Hwa-Teng Lee

2006

Microstructure and corrosion behaviour of alloy 690-SUS 304L butt joints formed by electron beam welding

Lee, H. T. & Lin, Y. D., 2006 11月, 於: Science and Technology of Welding and Joining. 11, 6, p. 650-656 7 p.

研究成果: Article › 同行評審

14 引文斯高帕斯（Scopus）

2005

Effects of in situ nickel particle addition on the microstructure and microhardness of Sn-Ag solder

Lee, H. T. & Lee, Y. H., 2005 6月, 於: Science and Technology of Welding and Joining. 10, 3, p. 353-360 8 p.

研究成果: Article › 同行評審

14 引文斯高帕斯（Scopus）

Effects of Nb on the microstructure and corrosive property in the Alloy 690-SUS 304L weldment

Jeng, S. L., Lee, H. T., Rehbach, W. P., Kuo, T. Y., Weirich, T. E. & Mayer, J. P., 2005 4月 25, 於: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 397, 1-2, p. 229-238 10 p.

研究成果: Article › 同行評審

47 引文斯高帕斯（Scopus）

Reliability of Sn-Ag-Sb lead-free solder joints

Lee, H. T., Lin, H. S., Lee, C. S. & Chen, P. W., 2005 10月 25, 於: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 407, 1-2, p. 36-44 9 p.

研究成果: Article › 同行評審

101 引文斯高帕斯（Scopus）

The relationship between of fracture behaviors and thermomechanical effects of alloy AA2024 of T3 and T81 temper designations using the center crack tensile test

Kuo, T. Y., Lin, H. S. & Lee, H. T., 2005 3月 15, 於: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 394, 1-2, p. 28-35 8 p.

研究成果: Article › 同行評審

5 引文斯高帕斯（Scopus）

2004

Dissimilar welding of nickel-based Alloy 690 to SUS 304L with Ti addition

Lee, H. T., Jeng, S. L., Yen, C. H. & Kuo, T. Y., 2004 10月 1, 於: Journal of Nuclear Materials. 335, 1, p. 59-69 11 p.

研究成果: Article › 同行評審

88 引文斯高帕斯（Scopus）

Effect of adding Sb on microstructure and adhesive strength of Sn-Ag solder joints

Lee, H. T., Chen, M. H., Jao, H. M. & Hsu, C. J., 2004 9月, 於: Journal of Electronic Materials. 33, 9, p. 1048-1054 7 p.

研究成果: Article › 同行評審

52 引文斯高帕斯（Scopus）

Influence of copper addition on adhesive strength of Sn-3Ag-1·5Sb solder joints

Lee, H. T., Chen, M. H. & Jao, H. M., 2004 12月, 於: Science and Technology of Welding and Joining. 9, 6, p. 555-559 5 p.

研究成果: Article › 同行評審

3 引文斯高帕斯（Scopus）

Relationship between electrode size and surface cracking in the EDM machining process

Lee, H. T., Rehbach, W. P., Tai, T. Y. & Hsu, F. C., 2004 12月 1, 於: Journal of Materials Science. 39, 23, p. 6981-6986 6 p.

研究成果: Article › 同行評審

26 引文斯高帕斯（Scopus）

Stress singularities near the apex of a cylindrically polarized piezoelectric wedge

Chen, T. H., Chue, C. H. & Lee, H. T., 2004 12月 1, 於: Archive of Applied Mechanics. 74, 3-4, p. 248-261 14 p.

研究成果: Article › 同行評審

8 引文斯高帕斯（Scopus）

Study of surface integrity using the small area EDM process with a copper-tungsten electrode

Lee, H. T., Hsu, F. C. & Tai, T. Y., 2004 1月 15, 於: Materials Science and Engineering: A. 364, 1-2, p. 346-356 11 p.

研究成果: Article › 同行評審

123 引文斯高帕斯（Scopus）

The study of EDM hole-drilling method for measuring residual stress in SKD11 tool steel

Lee, H. T., Rehbach, W. P., Hsu, F. C., Tai, T. Y. & Hsu, E., 2004 6月 10, 於: Journal of Materials Processing Technology. 149, 1-3, p. 88-93 6 p.

