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查看斯高帕斯 (Scopus) 概要
洪 飛義
教授
材料科學及工程學系
尖端材料國際碩士學位學程
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886 6 2757575 ext 62950
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fyhung
mail.ncku.edu
tw
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https://sites.google.com/gs.ncku.edu.tw/netlab
h-index
2350
引文
22
h-指數
按照存儲在普爾(Pure)的出版物數量及斯高帕斯(Scopus)引文計算。
2001
2023
每年研究成果
概覽
指紋
網路
專案
(27)
研究成果
(215)
類似的個人檔案
(6)
監製作品
(41)
如果您對這些純文本內容做了任何改變,很快就會看到。
指紋
查看啟用 Fei-Yi Hung 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Engineering & Materials Science
Microstructure
95%
Thin films
68%
Crystallization
59%
Wire
58%
Heat treatment
50%
Mechanical properties
45%
Electric properties
44%
Tensile properties
41%
Annealing
38%
Intermetallics
36%
Temperature
35%
Erosion
34%
Optical properties
33%
Powders
33%
Nanowires
33%
Soldering alloys
32%
Aluminum alloys
31%
Copper
28%
Friction
24%
Tensile strength
23%
Aging of materials
23%
Silver
22%
Substrates
22%
Solid solutions
21%
Anodes
21%
Magnesium
20%
Lead-free solders
19%
Ions
19%
Selective laser melting
19%
Sputtering
19%
Sol-gel process
18%
Hardness
18%
Hot Temperature
18%
Embrittlement
17%
Photoluminescence
17%
Gold
17%
Coatings
17%
Glass
17%
Eutectics
16%
Phase transitions
14%
Fracture toughness
14%
Zinc oxide
14%
Atoms
14%
Doping (additives)
13%
Silver oxides
12%
Shielding
12%
Microelectronics
12%
Signal interference
12%
Chemical Compounds
Microstructure
100%
Alloy
91%
Resistance
58%
Heat Treatment
53%
Liquid Film
45%
Electrical Property
41%
Aluminium Alloy
40%
Ductility
38%
Solder
37%
Tensile Strength
34%
Annealing
33%
Crystallization
33%
Intermetallic Compound
30%
Embrittlement
27%
Strength
27%
Austempering
22%
Optical Property
19%
Solid Solution
18%
Erosion (Wear)
17%
Melting
16%
Anode
16%
Eutectics
16%
Surface
16%
Grain Size
16%
Nanowire
15%
Heat
15%
Electrical Resistance
14%
Microelectronics
13%
Magnesium Alloy
13%
Diffusion
13%
Grain Boundary
12%
Glass Substrate
11%
Corrosion
11%
Corrosion Resistance
11%
Magnesium Atom
10%
Sol Gel Process
10%
Forging
10%
Plate Like Crystal
10%
Purity
10%
Ambient Reaction Temperature
10%
Wear
10%
Solar Cell
10%
Grain Growth
9%
Film Material
9%
Thermal Diffusion
9%
Etching
8%
Oxide
8%
Physics & Astronomy
microstructure
49%
wire
41%
crystallization
31%
tensile properties
30%
thin films
30%
solders
24%
mechanical properties
23%
erosion
22%
electrical properties
22%
friction
21%
anodes
18%
copper
17%
annealing
16%
heat treatment
16%
silver
15%
flames
14%
aluminum alloys
13%
intermetallics
12%
embrittlement
11%
ribbons
11%
gels
11%
optical properties
11%
tensile strength
11%
gold
10%
matrices
10%
electric batteries
10%
silver alloys
9%
microelectronics
9%
sensors
9%
indium
8%
coatings
8%
ions
8%
glass
8%
cycles
8%
nanowires
8%
hardness
8%
electromagnetic interference
8%
heat
8%
balls
8%
electrical resistivity
8%
chlorination
8%
iron
8%
ductility
7%
zinc oxides
7%
wear resistance
7%
eutectics
7%
carbides
6%
process heat
6%
casts
6%
shear properties
6%