尖端材料國際碩士學位學程

研究成果

篩選
Conference contribution

On strain-induced grain growth using modified Monte Carlo method and digital image correlation technique

Lin, W. G. & Kuo, J-C., 2007 十二月 1, Recrystallization and Grain Growth III - Proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX and GG III. PART 2 編輯 p. 1121-1126 6 p. (Materials Science Forum; 卷 558-559, 編號 PART 2).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

On the Passive Role of Grain Boundaries in Deformation Processing

Kuo, J-C. & Chen, D., 2006 七月 17, 12th International Symposium Plasticity. Halifax, Nova Scotia, Canada

研究成果: Conference contribution

Optimization of micro-plasma parameters for wound healing

Hien, N. T. M., Linh, H. Q. & Liao, J-D., 2016 十二月 12, BME-HUST 2016 - 3rd International Conference on Biomedical Engineering. Institute of Electrical and Electronics Engineers Inc., p. 146-149 4 p. 7782095. (BME-HUST 2016 - 3rd International Conference on Biomedical Engineering).

研究成果: Conference contribution

Oxidation of metallic Mn thin films prepared in butyimethylpyrrolidinium bis(trifluoromethyisuifony)imide ionic liquid and the pseudo-capacitive performance of the anodized oxide electrodes

Chang, J. K., Huang, C. H., Tsai, W-T., Sun, I-W. & Chen, P. Y., 2008 十二月 22, ECS Transactions - Electrochemistry of Novel Electrode Materials for Energy Conversion and Storage. 25 編輯 p. 165-174 10 p. (ECS Transactions; 卷 6, 編號 25).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

Phase transformation of Cu@Ag core-shell nanoparticles upon heating

Tsai, C. H., Chen, S. Y., Song, J. M., Chen, I-G. & Lee, H. Y., 2012 十二月 1, 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012. 6523432. (2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012).

研究成果: Conference contribution

Phase transformation of metallic nanoparticle deposits for the electrodes of flexible electronics

Kao, T. H., Song, J. M., Wang, J. Y. & Chen, I-G., 2010 十二月 1, 2010 IEEE CPMT Symposium Japan, ICSJ10. 5680473. (2010 IEEE CPMT Symposium Japan, ICSJ10).

研究成果: Conference contribution

Physical method to shape a nano-structured Au substrate for surface enhanced Raman scattering

Lin, Y. Y., Chu, Y. H. & Liao, J. D., 2010 十二月 14, XXII International Conference on Raman Spectroscopy, ICORS 2010. p. 923-924 2 p. (AIP Conference Proceedings; 卷 1267).

研究成果: Conference contribution

Preparation and characterization of cubic and rod-shapedindium tin oxide powdersusing thehydrothermal process

Hsu, K. C., Liao, J. D., Xie, Z. Z. & Fu, Y. S., 2014 一月 1, Applied Science and Precision Engineering Innovation. p. 64-68 5 p. (Applied Mechanics and Materials; 卷 479-480).

研究成果: Conference contribution

Preparation and characterization of cubic and rod-shaped indium tin oxide powders using the hydrothermal process

Hsu, K. C., Liao, J-D., Xie, Z. Z. & Fu, Y. S., 2013 三月 19, Information, Communication and Engineering. p. 430-434 5 p. (Applied Mechanics and Materials; 卷 311).

研究成果: Conference contribution

Preparation and hydrogen storage performance of Pd nanoparticles decorated carbon nanotubes

Chang, J. K., Chen, C. Y. & Tsai, W-T., 2009 十二月 1, Hydrogen Production, Transport, and Storage 3. 10 編輯 p. 33-40 8 p. (ECS Transactions; 卷 19, 編號 10).

研究成果: Conference contribution

Preparation and properties of a high temperature, flexible and colorless ITO coated polyimide substrate

Li, T. L. & Hsu, S. L. C., 2007 十二月 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 354-355 2 p. 4456250. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Preparation of highly concentrated and stable suspensions of silver nanoparticles by an organic base catalyzed reduction reaction

Wu, R. T. & Hsu, S. L. C., 2007 十二月 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 196-197 2 p. 4456171. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

研究成果: Conference contribution

Preparation of perovskite conductive LaNiO3 films by sol-gel techniques

Lai, P. Y. & Chen, J-S., 2006 十二月 1, Science and Technology of Nonvolatile Memories. p. 31-36 6 p. (Materials Research Society Symposium Proceedings; 卷 933).

