Methane
Neural networks
Catalysts

Anionic/electrostatic field effects in hot surface catalyzed combustions

Paramasawat, W., Chaosukhum, J., Meesrisom, A., Sriseubsai, W., Nagarajan, R., Egan, J., Jahngen, E., Euaphantasate, N., Kuo, C., Muangchareon, P., Tangarrayasap, P. & Bannister, W. W., 2007 一月 1, Western States Section/Combustion Institute Fall Meeting 2007. Western States Section/Combustion Institute, p. 376-388 13 p. (Western States Section/Combustion Institute Fall Meeting 2007; 卷 1).

研究成果: Conference contribution

hot surfaces
Anions
Negative ions
Electric fields
electric fields

Combinatorial methodologies applied to the advanced CMOS gate stack

Chang, K. S., Bassim, N. D., Schenck, P. K., Suehle, J., Takeuchi, I. & Green, M. L., 2007 十月 22, CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2007 International Conference on Frontiers of Characterization and Metrology. p. 297-302 6 p. (AIP Conference Proceedings; 卷 931).

研究成果: Conference contribution

CMOS
methodology
experimentation
metals
requirements
2 引文 (Scopus)

Effect of y2O3 addition on crystal structure and electrical conductivity of WO3 Doped Bi2O3 solid electrolyte

Hsieh, C. Y. & Fung, K-Z., 2007 十二月 1, ECS Transactions - 10th International Symposium on Solid Oxide Fuel Cells, SOFC-X. 1 PART 2 編輯 p. 2357-2362 6 p. (ECS Transactions; 卷 7, 編號 1 PART 2).

研究成果: Conference contribution

Fluorspar
Solid electrolytes
Crystal structure
Ionic conductivity
Heat treatment

High density patterns fabricated in low-viscosity thermal-curable epoxy system for thermal-nanoimprint lithography

Wu, C. C. & Hsu, S. L. C., 2007 十二月 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 312-313 2 p. 4456229. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

研究成果: Conference contribution

Nanoimprint lithography
Epoxy resins
Curing
Viscosity
Fluidity
4 引文 (Scopus)

Measurement uncertainty in nanometrology: Leveraging attributes of TEM and CD AFM

Liu, H-C., Dahlen, G. A., Osborn, M., Osborne, J. R., Mininni, L., Tracy, B. & Del Rosario, A., 2007, 2007 IEEE Instrumentation and Measurement Technology, IMTC 2007 - Conference Proceedings - Synergy of Science and Technology in Instrumentation and Measurement. 4258228

研究成果: Conference contribution

Atomic force microscopy
Transmission electron microscopy
Image reconstruction
Surface morphology
Uncertainty
3 引文 (Scopus)

Metal silicide nanowires

Chen, L. J., Wu, W. W., Hsu, H. C., Chen, S. Y., Chueh, Y. L., Chou, L. J., Lu, K. C. & Tu, K. N., 2007 十二月 1, ECS Transactions - Nanoscale One-Dimensional Electronic and Photonic Devices, NODEPD. 8 編輯 p. 3-6 4 p. (ECS Transactions; 卷 11, 編號 8).

研究成果: Conference contribution

Nanowires
Metals
Epitaxial growth
Point contacts
Nitrides
2 引文 (Scopus)

On strain-induced grain growth using modified Monte Carlo method and digital image correlation technique

Lin, W. G. & Kuo, J-C., 2007 十二月 1, Recrystallization and Grain Growth III - Proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX and GG III. PART 2 編輯 p. 1121-1126 6 p. (Materials Science Forum; 卷 558-559, 編號 PART 2).

研究成果: Conference contribution

Grain growth
Monte Carlo methods
Bicrystals
Compaction
Aluminum
1 引文 (Scopus)

Preparation and properties of a high temperature, flexible and colorless ITO coated polyimide substrate

Li, T. L. & Hsu, L-C., 2007 十二月 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 354-355 2 p. 4456250. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

研究成果: Conference contribution

Polyimides
Substrates
Temperature
Sputtering
Monomers

Preparation of highly concentrated and stable suspensions of silver nanoparticles by an organic base catalyzed reduction reaction

Wu, R. T. & Hsu, S. L. C., 2007 十二月 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 196-197 2 p. 4456171. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

研究成果: Conference contribution

Silver
Nanoparticles
Formaldehyde
Metal ions
Nitrates
1 引文 (Scopus)

Self-assembled Zn/ZnO dots on silicon by RF magnetron sputter

Liang, Y. H. & Liu, C. P., 2007 十二月 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 158-159 2 p. 4456152. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

研究成果: Conference contribution

Silicon
14 引文 (Scopus)

TEM validation of CD AFM image reconstruction

Dahlen, G. A., Mininni, L., Osborn, M., Liu, B. H., Osborne, J. R., Tracy, B. & Del Rosario, A., 2007 十月 15, Metrology, Inspection, and Process Control for Microlithography XXI. PART 1 編輯 651818. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 6518, 編號 PART 1).

