陳 國聲

教授

  • 1657 引文
  • 23 h-指數
19972020

每年研究成果

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研究成果

篩選
Conference contribution
2007

Mechanical properties characteristics or rubber O-rings by digital image correlation and nanoindentation

Chen, K. S., Chen, T. Y., Yan, H. Y., Huang, I. T. & Chen, J. K., 2007 十一月 19, Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007. p. 286-293 8 p. (Proceedings of the SEM Annual Conference and Exposition on Experimental and Applied Mechanics 2007; 卷 1).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2008

Elastic and viscoelastic characterization of polydimethylsiloxane (PDMS) for cell-mechanics applications

Lin, I. K., Liao, Y. M., Liu, Y., Chen, K. S. & Zhang, X., 2008 六月 30, Microelectromechanical Systems - Materials and Devices. p. 81-86 6 p. (Materials Research Society Symposium Proceedings; 卷 1052).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

Indentation characterization of fracture toughness and interfacial strength of PECVD nitrides after rapid thermal annealing

Yan, H. Y., Ou, K. S. & Chen, K. S., 2008 六月 30, Microelectromechanical Systems - Materials and Devices. p. 59-64 6 p. (Materials Research Society Symposium Proceedings; 卷 1052).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)
2009

A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

Ou, K. S., Chen, K-S., Yang, T-S. & Lee, S-Y., 2009 十二月 1, ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. p. 597-606 10 p. (Proceedings of the ASME Design Engineering Technical Conference; 卷 6).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Cellular force measurement in cardiac myocytes using polymer micropillar array with viscoelastic characterization

Lin, I. K., Ou, K. S., Chen, K-S. & Zhang, X., 2009, Proceedings of Conference, MicroTAS 2009 - The 13th International Conference on Miniaturized Systems for Chemistry and Life Sciences. Chemical and Biological Microsystems Society, p. 269-271 3 p.

研究成果: Conference contribution

2010

Development of device-level chemical-mechanical polishing simulation module using cellular automata method

Yeh, H. M. & Chen, K. S., 2010 十一月 9, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010. p. 669-672 4 p. (Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010; 卷 2).

研究成果: Conference contribution

Effects of wafer carrier design on contact stress uniformity in CMP

Hu, I., Yanga, T. S. & Chen, K. S., 2010, Advances in Abrasive Technology XIII. p. 305-310 6 p. (Advanced Materials Research; 卷 126-128).

研究成果: Conference contribution

IR indoor localization and wireless transmission for motion control in smart building applications based on wiimote technology

Chen, P. W., Ou, K. S. & Chen, K. S., 2010 一月 1, Proceedings of SICE Annual Conference 2010, SICE 2010 - Final Program and Papers. Society of Instrument and Control Engineers (SICE), p. 1781-1785 5 p. 5602939. (Proceedings of the SICE Annual Conference).

研究成果: Conference contribution

33 引文 斯高帕斯(Scopus)

Mechanical characterization of atomic layer deposited (ALD) alumina for applications in corrosive environments

Ou, K. S., Lin, I. K., Wu, P. H., Huang, Z. K., Chen, K. S. & Zhang, X., 2010 八月 30, Microelectromechanical Systems - Materials and Devices III. p. 111-116 6 p. (Materials Research Society Symposium Proceedings; 卷 1222).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

The tunability in mechanical properties and fracture toughness of sputtered silicon oxynitride thin films for MEMS-based infrared detectors

Lin, I. K., Wu, P. H., Ou, K. S., Chen, K. S. & Zhang, X., 2010 八月 30, Microelectromechanical Systems - Materials and Devices III. p. 123-128 6 p. (Materials Research Society Symposium Proceedings; 卷 1222).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)
2011

Analysis, simulation, and experimental investigations of a one dimensional touch panel based on strain sensing

Pi, C. H., Ou, K. S., Chen, M. H. & Chen, K. S., 2011 一月 1, SICE 2011 - SICE Annual Conference 2011, Final Program and Abstracts. Society of Instrument and Control Engineers (SICE), p. 1954-1959 6 p. 6060288. (Proceedings of the SICE Annual Conference).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Mechanical properties characterization of PECVD nitride films with rapid thermal annealing using finite element simulation

Chiang, C. Y., Yan, H. Y., Huang, Z. K. & Chen, K. S., 2011 十一月 23, Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011. p. 20-23 4 p. (Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011; 卷 1).