研究成果: Conference contribution

Rapid SNP Genotyping of TMIGD1 Gene in Tsaiya Duck Using Lateral-flow Immunoassay with Primer Extension and Nano-gold

Lin, C. W., Kuo, J-C. & Huang, H. L., 2016 七月 25, 10th Asia-Pacific Biotech Congress. Bangkok, Thailand

研究成果: Conference contribution

Recent CD AFM probe developments for sub-45 nm technology nodes

Liu, B. H., Osborne, J. R., Dahlen, G. A., Greschner, J., Bayer, T., Kalt, S. & Fritz, G., 2008 十二月 1, Metrology, Inspection, and Process Control for Microlithography XXII. 69222J. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 6922).

研究成果: Conference contribution

10 引文 斯高帕斯(Scopus)

Recrystallization of Ag and Ag-La alloy wire in wire bonding process

Hsueh, H. W., Hung, F-Y. & Lui, T-S., 2013 十月 29, Materials and Measurement. p. 151-157 7 p. (Advanced Materials Research; 卷 804).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Removed organic solderability preservative (OSPs) by Ar/O2 microwave plasma to improve solder joint in thermal compression flip chip bonding

Peng, J. W., Chen, Y. S., Chen, Y., Liang, J. L., Lin, K. L. & Lee, Y. L., 2014 九月 11, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 1584-1589 6 p. 689750. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

Room-temperature diamond seeding and microwave plasma enhanced CVD growth of nanodiamond with a tungsten interfacial layer

Chu, Y. C., Jiang, G., Chang, C., Ting, J. M., Lee, H. L. & Tzeng, Y., 2011 十二月 1, 2011 11th IEEE International Conference on Nanotechnology, NANO 2011. p. 1367-1370 4 p. 6144477. (Proceedings of the IEEE Conference on Nanotechnology).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Self-assembled alternating nano-scaled layers

Wu, W. Y. & Ting, J. M., 2004 一月 1, 2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004. Nano Science and Technology Institute, p. 448-451 4 p. (2004 NSTI Nanotechnology Conference and Trade Show - NSTI Nanotech 2004; 卷 3).

研究成果: Conference contribution

Self-assembled Zn/ZnO dots on silicon by RF magnetron sputter

Liang, Y. H. & Liu, C. P., 2007 十二月 1, Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC. p. 158-159 2 p. 4456152. (Digest of Papers - Microprocesses and Nanotechnology 2007; 20th International Microprocesses and Nanotechnology Conference, MNC).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Spark plasma sintering of PbTe thermoelectric bulk materials with small grains

Kuo, C. H., Hwang, C-S., Ku, J. R., Jeng, M. S. & Tsau, F. H., 2008 八月 20, 2008 Proceedings of the ASME Micro/Nanoscale Heat Transfer International Conference, MNHT 2008. p. 1191-1193 3 p. (2008 Proceedings of the ASME Micro/Nanoscale Heat Transfer International Conference, MNHT 2008; 卷 PART B).

研究成果: Conference contribution

Squeeze film characteristics of circular contacts at constant squeeze velocity motion with non-newtonian lubricants

Chu, L. M., Li, W. L. & Hsu, H. C., 2011 七月 4, Advanced Research on Mechanical Engineering, Industry and Manufacturing Engineering. p. 147-151 5 p. (Applied Mechanics and Materials; 卷 63-64).

研究成果: Conference contribution

Stability of Bi2O3-based ionic conductor and its application on composite cathode

Tsai, S. Y., Fung, K. Z., Ni, C. T. & Chang, Y. F., 2015 一月 1, Solid Oxide Fuel Cells 14, SOFC 2015. Singhal, S. C. & Eguchi, K. (編輯). 1 編輯 Electrochemical Society Inc., p. 867-874 8 p. (ECS Transactions; 卷 68, 編號 1).

研究成果: Conference contribution

5 引文 斯高帕斯(Scopus)

Stable Pt/Ge/Au ohmic contact to n-GaAs with a Ta-Si-N barrier

Chen, J. S., Kolawa, E., Ruiz, R. P. & Nicolet, M. A., 1993 十二月 1, III-V Electronic and Photonic Device Fabrication and Performance. Jones, K. S., Pearton, S. J. & Kanber, H. (編輯). Publ by Materials Research Society, p. 255-260 6 p. (Materials Research Society Symposium Proceedings; 卷 300).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Static analysis of spiral-grooved gas film face seal in microsystem

Nguyen, C. C., Jao, H. C. & Li, W. L., 2015 一月 1, 2015 IFToMM World Congress Proceedings, IFToMM 2015. National Taiwan University, (2015 IFToMM World Congress Proceedings, IFToMM 2015).

