陳國聲

Lin, P. C., Cheng, Y. F. & Chen, K-S., 2019 一月 23, Proceedings of the 2018 18th International Conference on Mechatronics - Mechatronika, ME 2018. Maga, D., Stefek, A. & Brezina, T. (編輯). Institute of Electrical and Electronics Engineers Inc., 8624672. (Proceedings of the 2018 18th International Conference on Mechatronics - Mechatronika, ME 2018).

研究成果: Conference contribution

Bearings (structural)

Elastomers

Precision engineering

Rubber

Stiffness

Finite Element Input Shaping Design for Vibration Suppression of Mechatronics Systems

Chen, W., Chen, K-S. & Tsai, M-C., 2019 五月 24, Proceedings - 2019 IEEE International Conference on Mechatronics, ICM 2019. Institute of Electrical and Electronics Engineers Inc., p. 37-42 6 p. 8722868. (Proceedings - 2019 IEEE International Conference on Mechatronics, ICM 2019).

研究成果: Conference contribution

Vibration Suppression

Mechatronics

Finite Element

Motion

Finite Element Simulation

Realization and performance assessment of a force-sensing based smart floor panel for indoor localization applications

Cheng, C. H., Wu, M. F., Guo, S. H. & Chen, K-S., 2019 一月 1, 於 : Sensors and Actuators, A: Physical. 285, p. 468-481 14 p.

研究成果: Article

Demonstrations

Fusion reactions

Calibration

rigid structures

Bridge decks

Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

Yang, C. Y., Chen, K-S., Yang, T-S., Chiu, T-C. & Ho, C-J., 2019 四月 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

Fans

Sensitivity analysis

Packaging

Processing

Sheet molding compounds

A new technique for creating curved interior holes on ultrathin glass based on picosecond laser drilling and thermo-shock separation

Chuang, C. F. & Chen, K-S., 2018 六月 22, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018. Marcelli, R., Mita, Y., Smith, S., Pressecq, F., Nouet, P., Mailly, F. & Schneider, P. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 1-5 5 p. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018).

研究成果: Conference contribution

laser drilling

Drilling

shock

Glass

Lasers