陳 國聲

教授

  • 1655 引文
  • 23 h-指數
19972020

每年研究成果

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研究成果

2020

Design and realization of a performance and reliability evaluation module for commercialized anti-lock braking systems

Wu, J. H., Guo, S. H., Chen, K. S. & Tsai, M. C., 2020 一月 1, Mechatronics 2019: Recent Advances Towards Industry 4.0. Szewczyk, R., Nowicki, M., Ostaszewska-Lizewska, A. & Krejsa, J. (編輯). Springer Verlag, p. 237-245 9 p. (Advances in Intelligent Systems and Computing; 卷 1044).

研究成果: Conference contribution

2019

Design and Realization of a Novel Elastomer Characterization System for Precision Positioning Application

Lin, P. C., Cheng, Y. F. & Chen, K. S., 2019 一月 23, Proceedings of the 2018 18th International Conference on Mechatronics - Mechatronika, ME 2018. Maga, D., Stefek, A. & Brezina, T. (編輯). Institute of Electrical and Electronics Engineers Inc., 8624672. (Proceedings of the 2018 18th International Conference on Mechatronics - Mechatronika, ME 2018).

研究成果: Conference contribution

Finite Element Input Shaping Design for Vibration Suppression of Mechatronics Systems

Chen, W., Chen, K. S. & Tsai, M. C., 2019 五月 24, Proceedings - 2019 IEEE International Conference on Mechatronics, ICM 2019. Institute of Electrical and Electronics Engineers Inc., p. 37-42 6 p. 8722868. (Proceedings - 2019 IEEE International Conference on Mechatronics, ICM 2019).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

Yang, C. Y., Chen, K. S., Yang, T. S. G., Chiu, T. C. & Ho, C. J., 2019 四月, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2018

A new technique for creating curved interior holes on ultrathin glass based on picosecond laser drilling and thermo-shock separation

Chuang, C. F. & Chen, K. S., 2018 六月 22, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018. Marcelli, R., Mita, Y., Smith, S., Pressecq, F., Nouet, P., Mailly, F. & Schneider, P. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 1-5 5 p. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Damping Enhancement and Positioning Control of Compliant Stages by Incorporating Rubber Shear Dampers

Yula, Y. H., Lee, K. H., Chen, K. S. & Liu, Y. H., 2018 十月 15, 2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018. Institute of Electrical and Electronics Engineers Inc., p. 533-538 6 p. 8492683. (2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018).

研究成果: Conference contribution

Development of dual Wiimote-based 3D localization schemes for mobile robot and quadcopter integration

Zhan, H. Y., Li, T. H., Cheng, C. H., Kuo, S. H. & Chen, K. S., 2018 一月 1, Mechatronics 2017 - Recent Technological and Scientific Advances. Brezina, T. & Jablonski, R. (編輯). Springer Verlag, p. 644-652 9 p. (Advances in Intelligent Systems and Computing; 卷 644).

研究成果: Conference contribution

Impedance Control of Self-Sensing Piezoelectric Actuator for Vibration Suppression

Chang, L. K., Tsai, M. C., Chen, K. S. & Lu, Z. L., 2018 十一月 27, ICEMS 2018 - 2018 21st International Conference on Electrical Machines and Systems. Institute of Electrical and Electronics Engineers Inc., p. 2533-2536 4 p. 8549428. (ICEMS 2018 - 2018 21st International Conference on Electrical Machines and Systems).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Mechanical Properties Characterizations of Elastomer Pads and Control of a 3-DOF Rubber-Bearing Stage

Chen, Y. C., Chen, C. A., Chen, K. S. & Liu, Y. H., 2018 十月 15, 2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018. Institute of Electrical and Electronics Engineers Inc., p. 539-544 6 p. 8492707. (2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018).