研究成果: Conference contribution

Statistical analysis on bonding strength and failure mechanism of plasma-sprayed HA coating with reinforced intermediate layers

Yang, C. W. & Lui, T. S., 2008 一月 1, Multi-functional Materials and Structures - International Conference on Multifunctional Materials and Structures. Trans Tech Publications, p. 1007-1010 4 p. (Advanced Materials Research; 卷 47-50 PART 2).

研究成果: Conference contribution

Strain Distribution Analysis Using Digital- Image-Correlation Techniques

Tung, S. H., Kuo, J-C. & Shih, M. H., 2005 十二月 19, The Eighteenth KKCNN Symposium on Civil Engineering-NTU 29. Kaohsiung, Taiwan

研究成果: Conference contribution

Structures and opto-electrical characteristics of ZITO thin films

Hung, F. Y., Chen, K. J., Chang, S. J., Young, S. J. & Hu, Z. S., 2009 十二月 1, 2009 International Semiconductor Device Research Symposium, ISDRS '09. 5378181. (2009 International Semiconductor Device Research Symposium, ISDRS '09).

研究成果: Conference contribution

Study of AZO thin films under different annealing atmosphere on structural, optical and electrical properties by RF magnetron sputtering

Lin, Y. M., Chu, C. H., Wu, H. W. & Huang, J-L., 2015 一月 1, IMECS 2015 - International MultiConference of Engineers and Computer Scientists 2015. Feng, D. D., Ao, S. I., Douglas, C., Ao, S. I., Douglas, C., Lee, J-A., Ao, S. I. & Castillo, O. (編輯). Newswood Limited, p. 807-810 4 p. (Lecture Notes in Engineering and Computer Science; 卷 2).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Synthesis of GaN nanowires using gold nanoparticles on plasma-activated silicon substrate

Lee, K. H., Lo, P. L. & Chen, I. G., 2009 十二月 1, Nanoscale One-Dimensional Electronic and Photonic Devices 3, NODEPD 3. 10 編輯 p. 79-82 4 p. (ECS Transactions; 卷 25, 編號 10).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

TEM validation of CD AFM image reconstruction: Part II

Dahlen, G. A., Liu, H. C., Osborn, M., Osborne, J. R., Tracy, B. & Del Rosario, A., 2008 十二月 1, Metrology, Inspection, and Process Control for Microlithography XXII. 69220K. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 6922).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

TEM validation of CD AFM image reconstruction

Dahlen, G. A., Mininni, L., Osborn, M., Liu, B. H., Osborne, J. R., Tracy, B. & Del Rosario, A., 2007 十月 15, Metrology, Inspection, and Process Control for Microlithography XXI. PART 1 編輯 651818. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 6518, 編號 PART 1).

研究成果: Conference contribution

14 引文 斯高帕斯(Scopus)

Tensile mechanical properties and brittle effect of austempered Cr-Mo alloy steel

Chen, C. Y., Hung, F-Y., Lui, T-S. & Chen, L. H., 2013 四月 26, 4th International Symposium on High-Temperature Metallurgical Processing - Held During the TMS 2013 Annual Meeting and Exhibition. p. 299-306 8 p. (TMS Annual Meeting).

研究成果: Conference contribution

Tensile mechanical properties and the ductile-to-brittle transition behavior of Mg-Li-Ai-Zn alloy

Yang, C. W., Lui, T-S. & Chen, L. H., 2010 五月 21, Magnesium Technology 2010 - Held During TMS 2010 Annual Meeting and Exhibition. p. 455-459 5 p. (Magnesium Technology).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Tensile properties of a friction stir processed Al-Cu 2218 alloy at elevated temperatures and related microstructural characteristics

Chen, S. T., Lui, T-S. & Chen, L. H., 2010 五月 21, TMS 2010 - 139th Annual Meeting and Exhibition - Supplemental Proceedings. p. 129-138 10 p. (TMS Annual Meeting; 卷 1).

