Kwang-Lung Lin

2025

An electromigration study of novel 3D Cu stack-via interconnects for advanced high-density fan-out packaging

Shao, K. J., Chiu, M. C., Liang, C. L., Tsai, M. Y., Lin, Y. S., Wang, C. C., Hung, C. P. & Lin, K. L., 2025 3月 15, 於: Materials Science in Semiconductor Processing. 188, 109256.

研究成果: Article › 同行評審

2024

Microstructure and growth of Cu hillock on redistribution line under electromigration

Huang, Y. C., Tsai, M. Y., Lin, T. C., Lin, Y. S., Hung, C. P. & Lin, K. L., 2024 3月, 於: Journal of Materials Science: Materials in Electronics. 35, 9, 659.

研究成果: Article › 同行評審

2 引文斯高帕斯（Scopus）

The twin formation under electric current stressing and its effect on the properties of copper

Wu, M. F. & Lin, K. L., 2024 7月 1, 於: Journal of Materials Research and Technology. 31, p. 2414-2423 10 p.

研究成果: Article › 同行評審

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2023

Electrorecrystallization of Invar 36 alloy

Huang, J. J. & Lin, K. L., 2023 6月, 於: Materials Today Communications. 35, 106392.

研究成果: Article › 同行評審

1 引文斯高帕斯（Scopus）

Strengthening of Inconel 600 alloy with electric current stressing

Li, W. J. & Lin, K. L., 2023 3月, 於: Materialia. 27, 101666.

研究成果: Article › 同行評審

4 引文斯高帕斯（Scopus）

2022

Non-epitaxial silver nanodendrite growth via helical nano-yarn bundling at intra-dendrite interface under applied bias

Tsai, W. C., Liang, C. L. & Lin, K. L., 2022 4月 15, 於: Scripta Materialia. 212, 114586.

研究成果: Article › 同行評審

1 引文斯高帕斯（Scopus）

Self-assembly growth of electrolytic silver dendrites

Tsai, W. C. & Lin, K. L., 2022 12月, 於: Scientific reports. 12, 1, 4479.

研究成果: Article › 同行評審

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2 引文斯高帕斯（Scopus）

2021

Electromigration-assisted manipulation of microstructure and properties of metals via cyclic direct current stressing treatment

Ku, P. H., Liang, C. L. & Lin, K. L., 2021 4月, 於: Materials Characterization. 174, 110980.

研究成果: Article › 同行評審

12 引文斯高帕斯（Scopus）

Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu

Lin, T. C., Liang, C. L., Wang, S. B., Lin, Y. S., Kao, C. L., Tarng, D. & Lin, K. L., 2021 5月, 於: Scripta Materialia. 197, 113782.

研究成果: Article › 同行評審

21 引文斯高帕斯（Scopus）

2020

A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property

Liao, Y. H., Chen, C. H., Liang, C. L., Lin, K. L. & Wu, A. T., 2020 11月, 於: Acta Materialia. 200, p. 200-210 11 p.

研究成果: Article › 同行評審

39 引文斯高帕斯（Scopus）

Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density

Liang, C. L., Lin, Y. S., Kao, C. L., Tarng, D., Wang, S. B., Hung, Y. C., Lin, G. T. & Lin, K. L., 2020 12月 1, 於: Materials Chemistry and Physics. 256, 123680.

研究成果: Article › 同行評審

21 引文斯高帕斯（Scopus）

Electromigration Reliability of Advanced High-Density Fan-Out Packaging with Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines

Liang, C. L., Lin, Y. S., Kao, C. L., Tarng, D., Wang, S. B., Hung, Y. C., Lin, G. T. & Lin, K. L., 2020 9月, 於: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 9, p. 1438-1445 8 p., 9099960.

研究成果: Article › 同行評審

25 引文斯高帕斯（Scopus）

Electro-work hardening of metals induced by the athermal electromigration effect

Shu, C. C., Liang, C. L. & Lin, K. L., 2020 1月 20, 於: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 772, 138689.