研究成果: Conference contribution

Nanoindentation characterization of PECVD silicon nitride on silicon subjected to mechanical fatigue loading

Huang, Z. K., Ou, K. S. & Chen, K-S., 2011 九月 30, Microelectromechanical Systems - Materials and Devices IV. p. 173-178 6 p. (Materials Research Society Symposium Proceedings; 卷 1299).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Vibration control on single axis flexible piezoelectric positioning stage by PID controller

Liu, Y. H., Chao, C. M., Lu, C. T. & Chen, K-S., 2011 一月 1, Advances in Environmental Vibration - Proceedings of the 5th International Symposium on Environmental Vibration, ISEV 2011. Takemiya, H., De Roeck, G., Zhai, W. & Tutumluer, E. (編輯). Science Press, p. 883-889 7 p. (Advances in Environmental Vibration - Proceedings of the 5th International Symposium on Environmental Vibration, ISEV 2011).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Wireless group manipulation of autonomously guided mobile robots for smart living space applications

Chen, M. H., Gu, D., Fu, Y. D., Pi, C. H., Ou, K. S. & Chen, K. S., 2011 一月 1, SICE 2011 - SICE Annual Conference 2011, Final Program and Abstracts. Society of Instrument and Control Engineers (SICE), p. 2143-2148 6 p. 6060326. (Proceedings of the SICE Annual Conference).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)
2012

Design of Wiimote indoor localization technology for omni-directional vehicle trajectory control

Gu, D., Ou, K. S., Fu, Y. T. & Chen, K-S., 2012 十月 9, CSAE 2012 - Proceedings, 2012 IEEE International Conference on Computer Science and Automation Engineering. p. 600-604 5 p. 6272667. (CSAE 2012 - Proceedings, 2012 IEEE International Conference on Computer Science and Automation Engineering; 卷 1).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

On the development of autonomously manipulation of group mobile robots for smart living and biomimetic applications

Chen, M. H., Fu, Y. T., Ou, K. S., Gu, D., Pi, C. H. & Chen, K-S., 2012 十月 9, CSAE 2012 - Proceedings, 2012 IEEE International Conference on Computer Science and Automation Engineering. p. 259-263 5 p. 6272770. (CSAE 2012 - Proceedings, 2012 IEEE International Conference on Computer Science and Automation Engineering; 卷 2).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)
2013

Modeling of chemical mechanical polishing processes by cellular automata and finite element/Matlab integration methods

Chen, K. S. & Wu, S. L., 2013 九月 2, 2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013. 6559453. (2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2014

A novel indoor localization scheme by integrating wiimote sensing and a controllable IR-LED array

Fu, Y. T. & Chen, K. S., 2014 一月 1, Mechatronics 2013: Recent Technological and Scientific Advances. Springer Berlin, p. 567-574 8 p. (Mechatronics 2013: Recent Technological and Scientific Advances).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

Buckling analysis for a rectangular membrane for touch panel applications

Chuang, C. H., Hong, R. C., Chen, K. S. & Chen, C. C., 2014 十月 13, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014. Bi, K., Tian, Z. & Xu, Z. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 1495-1498 4 p. 6922937. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Design, analysis, and experimental studies of a novel PVDF-based piezoelectric energy harvester with beating mechanisms

Chen, K-S., 2014 一月 1, Dynamics, Vibration, and Control. American Society of Mechanical Engineers (ASME), (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); 卷 4B).