研究成果: Conference contribution

Atomic Force Microscopy
Critical Dimension
Image Reconstruction
Transmission Electron Microscopy
image reconstruction

The electromigration investigation on the newly developed Pb-free Sn-Zn-Ag-Al-Ga solder ball interconnect

Lin, K. L. & Lin, G. P., 2007 十月 22, Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. p. 1467-1471 5 p. 4250075. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

Electromigration
Soldering alloys
Metallizing
Polychlorinated biphenyls
Ball grid arrays
2006

A hybrid nano-imprinting lithography based on infrared pulsed laser heating

Lee, Y. C., Chen, C. H. & Liu, C. P., 2006 十二月 1, Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS. p. 6-10 5 p. 4134891. (Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS).

研究成果: Conference contribution

Laser heating
Infrared lasers
Silicon
Pulsed lasers
Heating
1 引文 (Scopus)

Calibration of the image distortion induced error for a plane strain field measured using digital image correlation techniques

Tung, S. H., Kuo, J-C. & Shih, M. H., 2006 十二月 1, Proceedings of the 5th International Conference on Engineering Computational Technology. (Proceedings of the 5th International Conference on Engineering Computational Technology).

研究成果: Conference contribution

Calibration
Photogrammetry
Digital cameras
Tensors
Interpolation
16 引文 (Scopus)

Carbon nanotube AFM probes for microlithography process control

Liu, H. C., Fong, D., Dahlen, G. A., Osborn, M., Hand, S. & Osborne, J. R., 2006 七月 11, Metrology, Inspection, and Process Control for Microlithography XX. 61522Y. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 6152 II).

研究成果: Conference contribution

Microlithography
Carbon Nanotubes
Atomic Force Microscopy
Process Control
Nanotubes
1 引文 (Scopus)

Controllability of flatband voltage in high-k gate stack structures - Remarkable advantages of la2O3 over HfO2

Ohmori, K., Ahmet, P., Shiraishi, K., Yamabe, K., Watanabe, H., Akasaka, Y., Umezawa, N., Nakajima, K., Yoshitake, M., Nakayama, T., Chang, K. S., Kakushima, K., Nara, Y., Green, M. L., Iwai, H., Yamada, K. & Chikyow, T., 2006 一月 1, ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings. IEEE Computer Society, p. 376-379 4 p. 4098113. (ICSICT-2006: 2006 8th International Conference on Solid-State and Integrated Circuit Technology, Proceedings).

研究成果: Conference contribution

Controllability
Electric potential
Gases
Charge transfer
Annealing
25 引文 (Scopus)

Critical dimension AFM tip characterization and image reconstruction applied to the 45 nm node

Dahlen, G., Osborn, M., Liu, B. H., Jain, R., Foreman, W. & Osborne, J. R., 2006 七月 10, Metrology, Inspection, and Process Control for Microlithography XX. 61522R. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 6152 II).

研究成果: Conference contribution

Atomic Force Microscopy
Critical Dimension
Image Reconstruction
image reconstruction
Image reconstruction
1 引文 (Scopus)

Determination of residual resist layer thickness in e-beam lithography based on energy dispersive X-ray spectrometer

Lee, Y. C., Chiu, C. Y., Liu, C. P., Hsiao, F. B. & Chen, C. H., 2006 十二月 1, Progress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture. PART 1 編輯 p. 43-48 6 p. (Materials Science Forum; 卷 505-507, 編號 PART 1).

研究成果: Conference contribution

X ray spectrometers
Polymethyl Methacrylate
Lithography
lithography
spectrometers

Dopant profiling of metal-oxide semiconductor (MOS) structures with scanning electron microscopy

Hsiao, W. C., Liu, C. P., Yang, C. L., Sun, L. C. & Hung, T., 2006 七月 20, Interfaces in Electronic Materials - Proceedings of the International Symposium. p. 180-183 4 p. (Proceedings - Electrochemical Society; 卷 PV 2003-31).