研究成果: Conference contribution

Texture simulation of cold-rolled F.C.C. metals by using taylor model

Hsiao, S. C. & Kuo, J-C., 2018 八月 27, 30th International Conference on Materials Chemistry & Science. Toronto, Canada

研究成果: Conference contribution

The application of a digital image correlation method for crack observation

Shih, M. H., Tung, S. H., Kuo, J-C. & Sung, W. P., 2006 一月 1, Proceedings of the 8th International Conference on Computational Structures Technology, CST 2006. Civil-Comp Press, 卷 83.

研究成果: Conference contribution

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Yang, P. F., Huang, L., Hung, C. P., Uegaki, S. & Lin, K-L., 2016 六月 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 497-501 5 p. 7486877. (2016 International Conference on Electronics Packaging, ICEP 2016).

研究成果: Conference contribution

7 引文 斯高帕斯(Scopus)

The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Chen, Y. F., Yang, P. F., Huang, L. & Lin, K-L., 2014 九月 11, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 419-424 6 p. 6897319. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

5 引文 斯高帕斯(Scopus)

The crystallization characteristics and photoluminescence properties of ZnO/Ag nanoflower arrays

Hu, Z. S., Hung, F. Y., Chang, S. J. & Chen, K. J., 2012 十一月 19, Technical Digest - 25th International Vacuum Nanoelectronics Conference, IVNC 2012Om. p. 176-180 5 p. 6316893. (Technical Digest - 25th International Vacuum Nanoelectronics Conference, IVNC 2012).

研究成果: Conference contribution

The effects of annealing and Si content on the charge-discharge characteristics of Al-Si thin film with pre-deposited Al layer

Wu, C. H., Hung, F-Y., Lui, T-S. & Chen, L. H., 2011 七月 26, TMS 2011 - 140th Annual Meeting and Exhibition, Supplemental Proceedings. p. 127-134 8 p. (TMS Annual Meeting; 卷 1).

研究成果: Conference contribution

The electromigration and thermomigration behaviors of Pb-free flip chip Sn-3Ag-0.5Cu solder bumps

Lin, K. L. & Kuo, S. M., 2006 十二月 22, Proceedings - IEEE 56th Electronic Components and Technology Conference. p. 667-672 6 p. 1645722. (Proceedings - Electronic Components and Technology Conference; 卷 2006).

研究成果: Conference contribution

10 引文 斯高帕斯(Scopus)

The electromigration investigation on the newly developed Pb-free Sn-Zn-Ag-Al-Ga solder ball interconnect

Lin, K. L. & Lin, G. P., 2007 十月 22, Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07. p. 1467-1471 5 p. 4250075. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

Lin, T. C., Kung, H. Y., Lee, S. H., Chen, M. H., Chiu, Y. T. & Lin, K. L., 2018 六月 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 226-229 4 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

The growth and segregation of intermetallic compounds in the bulk of flip chip Sn2.4Ag solder joint under electrical current stressing

Wang, W. C., Lin, K-L., Chiu, Y. T. & Lai, Y. S., 2013 九月 9, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. p. 1600-1605 6 p. 6575785. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

The IMC formation and progress in the copper pillar Cu/Sn1.8Ag /OSP-Cu microbump structure upon current stressing

Chen, C. W., Lin, K-L., Chiu, Y. T., Kao, C. L., Lee, C. W. & Yang, P. F., 2014 一月 30, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., p. 518-521 4 p. 7028325. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

研究成果: Conference contribution

The Influence of Grain Boundary and Triple Junction on Plastic Deformation

Liao, Y. Y. & Kuo, J-C., 2008 一月 3, 14th International Symposium Plasticity. Hawaii, USA.

研究成果: Conference contribution

The interfacial interaction of Ti/Ni/Ag/Au multilayer under thermal cycling test

Yeh, F. J., Chiu, T. C. & Lin, K-L., 2012, 14th International Conference on Electronic Materials and Packaging, EMAP 2012. 6507860

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

The introduction of MEMS packaging technology

Hsieh, C. T., Ting, J-M., Yang, C. & Chung, C-K., 2002 一月 1, Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc., p. 300-306 7 p. 1188855. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

The investigations of InAs quantum dots overgrown on in 0.1Ga0.9As surfactant layer and 10° off-angle (100) GaAs substrate

Tang, S. F., Hsu, M. Y., Chiang, C. D., Su, C. C., Liu, C. P. & Fang, Y. C., 2008 三月 31, Device and Process Technologies for Microelectronics, MEMS, Photonics, and Nanotechnology IV. 68001E. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 6800).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)