每年研究成果
每年研究成果
搜尋結果
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Experimental investigation of emissivity of aluminum alloys and application of multispectral radiation thermometry
Wen, C. D., 2010 12月 1, 2010 14th International Heat Transfer Conference, IHTC 14. p. 867-875 9 p. (2010 14th International Heat Transfer Conference, IHTC 14; 卷 5).研究成果: Conference contribution
3 引文 斯高帕斯（Scopus） -
Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing
Yang, T. S., Chen, G. D., Chen, K. S., Hong, R. C., Chiu, T. C., Wen, C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2015, Micro- and Nano-Systems Engineering and Packaging. American Society of Mechanical Engineers (ASME), (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); 卷 10-2015).研究成果: Conference contribution
4 引文 斯高帕斯（Scopus） -
Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications
Chen, K. S., Yang, T. S., Hong, R. C., Chiu, T. C., Wen, A. C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2016 7月 15, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Mita, Y., Rencz, M., Charlot, B., Schneider, P., Tas, N., Nouet, P. & Pressecq, F. (編輯). Institute of Electrical and Electronics Engineers Inc., 7514879. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016).研究成果: Conference contribution
1 引文 斯高帕斯（Scopus）