每年研究成果
每年研究成果
指紋
查看啟用 Chien-Lung Liang 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 3 類似的個人檔案
網路
國家層面的近期外部共同作業。通過按一下圓點深入探索詳細資料。
研究成果
-
A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property
Liao, Y. H., Chen, C. H., Liang, C. L., Lin, K. L. & Wu, A. T., 2020 十一月, 於: Acta Materialia. 200, p. 200-210 11 p.研究成果: Article › 同行評審
-
Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density
Liang, C. L., Lin, Y. S., Kao, C. L., Tarng, D., Wang, S. B., Hung, Y. C., Lin, G. T. & Lin, K. L., 2020 十二月 1, 於: Materials Chemistry and Physics. 256, 123680.研究成果: Article › 同行評審
-
Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging
Liang, C. L., Lin, Y. S., Kao, C. L., Tarng, D., Wang, S. B., Hung, Y. C. & Lin, K. L., 2020 六月, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 361-366 6 p. 9159312. (Proceedings - Electronic Components and Technology Conference; 卷 2020-June).研究成果: Conference contribution
-
Electromigration Reliability of Advanced High-Density Fan-Out Packaging with Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines
Liang, C. L., Lin, Y. S., Kao, C. L., Tarng, D., Wang, S. B., Hung, Y. C., Lin, G. T. & Lin, K. L., 2020 九月, 於: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 9, p. 1438-1445 8 p., 9099960.研究成果: Article › 同行評審
-
Electro-work hardening of metals induced by the athermal electromigration effect
Shu, C. C., Liang, C. L. & Lin, K. L., 2020 一月 20, 於: Materials Science and Engineering A. 772, 138689.研究成果: Article › 同行評審
2 引文 斯高帕斯（Scopus）