研究成果: Conference contribution

5 引文 斯高帕斯(Scopus)

Hybrid navigation method for dynamic indoor environment based on mixed potential fields

Vechet, S., Chen, K-S. & Krejsa, J., 2014 一月 1, Mechatronics 2013: Recent Technological and Scientific Advances. Springer Berlin, p. 575-582 8 p. (Mechatronics 2013: Recent Technological and Scientific Advances).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

Sensor failure detection in autonomous mobile robot application

Vechet, S., Krejsa, J. & Chen, K. S., 2014 一月 22, Proceedings of the 16th International Conference on Mechatronics, Mechatronika 2014. Brezina, T., Stefek, A. & Maga, D. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 375-380 6 p. 7018287. (Proceedings of the 16th International Conference on Mechatronics, Mechatronika 2014).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

The investigation of buckling, deformation and interaction of elastic films for touch panel applications

Chuang, C. H., Chen, K. S., Chen, C. C. & Hong, R. C., 2014 一月 1, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 105-108 4 p. 7048398. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2015

Electromechanical coupling characteristics of MEMS micro cantilevers with applications

Ou, K. S. & Chen, K. S., 2015 七月 16, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015. Schropfer, G., Pressecq, F., Rencz, M., Schneider, P., Mita, Y., Charlot, B. & Nouet, P. (編輯). Institute of Electrical and Electronics Engineers Inc., 7161008. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing

Yang, T. S., Chen, G. D., Chen, K. S., Hong, R. C., Chiu, T. C., Wen, C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2015 一月 1, Micro- and Nano-Systems Engineering and Packaging. American Society of Mechanical Engineers (ASME), (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); 卷 10-2015).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)
2016

Design and control of a one-dimensional stage based on elastomeric bearing technology

Teng, Y. C., Chen, K. S. & Chen, Y. C., 2016 十月 7, MESA 2016 - 12th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications - Conference Proceedings. Institute of Electrical and Electronics Engineers Inc., 7587136. (MESA 2016 - 12th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications - Conference Proceedings).

研究成果: Conference contribution

Suppression of motion-induced vibration for a two-DoF system using state feedback control

Lin, W. T., Chen, K-S., Chen, Y. C. & Vechet, S., 2016 十一月 21, Proceedings - 2016 IEEE International Power Electronics and Motion Control Conference, PEMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 775-780 6 p. 7752091. (Proceedings - 2016 IEEE International Power Electronics and Motion Control Conference, PEMC 2016).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

Chen, K. S., Yang, T. S., Hong, R. C., Chiu, T. C., Wen, A. C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2016 七月 15, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Mita, Y., Rencz, M., Charlot, B., Schneider, P., Tas, N., Nouet, P. & Pressecq, F. (編輯). Institute of Electrical and Electronics Engineers Inc., 7514879. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2017

Development of signal transmission and reduction modules for status monitoring and prediction of machine tools

Sun, I. C. & Chen, K. S., 2017 十一月 10, 2017 56th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2017. Institute of Electrical and Electronics Engineers Inc., p. 711-716 6 p. (2017 56th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2017; 卷 2017-November).

研究成果: Conference contribution

Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects

Hsiao, C. L., Yang, C. Y., Chen, H. C., Yang, T. S., Chen, K. S., Wu, T. H., Wang, Y. C. & Lee, S., 2017 七月 1, IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, p. 42-45 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2017-October).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

Process emulation for predicting die shift and wafer warpage in wafer reconstitution

Yang, C. Y., Liu, Y. C., Chen, K. S., Yang, T. S., Wang, Y. C. & Lee, S. S., 2017 九月 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 215-220 6 p. 8046441. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)
2018

A new technique for creating curved interior holes on ultrathin glass based on picosecond laser drilling and thermo-shock separation

Chuang, C. F. & Chen, K. S., 2018 六月 22, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018. Marcelli, R., Mita, Y., Smith, S., Pressecq, F., Nouet, P., Mailly, F. & Schneider, P. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 1-5 5 p. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Damping Enhancement and Positioning Control of Compliant Stages by Incorporating Rubber Shear Dampers

Yula, Y. H., Lee, K. H., Chen, K. S. & Liu, Y. H., 2018 十月 15, 2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018. Institute of Electrical and Electronics Engineers Inc., p. 533-538 6 p. 8492683. (2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018).

