尖端材料國際碩士學位學程

研究成果

篩選
Editorial
2015

Macroscopic/Mesoscopic Computational Materials Science Modeling and Engineering

Lu, J. M., Ting, J. M., Li, M. & Kogan, E., 2015 一月 1, 於 : Mathematical Problems in Engineering. 2015, 319626.

研究成果: Editorial

2014

Corrosion prevention and environment protection of materials for a new era

Huang, H. H., Yeh, T. K., Kuo, J-C., Wang, C. J. & Tsai, W-T., 2014 一月 1, 於 : Corrosion Engineering Science and Technology. 49, 2, 1 p.

研究成果: Editorial

1 引文 斯高帕斯(Scopus)

Preface: The biennial TACT international thin films conference (TACT 2013)

Lee, J. W., He, J. L., Chang, K. S., Chang, Y. Y., Greczyński, G., Huang, H. H., Kuo, Y. L., Shih, S. J., Wang, C. H. & Wu, F. B., 2014 一月 1, 於 : Surface and Coatings Technology. 259, PB, p. 113-114 2 p.

研究成果: Editorial

2013

Preface (TACT 2011 Special Issue)

Huang, J. L., Ting, J. M., Hsieh, J. H., Feng, Z. C., Chu, J. P., Park, H. H., Liu, C. P. & Kusano, E., 2013 二月 1, 於 : Thin Solid Films. 529, 1 p.

研究成果: Editorial

The Biennial Taiwan Association for Coating and Thin Film Technology (TACT)

Ting, J. M., Huang, J. L., Lu, F. H., Lee, J. W., Wong, M. S., Park, H. H., Veprek, S., Okamoto, K., Huang, J. H. & Yamamoto, K., 2013 九月 25, 於 : Surface and Coatings Technology. 231, 1 p.

研究成果: Editorial

2010

Foreword: Pb-free solders and emerging interconnect and packaging technologies

Lin, K-L., Kang, S. K., Duh, J. G., Lee, A., Bieler, T., Turbini, L., Sidhu, R., Guo, F. & Anderson, I., 2010 十二月 1, 於 : Journal of Electronic Materials. 39, 12, 1 p.

研究成果: Editorial

3 引文 斯高帕斯(Scopus)
2008

Cluster issue on microplasmas

Chao, C. C., Liao, J. D. & Chang, J. E., 2008 十月 7, 於 : Journal of Physics D: Applied Physics. 41, 19, 190301.

研究成果: Editorial

2 引文 斯高帕斯(Scopus)
2006

Journal of Electronic Materials: Foreword

Chawla, N., Chada, S., Kang, S. K., Kao, C. R., Lin, K-L., Lucas, J. & Turbini, L., 2006 十二月 1, 於 : Journal of Electronic Materials. 35, 12, 1 p.

研究成果: Editorial

2 引文 斯高帕斯(Scopus)