每年專案
個人檔案
學歷
- 2002 國立交通大學資訊科學博士
研究專長
- 奈米積體電路自動化
經歷
- 2002~2007 瑞昱半導體研發中心設計自動化部專案副理
- 2007~2012 國立成功大學電機系助理教授
- 2012~迄今 國立成功大學電機系副教授
指紋
查看啟用 Jai-Ming Lin 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 1 類似的個人檔案
過去五年中的合作和熱門研究領域
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
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Voltage-Drop Optimization Through Insertion of Extra Stripes to a Power Delivery Network
Lin, J. M., Chen, Y. T., Kung, Y. T. & Lin, H. J., 2023 3月 26, ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Association for Computing Machinery, p. 35-43 9 p. (Proceedings of the International Symposium on Physical Design).研究成果: Conference contribution
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A novel blockage-avoiding macro placement approach for 3D ICs based on POCS
Lin, J. M., Lu, P. C., Lin, H. Y. & Tsai, J. T., 2022 10月 30, Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2022. Institute of Electrical and Electronics Engineers Inc., 118. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).研究成果: Conference contribution
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PPOM: An Effective Post-Global Placement Optimization Methodology for Better Wirelength and Routability
Lin, J. M., Zane, L. C., Tsai, M. C., Chen, Y. C., Lin, C. L. & Tsai, C. F., 2022 11月 1, 於: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 30, 11, p. 1783-1793 11 p.研究成果: Article › 同行評審
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Routability-driven analytical placement with precise penalty models for large-scale 3D ICs
Lin, J. M., Hsieh, H. Y., Kung, H. & Lin, H. J., 2022 10月 30, Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2022. Institute of Electrical and Electronics Engineers Inc., 119. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).研究成果: Conference contribution
開啟存取 -
A fast power network optimization algorithm for improving dynamic IR-drop
Lin, J. M., Kung, Y. T., Huang, Z. Y. & Chen, I. R., 2021 3月 22, ISPD 2021 - Proceedings of the 2021 International Symposium on Physical Design. Association for Computing Machinery, p. 91-98 8 p. 3447042. (Proceedings of the International Symposium on Physical Design).研究成果: Conference contribution
開啟存取1 引文 斯高帕斯（Scopus）