每年專案
個人檔案
學歷
- 2002 國立交通大學資訊科學博士
研究專長
- 奈米積體電路自動化
經歷
- 2002~2007 瑞昱半導體研發中心設計自動化部專案副理
- 2007~2012 國立成功大學電機系助理教授
- 2012~迄今 國立成功大學電機系副教授
指紋
查看啟用 Jai-Ming Lin 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
- 1 類似的個人檔案
過去五年中的合作和熱門研究領域
國家/地區層面的近期外部共同作業。按一下圓點深入探索詳細資料，或
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An Effective Analytical Placement Approach to Handle Fence Region Constraint
Lin, J. M., Chen, Y. C., Lin, W. Y., Chen, P. Y., Tsai, C. F., Fu, D. S. & Lin, C. L., 2025 4月 9, Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2024. Institute of Electrical and Electronics Engineers Inc., 21. (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).研究成果: Conference contribution
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Timing-Driven Analytical Placement According to Expected Cell Distribution Range
Lin, J. M., Chang, Y. Y. & Huang, W. L., 2024 3月 12, ISPD 2024 - Proceedings of the 2024 International Symposium on Physical Design. Association for Computing Machinery, p. 177-184 8 p. (Proceedings of the International Symposium on Physical Design).研究成果: Conference contribution
2 引文 斯高帕斯（Scopus） -
HyPlace-3D: A Hybrid Placement Approach for 3D ICs Using Space Transformation Technique
Lin, J. M., Lin, Y. C., Kung, H. & Lin, W. Y., 2023, 2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).研究成果: Conference contribution
1 引文 斯高帕斯（Scopus） -
Multilevel Fixed-Outline Component Placement and Graph-Based Ball Assignment for System in Package
Lin, J. M., Tsai, T. L. & Tsai, T. C., 2023 9月 1, 於: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 31, 9, p. 1308-1319 12 p.研究成果: Article › 同行評審
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Routability-Driven Orientation-Aware Analytical Placement for System in Package
Lin, J. M., Tsai, T. C. & Shen, R. T., 2023, 2023 42nd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD).研究成果: Conference contribution
2 引文 斯高帕斯（Scopus）