研究成果: Conference contribution

Semiconductor doping
Doping (additives)
Scanning electron microscopy
Electric potential
Metals

Fabrication and characterization of Electrodeposited Aluminum Nanocrystalline

Chen, D., Wang, H. H. & Kuo, J-C., 2006 十一月 20, Joint Conference of the Asian Crystallographic Association and the Crystallographic Society of Japan. Epochal Tsukuba, Japan

研究成果: Conference contribution

Growth characteristics of electrochemically deposited Cu2O thin film onto Pt/SiO2/Si substrate by galvanostatic technique

Lee, Y. H., Leu, I. C. & Fung, K. Z., 2006 七月 20, Chemical Solution Deposition of Semiconducting and Non-Metallic Films - Proceedings of the International Symposium. p. 225-229 5 p. (Proceedings - Electrochemical Society; 卷 PV 2003-32).

研究成果: Conference contribution

Thin films
Substrates
Photoelectrons
Deposition rates
Spectrum analysis

Influences of annealing conditions on flatband voltage properties using continuously workfunction-tuned metal electrodes

Ohmori, K., Ahmet, P., Shiraishi, K., Watanabe, H., Akasaka, Y., Yamabe, K., Yoshitake, M., Chang, K-S., Green, M. L., Yamada, K. & Chikyow, T., 2006 十二月 1, 1st IEEE International Workshop on Nano CMOS, IEEE IWNC 2006. p. 160-162 3 p. 4570988. (2006 International Workshop on Nano CMOS - Proceedings, IWNC).

研究成果: Conference contribution

Annealing
Electrodes
Electric potential
Metals

Investigation on the work function of tungsten and thermal stability of W/SiO2/Si, W/SiON/Si and W/HfO2/Si gate stacks

Jiang, P. C., Chen, J. S., Cheng, K. H., Hu, T. J., Huang, K. B. & Lee, F. S., 2006 十二月 1, Gate Stack Scaling: Materials Selection, Role of Interfaces, and Reliability Implications. p. 167-173 7 p. (Materials Research Society Symposium Proceedings; 卷 917).

研究成果: Conference contribution

Tungsten
MOS capacitors
tungsten
Thermodynamic stability
thermal stability
1 引文 (Scopus)

Morphology of polythiophene films produced via surface polymerization by ion-assisted deposition: A combined experimental and computational study

Tepavcevic, S., Hsu, W-D., Sinnott, S. B. & Hanley, L., 2006, Conjugated Organic Materials: Synthesis, Structure, Device, and Applications. 卷 937. p. 31-36 6 p.

研究成果: Conference contribution

Polymerization
Ions
Polymers
Lamellar structures
Sublimation

On the Passive Role of Grain Boundaries in Deformation Processing

Kuo, J-C. & Chen, D., 2006 七月 17, 12th International Symposium Plasticity. Halifax, Nova Scotia, Canada

研究成果: Conference contribution

Preparation of perovskite conductive LaNiO3 films by sol-gel techniques

Lai, P. Y. & Chen, J-S., 2006 十二月 1, Science and Technology of Nonvolatile Memories. p. 31-36 6 p. (Materials Research Society Symposium Proceedings; 卷 933).

研究成果: Conference contribution

Conductive films
Perovskite
Sol-gels
Thin films
Annealing

The application of a digital image correlation method for crack observation

Shih, M. H., Tung, S. H., Kuo, J-C. & Sung, W. P., 2006 一月 1, Proceedings of the 8th International Conference on Computational Structures Technology, CST 2006. Civil-Comp Press, 卷 83.

研究成果: Conference contribution

Correlation methods
Cracks
Monitoring
Strain gages
Concrete construction
10 引文 (Scopus)

The electromigration and thermomigration behaviors of Pb-free flip chip Sn-3Ag-0.5Cu solder bumps

Lin, K. L. & Kuo, S. M., 2006 十二月 22, Proceedings - IEEE 56th Electronic Components and Technology Conference. p. 667-672 6 p. 1645722. (Proceedings - Electronic Components and Technology Conference; 卷 2006).