研究成果: Conference contribution

Probabilistic reasoning in diagnostic expert system for smart homes

Vechet, S., Krejsa, J., Hrbacek, J. & Chen, K. S., 2018 一月 1, Mechatronics 2017 - Recent Technological and Scientific Advances. Brezina, T. & Jablonski, R. (編輯). Springer Verlag, p. 708-715 8 p. (Advances in Intelligent Systems and Computing; 卷 644).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)
2017

Buckling and Postbuckling Failure Analyses on a Rectangular Membrane for Touch Panel Applications

Chuang, C. H., Chang, Y. K., Chen, K. S. & Chen, C. C., 2017 三月, 於 : IEEE Transactions on Device and Materials Reliability. 17, 1, p. 204-212 9 p., 7812653.

研究成果: Article

2 引文 斯高帕斯(Scopus)

Development of signal transmission and reduction modules for status monitoring and prediction of machine tools

Sun, I. C. & Chen, K. S., 2017 十一月 10, 2017 56th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2017. Institute of Electrical and Electronics Engineers Inc., p. 711-716 6 p. (2017 56th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2017; 卷 2017-November).

研究成果: Conference contribution

Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects

Hsiao, C. L., Yang, C. Y., Chen, H. C., Yang, T. S., Chen, K. S., Wu, T. H., Wang, Y. C. & Lee, S., 2017 七月 1, IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, p. 42-45 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2017-October).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

Process emulation for predicting die shift and wafer warpage in wafer reconstitution

Yang, C. Y., Liu, Y. C., Chen, K. S., Yang, T. S., Wang, Y. C. & Lee, S. S., 2017 九月 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 215-220 6 p. 8046441. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)
2016
開啟存取
2 引文 斯高帕斯(Scopus)

A Wiimote 3D localization scheme without channel constraints

Li, T. H. & Chen, K. S., 2016 一月 1, Advances in Intelligent Systems and Computing. Springer Verlag, p. 577-582 6 p. (Advances in Intelligent Systems and Computing; 卷 393).

研究成果: Chapter

1 引文 斯高帕斯(Scopus)
23 引文 斯高帕斯(Scopus)

Design and control of a cascaded piezoelectric actuated two-degrees-of-freedom positioning compliant stage

Lee, J. W., Li, Y. C., Chen, K. S. & Liu, Y. H., 2016 七月 1, 於 : Precision Engineering. 45, p. 374-386 13 p.

研究成果: Article

11 引文 斯高帕斯(Scopus)

Design and control of a one-dimensional stage based on elastomeric bearing technology

Teng, Y. C., Chen, K. S. & Chen, Y. C., 2016 十月 7, MESA 2016 - 12th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 7587136. (MESA 2016 - 12th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications - Conference Proceedings).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Enhancement of autonomous robot navigation via sensor failure detection

Vechet, S., Krejsa, J. & Chen, K. S., 2016 一月 1, Advances in Intelligent Systems and Computing. Springer Verlag, p. 657-662 6 p. (Advances in Intelligent Systems and Computing; 卷 393).

研究成果: Chapter

1 引文 斯高帕斯(Scopus)

On the mechanics of laser peeling for ultra-thin glasses

Chiu, T. C., Hua, C. A., Wang, C. H., Chen, K. S., Yang, T. S., Wen, C. D., Li, C. H., Lin, M. C., Huang, C. J. & Chen, K. T., 2016 九月 1, 於 : Engineering Fracture Mechanics. 163, p. 236-247 12 p.

