每年專案
個人檔案
學歷
- 2002 國立交通大學資訊科學博士
研究專長
- 奈米積體電路自動化
經歷
- 2002~2007 瑞昱半導體研發中心設計自動化部專案副理
- 2007~2012 國立成功大學電機系助理教授
- 2012~迄今 國立成功大學電機系副教授
指紋
查看啟用 Jai-Ming Lin 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 1 類似的個人檔案
網路
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
專案
- 9 已完成
-
-
-
考量三維晶片平面規畫與除錯之低功耗動態調整電壓與頻率之設計方法-子計畫四：在三維晶片考量多重電壓源之整合型電源線規劃與平面規劃
15-08-01 → 16-07-31
研究計畫: Research project
-
考量三維晶片平面規畫與除錯之低功耗動態調整電壓與頻率之設計方法-子計畫四：在三維晶片考量多重電壓源之整合型電源線規劃與平面規劃
14-08-01 → 15-07-31
研究計畫: Research project
-
考量三維晶片平面規畫與除錯之低功耗動態調整電壓與頻率之設計方法-子計畫四：在三維晶片考量多重電壓源之整合型電源線規劃與平面規劃
13-08-01 → 14-07-31
研究計畫: Research project
-
A fast power network optimization algorithm for improving dynamic IR-drop
Lin, J. M., Kung, Y. T., Huang, Z. Y. & Chen, I. R., 2021 3月 22, ISPD 2021 - Proceedings of the 2021 International Symposium on Physical Design. Association for Computing Machinery, p. 91-98 8 p. 3447042. (Proceedings of the International Symposium on Physical Design).研究成果: Conference contribution
開啟存取 -
DAPA: A Dataflow-aware Analytical Placement Algorithm for Modern Mixed-size Circuit Designs
Lin, J. M., Huang, W. F., Chen, Y. C., Wang, Y. T. & Wang, P. W., 2021, 2021 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD; 卷 2021-November).研究成果: Conference contribution
-
Dataflow-Aware Macro Placement Based on Simulated Evolution Algorithm for Mixed-Size Designs
Lin, J. M., Deng, Y. L., Yang, Y. C., Chen, J. J. & Lu, P. C., 2021 5月, 於: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 29, 5, p. 973-984 12 p., 9360844.研究成果: Article › 同行評審
2 引文 斯高帕斯（Scopus） -
Routability-driven Global Placer Target on Removing Global and Local Congestion for VLSI Designs
Lin, J. M., Huang, C. W., Zane, L. C., Tsai, M. C., Lin, C. L. & Tsai, C. F., 2021, 2021 40th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD; 卷 2021-November).研究成果: Conference contribution
-
Thermal-Aware Fixed-Outline Floorplanning Using Analytical Models with Thermal-Force Modulation
Lin, J. M., Chen, T. T., Hsieh, H. Y., Shyu, Y. T., Chang, Y. J. & Lu, J. M., 2021 5月, 於: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 29, 5, p. 985-997 13 p., 9378550.研究成果: Article › 同行評審