Tsu, W. C., Hsu, H. L. & Mizuno, J., 2026, 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026.Institute of Electrical and Electronics Engineers Inc., p. 419-4202 p. (2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026).
Lo, Y. H., Mizuno, J., Chang, H. H., Wu, Y.-T., Friyadi, M. F., Yu, C.-H., Miyamoto, T., Wu, W. C., Huang, H. H., Wang, C. C. & Hung, C. P., 2026, 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026.Institute of Electrical and Electronics Engineers Inc., p. 223-2242 p. (2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026).
Mukherjee, S., Hsieh, W. Z., Hung, M. W., Chiang, C. Y., Chiu, S. J., Mizuno, J. & Lin, S.-K., 2026 3月 5, 於: Journal of Alloys and Compounds.1057, 186817.