研究成果: Article › 同行評審

24 引文斯高帕斯（Scopus）

Investigations of high-temperature tensile properties of Zn–25Sn–x(0.1–0.2)Cu–y(0.01–0.02)Ti high-temperature Pb-free solders

Lin, J. C., Liang, C. L. & Lin, K. L., 2020 11月, 於: Journal of Materials Science: Materials in Electronics. 31, 21, p. 19318-19331 14 p.

研究成果: Article › 同行評審

1 引文斯高帕斯（Scopus）

Sn/SnO hybrid graphene for thermal interface material and interconnections with Sn hybrid carbon nanotubes

Mittal, J. & Lin, K. L., 2020 3月, 於: Materials Science and Engineering B: Solid-State Materials for Advanced Technology. 253, 114485.

研究成果: Article › 同行評審

4 引文斯高帕斯（Scopus）

2019

Athermal recrystallization behavior of (Sn) solid-solution at an intermetallic-free Cu/Sn interface induced by room temperature electromigration

Liang, C. L. & Lin, K. L., 2019 2月 1, 於: Materials Letters. 236, p. 607-610 4 p.

研究成果: Article › 同行評審

12 引文斯高帕斯（Scopus）

High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders

Chang, C. W. & Lin, K. L., 2019 1月 15, 於: Journal of Electronic Materials. 48, 1, p. 135-141 7 p.

研究成果: Article › 同行評審

13 引文斯高帕斯（Scopus）

Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders

Lin, J. C., Liang, C. L. & Lin, K. L., 2019 9月 23, 於: Materials Science and Engineering A. 765, 138323.

研究成果: Article › 同行評審

8 引文斯高帕斯（Scopus）

Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration

Liang, C. L. & Lin, K. L., 2019 6月 15, 於: Journal of Alloys and Compounds. 789, p. 336-344 9 p.

研究成果: Article › 同行評審

18 引文斯高帕斯（Scopus）

The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders

Guo, W. T., Liang, C. L. & Lin, K. L., 2019 3月 18, 於: Materials Science and Engineering A. 750, p. 117-124 8 p.

研究成果: Article › 同行評審

14 引文斯高帕斯（Scopus）

The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate

Chang, C. W. & Lin, K. L., 2019 7月 30, 於: Journal of Materials Science: Materials in Electronics. 30, 14, p. 13090-13098 9 p.

研究成果: Article › 同行評審

3 引文斯高帕斯（Scopus）

Wetting and IMC Growth Behavior Between Cu Substrate and Zn-25Sn-xCu-yTi High-Temperature Solder Alloys

Sarwono, D. & Lin, K. L., 2019 1月 15, 於: Journal of Electronic Materials. 48, 1, p. 99-106 8 p.

研究成果: Article › 同行評審

5 引文斯高帕斯（Scopus）

2018

Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing

Lin, C. Y., Chiu, T. C. & Lin, K. L., 2018 3月 21, 於: Journal of Applied Physics. 123, 11, 115102.

研究成果: Article › 同行評審

5 引文斯高帕斯（Scopus）

Crystal Structure Variations of Sn Nanoparticles upon Heating

Mittal, J. & Lin, K. L., 2018 4月 1, 於: Journal of Electronic Materials. 47, 4, p. 2394-2401 8 p.

研究成果: Article › 同行評審

3 引文斯高帕斯（Scopus）

Diffusion of elements during reflow ageing of Sn-Zn solder in liquid state on Ni/Cu substrate – theoretical and experimental study

Mittal, J. & Lin, K. L., 2018, 於: Soldering and Surface Mount Technology. 30, 3, p. 137-144 8 p.

研究成果: Article › 同行評審

5 引文斯高帕斯（Scopus）

Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

Chang, C. W. & Lin, K. L., 2018 7月 1, 於: Journal of Materials Science: Materials in Electronics. 29, 13, p. 10962-10968 7 p.

