吳 國才

Project Assistant Research Fellow

  • 9 引文
  • 2 h-指數
20152020

Research output per year

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指紋 查看啟用 Kuo-Tsai Wu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。

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研究成果

  • 9 引文
  • 2 h-指數
  • 8 Article
  • 3 Conference contribution

Injection molding process control of servo-hydraulic system

Lin, C. Y., Shen, F. C., Wu, K. T., Lee, H. H. & Hwang, S. J., 2020 一月 1, 於 : Applied Sciences (Switzerland). 10, 1, 71.

研究成果: Article

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  • Adaptive process control of the changeover point for injection molding process

    Chen, Y. S., Wu, K. T., Tsai, M. H., Hwang, S. J., Lee, H. H., Peng, H. S. & Chu, H. Y., 2019 一月 1, (Accepted/In press) 於 : Journal of Low Frequency Noise Vibration and Active Control.

    研究成果: Article

    開啟存取
  • 1 引文 斯高帕斯(Scopus)

    Effects of substrate structure on the warpage of flip chip IC packages

    Lee, Y. S., Lin, P. Y., Wu, K. T., Lee, H. H. & Hwang, S. J., 2019 一月 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 66-70 5 p. 8625738. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2018-October).

    研究成果: Conference contribution

  • Injection Molding Process Control of Servo-Hydraulic System

    Lin, C. Y., Shen, F. C., Wu, K. T., Hwang, S. J. & Lee, H. H., 2019 十月, 2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019. Meen, T-H. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 242-245 4 p. 8942784. (2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019).

    研究成果: Conference contribution

  • 開啟存取
  • 1 引文 斯高帕斯(Scopus)