研究成果: Article › 同行評審

41 引文斯高帕斯（Scopus）

2003

Effect of stiffness and thickness ratios on popcorn cracking in IC packages

Chue, C. H., Chen, T. H. & Lee, H. T., 2003 6月, 於: IEEE Transactions on Components and Packaging Technologies. 26, 2, p. 340-348 9 p.

研究成果: Article › 同行評審

2 引文斯高帕斯（Scopus）

Evaluation of effects of niobium and manganese addition on nickel base weldments

Kuo, T. Y., Lee, H. T. & Tu, C. C., 2003 2月, 於: Science and Technology of Welding and Joining. 8, 1, p. 39-48 10 p.

研究成果: Article › 同行評審

21 引文斯高帕斯（Scopus）

Feasibility evaluation of EDM hole drilling method for residual stress measurement

Lee, H. T. & Hsu, F. C., 2003 9月 1, 於: Materials Science and Technology. 19, 9, p. 1261-1265 5 p.

研究成果: Article › 同行評審

16 引文斯高帕斯（Scopus）

Influence of interfacial intermetallic compound on fracture behavior of solder joints

Lee, H. T., Chen, M. H., Jao, H. M. & Liao, T. L., 2003 10月 15, 於: Materials Science and Engineering: A. 358, 1-2, p. 134-141 8 p.

研究成果: Article › 同行評審

255 引文斯高帕斯（Scopus）

Investigation of precipitates in dissimilar weldments of alloy 690 and SUS 304l with Nb addition in the electrodes

Lee, H. T., Jeng, S. L. & Rehbach, W. P., 2003, 於: Microscopy and Microanalysis. 9, SUPPL. 2, p. 704-705 2 p.

研究成果: Article › 同行評審

開啟存取

Relationship between EDM parameters and surface crack formation

Lee, H. T. & Tai, T. Y., 2003 12月 10, 於: Journal of Materials Processing Technology. 142, 3, p. 676-683 8 p.

研究成果: Article › 同行評審

297 引文斯高帕斯（Scopus）

Surface integrity in micro-hole drilling using micro-electro discharge machining

Lee, H. T., Rehbach, W. P., Tai, T. Y. & Hsu, F. C., 2003 12月, 於: Materials Transactions. 44, 12, p. 2718-2722 5 p.

研究成果: Article › 同行評審

9 引文斯高帕斯（Scopus）

TEM investigations on dissimilar metal weldments for corrosive environment applications: Alloy 690 - I 82 - SUS 304L

Jeng, S. L., Lee, H. T. & Weirich, T. E., 2003, 於: Microscopy and Microanalysis. 9, SUPPL. 3, p. 334-335 2 p.

研究成果: Article › 同行評審

The microstructure and fracture behavior of the dissimilar alloy 690-SUS 304L joint with various Nb addition

Lee, H. T., Jeng, S. L. & Kuo, T. Y., 2003 5月, 於: Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science. 34 A, 5, p. 1097-1105 9 p.

研究成果: Article › 同行評審

47 引文斯高帕斯（Scopus）

2002

A general solution on stress singularities in the junction of two anisotrophic materials

Chue, C. H., Chen, T. H. & Lee, H. T., 2002 1月, 於: Composite Structures. 55, 1, p. 81-93 13 p.

研究成果: Article › 同行評審

14 引文斯高帕斯（Scopus）

Effects of filler metal composition on joining properties of alloy 690 weldments

Kuo, T. Y. & Lee, H. T., 2002 12月 15, 於: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 338, 1-2, p. 202-212 11 p.

研究成果: Article › 同行評審

89 引文斯高帕斯（Scopus）

Influence of intermetallic compounds on the adhesive strength of solder joints

Lee, H. T. & Chen, M. H., 2002 8月, 於: Materials Science and Engineering: A. 333, 1-2, p. 24-34 11 p.

研究成果: Article › 同行評審

141 引文斯高帕斯（Scopus）

2001

Characteristics of dissimilar welding of alloy 690 to 304L stainless steel

Lee, H. T. & Jeng, S. L., 2001, 於: Science and Technology of Welding and Joining. 6, 4, p. 225-234 10 p.

研究成果: Article › 同行評審

57 引文斯高帕斯（Scopus）

2000

Characteristic analysis of EDMed surfaces using the Taguchi approach

Lee, H. T. & Yur, J. P., 2000 1月 1, 於: Materials and Manufacturing Processes. 15, 6, p. 781-806 26 p.