研究成果: Conference contribution

Development of dual Wiimote-based 3D localization schemes for mobile robot and quadcopter integration

Zhan, H. Y., Li, T. H., Cheng, C. H., Kuo, S. H. & Chen, K. S., 2018 一月 1, Mechatronics 2017 - Recent Technological and Scientific Advances. Brezina, T. & Jablonski, R. (編輯). Springer Verlag, p. 644-652 9 p. (Advances in Intelligent Systems and Computing; 卷 644).

研究成果: Conference contribution

Impedance Control of Self-Sensing Piezoelectric Actuator for Vibration Suppression

Chang, L. K., Tsai, M. C., Chen, K. S. & Lu, Z. L., 2018 十一月 27, ICEMS 2018 - 2018 21st International Conference on Electrical Machines and Systems. Institute of Electrical and Electronics Engineers Inc., p. 2533-2536 4 p. 8549428. (ICEMS 2018 - 2018 21st International Conference on Electrical Machines and Systems).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Mechanical Properties Characterizations of Elastomer Pads and Control of a 3-DOF Rubber-Bearing Stage

Chen, Y. C., Chen, C. A., Chen, K. S. & Liu, Y. H., 2018 十月 15, 2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018. Institute of Electrical and Electronics Engineers Inc., p. 539-544 6 p. 8492707. (2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018).

研究成果: Conference contribution

Probabilistic reasoning in diagnostic expert system for smart homes

Vechet, S., Krejsa, J., Hrbacek, J. & Chen, K. S., 2018 一月 1, Mechatronics 2017 - Recent Technological and Scientific Advances. Brezina, T. & Jablonski, R. (編輯). Springer Verlag, p. 708-715 8 p. (Advances in Intelligent Systems and Computing; 卷 644).

研究成果: Conference contribution

2019

Design and Realization of a Novel Elastomer Characterization System for Precision Positioning Application

Lin, P. C., Cheng, Y. F. & Chen, K. S., 2019 一月 23, Proceedings of the 2018 18th International Conference on Mechatronics - Mechatronika, ME 2018. Maga, D., Stefek, A. & Brezina, T. (編輯). Institute of Electrical and Electronics Engineers Inc., 8624672. (Proceedings of the 2018 18th International Conference on Mechatronics - Mechatronika, ME 2018).

研究成果: Conference contribution

Finite Element Input Shaping Design for Vibration Suppression of Mechatronics Systems

Chen, W., Chen, K. S. & Tsai, M. C., 2019 五月 24, Proceedings - 2019 IEEE International Conference on Mechatronics, ICM 2019. Institute of Electrical and Electronics Engineers Inc., p. 37-42 6 p. 8722868. (Proceedings - 2019 IEEE International Conference on Mechatronics, ICM 2019).

研究成果: Conference contribution

Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

Yang, C. Y., Chen, K. S., Yang, T. S. G., Chiu, T. C. & Ho, C. J., 2019 四月, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2020

Design and realization of a performance and reliability evaluation module for commercialized anti-lock braking systems

Wu, J. H., Guo, S. H., Chen, K. S. & Tsai, M. C., 2020 一月 1, Mechatronics 2019: Recent Advances Towards Industry 4.0. Szewczyk, R., Nowicki, M., Ostaszewska-Lizewska, A. & Krejsa, J. (編輯). Springer Verlag, p. 237-245 9 p. (Advances in Intelligent Systems and Computing; 卷 1044).

研究成果: Conference contribution