研究成果: Conference contribution

Electromigration
Soldering alloys
Thermal gradients
Cathodes
Heat losses

The magnetic anisotropy properties of Ga0.93Mn0.07As by low-temperature annealing

Lee, W., Chen, Y-F., Huang, J-L., Huang, B., Kuo, C., Chin, T. & Ku, H., 2006 十二月 1, INTERMAG 2006 - IEEE International Magnetics Conference. 1 p. 4261600. (INTERMAG 2006 - IEEE International Magnetics Conference).

研究成果: Conference contribution

3 引文 (Scopus)

The properties of Ti-doped ZnO films before and after annealing in the different atmosphere

Lin, S. S. & Huang, J-L., 2006 一月 1, Heat Treatment of Materials, AHTM ' 05 - Proceedings of the 3rd Asian Conference on Heat Treatment of Materials. Trans Tech Publications Ltd, p. 571-576 6 p. (Solid State Phenomena; 卷 118).

研究成果: Conference contribution

Annealing
atmospheres
annealing
direct current
electrical resistivity
2005
3 引文 (Scopus)

Amorphous diamond electron emission for thermal generation of electricity

Sung, J. C. M., Kan, K., Sung, M., Huang, J-L., Sung, E., Chen, C. P., Hsu, K. H. & Tai, M. F., 2005 十二月 1, 2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005 Technical Proceedings. Laudon, M. & Romanowicz, B. (編輯). p. 193-196 4 p. (2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005 Technical Proceedings).

研究成果: Conference contribution

Electron emission
Diamonds
Electricity
Vacuum
Electrons

Characteristics of W-Ni-Fe-(Cr) in metal injection molding

Hung, F-Y., Lui, T-S. & Chen, L. H., 2005 十二月 1, MPMD Sixth Global Innovations Proceedings - Trends in Materials and Manufacturing Technologies for Transportation Industries and Powder Metallurgy Res. and Development in the Transportation Industry. Bieler, T. R., Carsley, J. E., Fraser, H. L., Sears, J. W. & Smugeresky, J. E. (編輯). p. 321-331 11 p. (MPMD Sixth Global Innovations Proceedings - Trends in Materials and Manufacturing Technologies for Transportation Industries and Powder Metall. Research and Development in the Transportation Industry).

研究成果: Conference contribution

Metal molding
Injection molding
Tungsten
Powders
Particle size
1 引文 (Scopus)

Design and implementation of a non-contact X-Y table with high temperature superconductors

Chen, H. S., Wang, C. C., Lai, W. C., Tsai, M. H., Chen, I-G., Cheng, M-Y. & Tsai, M-C., 2005 十二月 1, Proceedings of the 2005 IEEE International Conference on Mechatronics, ICM '05. p. 959-963 5 p. 1529391. (Proceedings of the 2005 IEEE International Conference on Mechatronics, ICM '05; 卷 2005).

研究成果: Conference contribution

High temperature superconductors
Flux pinning
Stators
Permanent magnets
Superconducting materials

Effects of surface texturiimg on lubrication theory - Consideration of Electrodouble layer (EDL)

Li, W. L., 2005 十二月 1, Proceedings of the World Tribology Congress III - 2005. p. 317-318 2 p. (Proceedings of the World Tribology Congress III - 2005).

研究成果: Conference contribution

Bearings (structural)
Texturing
Lubrication
Hydrodynamics
Surface roughness

Fabrication of Bi2O3 thin film by thermal-enhanced electroplating

Huang, C. C., Wen, T. Y. & Fung, K-Z., 2005, Solid Oxide Fuel Cells IX, SOFC IX: Materials - Proceedings of the International Symposium. Singhal, S. C. & Mizusaki, J. (編輯). 卷 PV 2005-07. p. 1137-1141 5 p.

研究成果: Conference contribution

Electroplating
Fabrication
Crystal orientation
Thin films
Oxidation
5 引文 (Scopus)

Fabrication of the patterned flexible OLEDs using a combined roller imprinting and photolithography method

Kao, P. C., Chu, S-Y., Zhan, C. Y., Hsu, L-C. & Liao, W. C., 2005 十二月 1, 2005 5th IEEE Conference on Nanotechnology. p. 885-887 3 p. 1500860. (2005 5th IEEE Conference on Nanotechnology; 卷 2).

研究成果: Conference contribution

Photolithography
Lithography
Pixels
Fabrication
Wet etching
1 引文 (Scopus)

Modeling of heat transfer for laser-assisted direct nano imprint processing

Hsiao, F. B., Wang, D. B., Jen, C. P., Hsu, H. J., Chuang, C. H., Lee, Y-C. & Liu, C-P., 2005 十二月 1, 2005 IEEE International Conference on Robotics and Biomimetics, ROBIO. p. 747-751 5 p. 1708840. (2005 IEEE International Conference on Robotics and Biomimetics, ROBIO; 卷 2005).

