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查看斯高帕斯 (Scopus) 概要
陳 國聲
教授
機械工程學系
電話
886 6 2757575 ext 62192
電子郵件
kschen
mail.ncku.edu
tw
網站
http://140.116.155.39/
h-index
2093
引文
25
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
1997 …
2023
每年研究成果
概覽
指紋
網路
專案
(40)
研究成果
(158)
類似的個人檔案
(6)
監製作品
(24)
如果您對這些純文本內容做了任何改變，很快就會看到。
指紋
查看啟用 Kuo-Shen Chen 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Engineering & Materials Science
Buckling
15%
Cantilever beams
16%
Characterization (materials science)
39%
Chemical mechanical polishing
35%
Defects
13%
Demonstrations
14%
Derivatives
18%
Elastic moduli
13%
Elastomers
14%
Electromechanical coupling
18%
Electron beam lithography
15%
Electrostatics
27%
Fans
22%
Fracture toughness
23%
Glass
16%
Indentation
16%
Light emitting diodes
19%
Materials properties
13%
Mechanical properties
28%
Mechanics
19%
MEMS
100%
Mobile robots
43%
Nanoindentation
35%
Navigation
22%
Nitrides
15%
Oxide films
25%
Packaging
16%
Peeling
17%
Plasma enhanced chemical vapor deposition
39%
Plasmas
20%
Polydimethylsiloxane
16%
Rapid thermal annealing
34%
Reactive ion etching
13%
Residual stresses
52%
Robots
16%
Rubber
17%
Sensors
20%
Servomotors
15%
Silicon
30%
Silicon nitride
20%
Space applications
13%
Stiffness
17%
Structural design
17%
Structural integrity
20%
Temperature
22%
Testing
14%
Thin films
14%
Vapors
15%
Vibration control
15%
Chemical Compounds
Annealing
9%
Buffer Solution
5%
Creep
6%
Curing
9%
Energy
6%
Environment
6%
Error
8%
Etching
7%
Force
11%
Fracture Mechanics
6%
Fracture Strength
15%
Fracture Toughness
14%
Glass
11%
Heat Transfer
5%
Laser Ablation
5%
Liquid Film
29%
Mechanical Fatigue
6%
Mechanics
15%
Nitride
21%
Oxide
10%
Plasma
5%
Plasma Enhanced Chemical Vapour Deposition
13%
Pressure
5%
Rapid Thermal Annealing
26%
Reduction
5%
Residual Stress
53%
Shape
5%
Simulation
31%
Strength
19%
Stress Relaxation
7%
Surface
7%
Thermal Expansion Coefficient
7%
Turbine
7%
Viscoelasticity
9%
Voltage
6%
Young's Modulus
11%
Physics & Astronomy
actuation
8%
annealing
12%
characterization
18%
commands
10%
crack propagation
6%
data reduction
5%
design analysis
5%
elastomers
5%
electrostatics
5%
etching
5%
fabrication
6%
formulations
5%
fracture strength
14%
glass
5%
indentation
9%
integrity
6%
machine tools
5%
mechanical properties
18%
microelectromechanical systems
31%
modules
7%
modulus of elasticity
5%
nanoindentation
18%
nitrides
7%
oxide films
11%
performance
9%
positioning
11%
predictions
5%
residual stress
20%
retarding
5%
robot control
6%
robots
6%
rubber
6%
shock
5%
silicon
11%
silicon nitrides
13%
simulation
5%
structural reliability
6%
temperature
5%
tensile stress
6%
touch
5%
vapor deposition
8%
vapors
5%
vibration
10%
wafers
5%
warpage
5%
