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查看斯高帕斯 (Scopus) 概要
郭 瑞昭
教授
材料科學及工程學系
尖端材料國際碩士學位學程
電話
866 6 2757575 ext 62939
電子郵件
jckuo
mail.ncku.edu
tw
網站
https://office.mse.ncku.edu.tw/lmmp/
h-index
1395
引文
22
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
2003
2025
每年研究成果
概覽
指紋
網路
專案
(18)
研究成果
(124)
類似的個人檔案
(6)
監製作品
(31)
指紋
查看啟用 Jui-Chao Kuo 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Material Science
Electron Backscatter Diffraction
100%
Aluminum
55%
Grain Boundary
41%
Annealing
39%
Film
34%
Density
29%
Grain Size
23%
Single Crystal
23%
Thin Films
21%
Intermetallics
21%
Scanning Electron Microscopy
20%
X-Ray Diffraction
18%
Low Carbon Steel
18%
Nanoindentation
18%
Indentation
17%
Diffraction Measurement
16%
Plastic Deformation
15%
Bicrystal
14%
Austenite
14%
High Entropy Alloys
13%
Aluminum Alloy
13%
Solder Joint
11%
Surface (Surface Science)
11%
Magnesium
11%
Nucleation
10%
Stainless Steel
9%
Energy-Dispersive X-Ray Spectroscopy
9%
Electroplating
9%
Composite Material
9%
Oxide Compound
9%
Niobium
9%
Morphology
8%
Electrical Resistivity
8%
Electrodeposition
8%
Plating
7%
Volume Fraction
7%
Solid Solution
7%
Deep Drawing
6%
Optical Property
6%
Plastic Anisotropy
6%
Surface Morphology
6%
Crystal Growth
6%
Microstructural Analysis
6%
Atomic Force Microscopy
6%
Transmission Electron Microscopy
6%
Crystal Structure
6%
Crystal Plasticity
5%
Thermal Stability
5%
Strain Measurement
5%
Thick Films
5%
Engineering
Thin Films
24%
Indentation
23%
Digital Image Correlation
22%
Accelerating Voltage
16%
Correlation Method
14%
Anisotropic
13%
Digital Image Correlation Technique
13%
Layer Film
13%
Bicrystal
11%
Mild Steel
9%
Strain Field
9%
Simple Shear
9%
Plane Strain Compression
9%
Annealing Temperature
9%
Room Temperature
9%
Spatial Resolution
9%
Focused Ion Beam
7%
Laser Irradiation
6%
Specimen Thickness
6%
Film Surface
6%
Average Grain Size
6%
Plane Strain
6%
Austenite
6%
Yield Point
6%
Plastic Deformation
6%
Two Dimensional
5%
Magnetron
5%
High Resolution
5%
Austenite Grain Size
5%
Glass Substrate
5%
Keyphrases
Current Stressing
11%
Microstructure
10%
SnO2
9%
High-entropy Alloy
9%
Plane Strain Compression
9%
Fe-Pd Alloy
9%
Solder Joint
9%
EBSD Analysis
9%
Cu-Sn
9%
Annealing
7%
Digital Image Correlation
6%
Cu3Sn
6%
Channel-die
6%
Longitudinal Resolution
6%
Plastic Deformation
6%
Bicrystal
5%
Electron Backscatter Diffraction
5%
UV Laser
5%
Accelerating Voltage
5%
