每年研究成果
每年研究成果
- 4結果
搜尋結果
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2021
Fundamentals of Solder Alloys in 3D Packaging
Lin, K. L., 2021, Springer Series in Advanced Microelectronics. Springer Science and Business Media Deutschland GmbH, p. 329-346 18 p. (Springer Series in Advanced Microelectronics; 卷 64).研究成果: Chapter
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2017
Fundamentals of solder alloys in 3D packaging
Lin, K. L., 2017 1月 1, Springer Series in Advanced Microelectronics. Springer Verlag, p. 205-222 18 p. (Springer Series in Advanced Microelectronics; 卷 57).研究成果: Chapter
3 引文 斯高帕斯（Scopus） -
2012
Electrochemical corrosion behaviour of lead - free solder alloys in 3.5 % Nacl solution
Mohanty, U. S. & Lin, K. L., 2012 9月, Electrodeposition: Properties, Processes and Applications. Nova Science Publishers, Inc., p. 75-100 26 p.研究成果: Chapter
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2011
Electromigration-induced microstructural evolution in lead-free and lead-tin solders
Lin, K. L., 2011 8月, Electromigration in Thin Films and Electronic Devices: Materials and Reliability. Elsevier Ltd, p. 271-284 14 p.研究成果: Chapter