每年研究成果
指紋 查看啟用 Chien-Lung Liang 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 1 類似的檔案
Electromigration
Chemical Compounds
Intermetallics
Chemical Compounds
solders
Physics & Astronomy
Soldering alloys
Chemical Compounds
intermetallics
Physics & Astronomy
electromigration
Physics & Astronomy
electric current
Physics & Astronomy
Metals
Chemical Compounds
網絡
國家層面的近期外部合作。點選圓點深入探索詳細資料。
研究成果 2015 2020
Electro-work hardening of metals induced by the athermal electromigration effect
Shu, C. C., Liang, C. L. & Lin, K. L., 2020 一月 20, 於 : Materials Science and Engineering A. 772, 138689.研究成果: Article
work hardening
Electromigration
electromigration
Strain hardening
Metals
1
引文
(Scopus)
Athermal recrystallization behavior of (Sn) solid-solution at an intermetallic-free Cu/Sn interface induced by room temperature electromigration
Liang, C. L. & Lin, K. L., 2019 二月 1, 於 : Materials Letters. 236, p. 607-610 4 p.研究成果: Article
Electromigration
electromigration
Intermetallics
intermetallics
Solid solutions
Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders
Lin, J. C., Liang, C. L. & Lin, K. L., 2019 九月 23, 於 : Materials Science and Engineering A. 765, 138323.研究成果: Article
solders
mechanical properties
Soldering alloys
Mechanical properties
Microhardness
1
引文
(Scopus)
Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration
Liang, C. L. & Lin, K. L., 2019 六月 15, 於 : Journal of Alloys and Compounds. 789, p. 336-344 9 p.研究成果: Article
Electromigration
Supersaturation
Cathodes
Temperature
Electrodes
2
引文
(Scopus)
The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders
Guo, W. T., Liang, C. L. & Lin, K. L., 2019 三月 18, 於 : Materials Science and Engineering A. 750, p. 117-124 8 p.研究成果: Article
solders
Alloying
alloying
mechanical properties
Mechanical properties