Hsieh, C. T.,
Ting, J-M.,
Yang, C. &
Chung, C-K.,
2002 1月 1,
Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002. Institute of Electrical and Electronics Engineers Inc.,
p. 300-306 7 p. 1188855. (Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002).
研究成果: Conference contribution