研究成果: Article › 同行評審

65 引文斯高帕斯（Scopus）

Study between the fracture behavior and the thermomechanical effect of aluminum alloy 2024-T3 by TPB cracked test

Lee, H. T., Shaue, G. H. & Kuo, T. Y., 2000 6月 1, 於: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao. 21, 3, p. 293-301 9 p.

研究成果: Article › 同行評審

2 引文斯高帕斯（Scopus）

1999

Analysis of microstructure and mechanical properties in alloy 690 weldments using filler metals I-82 and I-52

Lee, H. T. & Kuo, T. Y., 1999, 於: Science and Technology of Welding and Joining. 4, 2, p. 94-103 10 p.

研究成果: Article › 同行評審

21 引文斯高帕斯（Scopus）

Effects of niobium on microstructure, mechanical properties, and corrosion behaviour in weldments of alloy 690

Lee, H. T. & Kuo, T. Y., 1999, 於: Science and Technology of Welding and Joining. 4, 4, p. 246-256 11 p.

研究成果: Article › 同行評審

23 引文斯高帕斯（Scopus）

Microstructural aspects and mechanical properties of alloy 690 weldments using I-52 and I-152 weld metals

Lee, H-T., Kuo, T. Y., Tu, C. J., Yeh, D. C. & Jeng, S. L., 1999 1月 1, 於: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao. 20, 3, p. 277-285 9 p.

研究成果: Article › 同行評審

2 引文斯高帕斯（Scopus）

The thermomechanical behavior for aluminum alloy under uniaxial tensile loading

Lee, H. T. & Shaue, G. H., 1999 8月 15, 於: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 268, 1-2, p. 154-164 11 p.

研究成果: Article › 同行評審

34 引文斯高帕斯（Scopus）

1993

Thermomechanical behaviour of metals in cyclic loading

Lee, H. T., Chen, J. C. & Wang, J. M., 1993 1月 1, 於: Journal of Materials Science. 28, 20, p. 5500-5507 8 p.

研究成果: Article › 同行評審

24 引文斯高帕斯（Scopus）

1991

Temperature effect induced by uniaxial tensile loading

Lee, H-T. & Chen, J. C., 1991 11月 1, 於: Journal of Materials Science. 26, 21, p. 5685-5692 8 p.

研究成果: Article › 同行評審

26 引文斯高帕斯（Scopus）

1990

Applications of thin-film replica on failure analysis

Lee, H. T., Chen, J. C. & Shieh, S. K., 1990 12月, 於: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao. 11, 6, p. 545-550 6 p.

研究成果: Article › 同行評審

The morphology and formation of gamma prime in nickel-base superalloy

Lee, H. T. & Lee, S. W., 1990 5月 1, 於: Journal of Materials Science Letters. 9, 5, p. 516-517 2 p.

研究成果: Article › 同行評審

27 引文斯高帕斯（Scopus）

1989

Effect of the variation in Sm/Cu/Zr content on phase stability of an Sm(Co, Fe, Cu, Zr)_7.4 permanent magnet alloy

Chin, T. S., Chang, W. C., Chang, R. T., Hung, M. P. & Lee, H. T., 1989 9月, 於: IEEE Transactions on Magnetics. 25, 5, p. 3782-3784 3 p.

研究成果: Article › 同行評審

7 引文斯高帕斯（Scopus）

Structure and Magnetic Properties of the ThMn₁₂ Type NdFeM Alloys (M=Si/Al/B/Transition Metals)

Chin, T. S., Chang, W. C., Ku, H. C., Weng, C. C., Lee, H. T. & Hung, M. P., 1989 9月, 於: IEEE Transactions on Magnetics. 25, 5, p. 3300-3302 3 p.

研究成果: Article › 同行評審

11 引文斯高帕斯（Scopus）

Study of the effect of induction surface hardening on AISI 1045 mild carbon steel

Lee, H. T. & Hwang, D. J., 1989 10月, 於: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao. 10, 5, p. 365-373 9 p.

研究成果: Article › 同行評審

1 引文斯高帕斯（Scopus）

李 驊登

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李驊登