研究成果: Conference contribution

Melting
Contact resistance
Heat transfer
Lasers
Processing

Modeling of laser assisted direct imprinting process based on pulsed laser heating and elastodynamic theory

Lee, Y-C., Chuang, C. H., Wang, D. B., Liu, C-P. & Hsiao, F. B., 2005 十二月 1, 2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005 Technical Proceedings. Laudon, M. & Romanowicz, B. (編輯). p. 680-683 4 p. (2005 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2005 Technical Proceedings).

研究成果: Conference contribution

Laser heating
Pulsed lasers
Lasers
Quartz
Materials properties

Strain Distribution Analysis Using Digital- Image-Correlation Techniques

Tung, S. H., Kuo, J-C. & Shih, M. H., 2005 十二月 19, The Eighteenth KKCNN Symposium on Civil Engineering-NTU 29. Kaohsiung, Taiwan

研究成果: Conference contribution

2004

Design and fabrication of multi-microelectrode array with SAMs surface modification for neural prosthesis

Chang, C. H., Chen, J-J. & Liao, J-D., 2004 十二月 1, Digest of Papers - Microprocesses and Nanotechnology 2004. p. 246-247 2 p. (Digest of Papers - Microprocesses and Nanotechnology 2004).

研究成果: Conference contribution

Neural prostheses
Microelectrodes
Surface treatment
Fabrication
Electrodes

Effect of the electrolyte composition on the electrochemical reactivation behavior of alloy 182 weld

Wu, T. F. & Tsai, W-T., 2004, EUROCORR 2004 - European Corrosion Conference: Long Term Prediction and Modelling of Corrosion.

研究成果: Conference contribution

Electrolytes
Welds
Corrosion
Chemical analysis
Grain boundaries

Self-assembled alternating nano-scaled layers

Wu, W. Y. & Ting, J. M., 2004 一月 1, 2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004. Nano Science and Technology Institute, p. 448-451 4 p. (2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004; 卷 3).

研究成果: Conference contribution

Sputter deposition
Sputtering
Diamonds
Microstructure
Carbon
2003

Exploration of magnetoelectric thin-film sensors using superlattice composition spreads

Chang, K. S., Aronova, M. A., Gao, C., Lin, C. L., Simpers, J. H., Murakami, M. & Takeuchi, I., 2003 一月 1, 2003 International Semiconductor Device Research Symposium, ISDRS 2003 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 1 p. 1272099. (2003 International Semiconductor Device Research Symposium, ISDRS 2003 - Proceedings).

研究成果: Conference contribution

Thin films
Sensors
Chemical analysis
Magnetization
Piezoelectric materials

Microstructure mechanics: Investigation on deformation behavior of grain boundaries

Kuo, J-C., Raabe, D., Zaefferer, S., Roters, F., Zhao, Z. & Winning, M., 2003 七月 7, 10th International Symposium Plasticity 03: Plasticity and its Current Applications. Quebec City, Canada

研究成果: Conference contribution

2002
10 引文 (Scopus)

Effects of gallium on wettability, microstructures and mechanical properties of the Sn-Zn-Ag-Ga and Sn-Zn-Ag-Al-Ga solder alloys

Chen, K. I. & Lin, K. L., 2002 一月 1, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 49-54 6 p. 1188812. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

研究成果: Conference contribution

Gallium
Soldering alloys
Wetting
Mechanical properties
Microstructure
16 引文 (Scopus)

Interfacial reaction between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge lead-free solders and metallic substrates

Chuang, C. M., Shi, P. C. & Lin, K-L., 2002 一月 1, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 360-365 6 p. 1188865. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

研究成果: Conference contribution

Surface chemistry
Soldering alloys
Intermetallics
Substrates
Lead-free solders
3 引文 (Scopus)

Microstructural features and vibration fracture behavior of Sn-Zn-Ag solder alloys

Song, J. M., Lan, G. F., Lui, T-S. & Chen, L. H., 2002 一月 1, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 276-281 6 p. 1188850. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

研究成果: Conference contribution

Soldering alloys
Fracture toughness
Damping
Fatigue of materials
Cracks