研究成果: Article

4 引文 斯高帕斯(Scopus)
1 引文 斯高帕斯(Scopus)

Suppression of motion-induced vibration for a two-DoF system using state feedback control

Lin, W. T., Chen, K-S., Chen, Y. C. & Vechet, S., 2016 十一月 21, Proceedings - 2016 IEEE International Power Electronics and Motion Control Conference, PEMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 775-780 6 p. 7752091. (Proceedings - 2016 IEEE International Power Electronics and Motion Control Conference, PEMC 2016).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

Chen, K. S., Yang, T. S., Hong, R. C., Chiu, T. C., Wen, A. C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2016 七月 15, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Mita, Y., Rencz, M., Charlot, B., Schneider, P., Tas, N., Nouet, P. & Pressecq, F. (編輯). Institute of Electrical and Electronics Engineers Inc., 7514879. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2015
8 引文 斯高帕斯(Scopus)

Electromechanical coupling characteristics of MEMS micro cantilevers with applications

Ou, K. S. & Chen, K. S., 2015 七月 16, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015. Schropfer, G., Pressecq, F., Rencz, M., Schneider, P., Mita, Y., Charlot, B. & Nouet, P. (編輯). Institute of Electrical and Electronics Engineers Inc., 7161008. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

MEMS Residual Stress Characterization: Methodology and Perspective

Chen, K-S. & Ou, K. S., 2015 一月 1, Handbook of Silicon Based MEMS Materials and Technologies: Second Edition. Elsevier Inc., p. 398-412 15 p.

研究成果: Chapter

5 引文 斯高帕斯(Scopus)
1 引文 斯高帕斯(Scopus)

Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing

Yang, T. S., Chen, G. D., Chen, K. S., Hong, R. C., Chiu, T. C., Wen, C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2015 一月 1, Micro- and Nano-Systems Engineering and Packaging. American Society of Mechanical Engineers (ASME), (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); 卷 10-2015).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)
2014

A novel indoor localization scheme by integrating wiimote sensing and a controllable IR-LED array

Fu, Y. T. & Chen, K. S., 2014 一月 1, Mechatronics 2013: Recent Technological and Scientific Advances. Springer Berlin, p. 567-574 8 p. (Mechatronics 2013: Recent Technological and Scientific Advances).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)
3 引文 斯高帕斯(Scopus)

Buckling analysis for a rectangular membrane for touch panel applications

Chuang, C. H., Hong, R. C., Chen, K. S. & Chen, C. C., 2014 十月 13, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014. Bi, K., Tian, Z. & Xu, Z. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 1495-1498 4 p. 6922937. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Design, analysis, and experimental studies of a novel PVDF-based piezoelectric energy harvester with beating mechanisms

Chen, K-S., 2014 一月 1, Dynamics, Vibration, and Control. American Society of Mechanical Engineers (ASME), (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); 卷 4B).

研究成果: Conference contribution

5 引文 斯高帕斯(Scopus)

Design and vibration control of a notch-based compliant stage for display panel inspection applications

Wang, W. C., Lee, J. W., Chen, K. S. & Liu, Y. H., 2014 五月 12, 於 : Journal of Sound and Vibration. 333, 10, p. 2701-2718 18 p.

研究成果: Article

6 引文 斯高帕斯(Scopus)

Hybrid navigation method for dynamic indoor environment based on mixed potential fields

Vechet, S., Chen, K-S. & Krejsa, J., 2014 一月 1, Mechatronics 2013: Recent Technological and Scientific Advances. Springer Berlin, p. 575-582 8 p. (Mechatronics 2013: Recent Technological and Scientific Advances).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)
9 引文 斯高帕斯(Scopus)
4 引文 斯高帕斯(Scopus)

Sensor failure detection in autonomous mobile robot application

Vechet, S., Krejsa, J. & Chen, K. S., 2014 一月 22, Proceedings of the 16th International Conference on Mechatronics, Mechatronika 2014. Brezina, T., Stefek, A. & Maga, D. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 375-380 6 p. 7018287. (Proceedings of the 16th International Conference on Mechatronics, Mechatronika 2014).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

The investigation of buckling, deformation and interaction of elastic films for touch panel applications

Chuang, C. H., Chen, K. S., Chen, C. C. & Hong, R. C., 2014 一月 1, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 105-108 4 p. 7048398. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2013

Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods

Chen, K. S. & Wu, S. L., 2013 九月 2, 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013. 6559453. (2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)