每年專案
個人檔案
學歷
- 國立台灣大學 土木工程學系博士
研究專長
- 人工智慧
- 多尺度模擬
- 破壞力學
- 材料設計
- 計算力學
與 UN SDG 相關的專業知識
聯合國會員國於 2015 年同意 17 項全球永續發展目標 (SDG)，以終結貧困、保護地球並確保全體的興盛繁榮。此人的作品有助於以下永續發展目標：
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SDG 3 良好的健康和福祉 -
SDG 5 性別平等 -
SDG 7 經濟實惠的清潔能源 -
SDG 9 產業、創新與基礎設施 -
SDG 13 氣候行動 -
SDG 14 水下生命
指紋
查看啟用 Chi-Hua Yu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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過去五年中的合作和熱門研究領域
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2026 Taiwan society of lipids and atherosclerosis consensus statement for the identification and management of patients receiving suboptimally tolerable statins
Wu, Y. J., Yeh, C. F., Hsu, C. Y., Lin, C. F., Huang, C. C., Tang, S. C., Huang, Y. C., Lin, C. Y., Yu, C.-H., Huang, C. Y., Wang, C. Y., Huang, P. H., Yeh, H. I., Li, Y. H. & Liu, P. Y., 2026, (Accepted/In press) 於: Journal of the Formosan Medical Association.研究成果: Article › 同行評審
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Artificial intelligence application in the prediction of spontaneous preterm birth by cervical length in the first trimester of pregnancy: Comparison of three measurement methods
Tai, Y. Y., Tseng, B. Y., Yang, Z. H., Yu, C. H. & Poon, L. C., 2026, (Accepted/In press) 於: International Journal of Gynecology and Obstetrics.研究成果: Article › 同行評審
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Design and Evaluation of Microchannel Cooling Modules for 2.5D Multi-Hotspot High-Power Packages
Lo, Y. H., Mizuno, J., Chang, H. H., Wu, Y.-T., Friyadi, M. F., Yu, C.-H., Miyamoto, T., Wu, W. C., Huang, H. H., Wang, C. C. & Hung, C. P., 2026, 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026. Institute of Electrical and Electronics Engineers Inc., p. 223-224 2 p. (2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026).研究成果: Conference contribution
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Polyaniline Derivatives Decorated With Atomic-Scale Gold Toward Electrochemical Non-Enzymatic Glucose Sensing
Okamoto, K., Kurioka, T., Yu, C. H., Hsu, Y. J., Chang, T. F. M. & Sone, M., 2026 10月, 於: Electrochemical Science Advances. 6, 5, e70040.研究成果: Article › 同行評審
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AI-Driven Microfluidic Engineering for Advanced Thermal Control in Power-Dense Electronics
Friyadi, M. F., Yu, C. H., Huang, H. H., Wu, W. C., Wang, C. C. & Hun, C. P., 2025, Proceedings - 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Energy-Efficient AI: From Cloud to Edge, IMPACT 2025. IEEE Computer Society, p. 274-277 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).研究成果: Conference contribution