研究成果: Article › 同行評審

8 引文斯高帕斯（Scopus）

Softening of micro Sn electrodeposit by polyethylene glycol (PEG) addition

Chiu, T. C., Chiu, Y. T. & Lin, K. L., 2018 1月, 於: ECS Journal of Solid State Science and Technology. 7, 3, p. P109-P113

研究成果: Article › 同行評審

1 引文斯高帕斯（Scopus）

The amorphous interphase formed in an intermetallic-free Cu/Sn couple during early stage electromigration

Liang, C. L. & Lin, K. L., 2018 10月, 於: Scripta Materialia. 155, p. 58-62 5 p.

研究成果: Article › 同行評審

16 引文斯高帕斯（Scopus）

The interfacial bilayer Cu₆Sn₅ formed in a Sn–Ag–Cu flip-chip solder joint incorporating Au/Pd metallization during solid-state aging

Liang, C. L., Lin, K. L. & Cheng, P. J., 2018 9月 1, 於: Journal of Materials Science: Materials in Electronics. 29, 17, p. 15233-15240 8 p.

研究成果: Article › 同行評審

8 引文斯高帕斯（Scopus）

2017

Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles

Mittal, J. & Lin, K. L., 2017 1月 1, 於: Journal of Electronic Materials. 46, 1, p. 602-608 7 p.

研究成果: Article › 同行評審

5 引文斯高帕斯（Scopus）

Bulk thermal conductivity studies of Sn/SnO coated and filled multiwalled carbon nanotubes for thermal interface material

Mittal, J. & Lin, K. L., 2017 5月 4, 於: Fullerenes Nanotubes and Carbon Nanostructures. 25, 5, p. 301-305 5 p.

研究成果: Article › 同行評審

8 引文斯高帕斯（Scopus）

Current induced rapid phase transformation in Au/Sn reaction couple

Chiu, T. C. & Lin, K. L., 2017, 於: Journal of Alloys and Compounds. 712, p. 111-120 10 p.

研究成果: Article › 同行評審

5 引文斯高帕斯（Scopus）

Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps

Chen, C. W., Chiu, T. C., Chiu, Y. T., Lee, C. W. & Lin, K. L., 2017 6月 1, 於: Intermetallics. 85, p. 117-124 8 p.

研究成果: Article › 同行評審

16 引文斯高帕斯（Scopus）

Effect of Au/Pd bilayer metallization on solder/Cu interfacial reaction and growth kinetics of Cu[sbnd]Sn intermetallic compounds during solid-state aging

Liang, C. L., Lin, K. L. & Cheng, P. J., 2017 6月 15, 於: Surface and Coatings Technology. 319, p. 55-60 6 p.

研究成果: Article › 同行評審

12 引文斯高帕斯（Scopus）

Effects of Al, Pr additions on the wettability and interfacial reaction of Zn–25Sn solder on Cu substrate

Niu, X. & Lin, K. L., 2017 1月 1, 於: Journal of Materials Science: Materials in Electronics. 28, 1, p. 105-113 9 p.

研究成果: Article › 同行評審

13 引文斯高帕斯（Scopus）

Non-deformation recrystallization of metal with electric current stressing

Liang, P. C. & Lin, K. L., 2017, 於: Journal of Alloys and Compounds. 722, p. 690-697 8 p.

研究成果: Article › 同行評審

38 引文斯高帕斯（Scopus）

The dissolution and reprecipitation behavior of the AuSn₄ intermetallic compound in a solder joint during liquid-state and solid-state reactions

Liang, C. L., Lin, K. L. & Cheng, P. J., 2017 10月 1, 於: Journal of Materials Science. 52, 19, p. 11659-11667 9 p.

研究成果: Article › 同行評審

12 引文斯高帕斯（Scopus）

The mechanism of an increase in electrical resistance in Al thin film induced by current stressing

Liang, C. L., Lee, S. W. & Lin, K. L., 2017 8月 31, 於: Thin Solid Films. 636, p. 164-170 7 p.

研究成果: Article › 同行評審

28 引文斯高帕斯（Scopus）

2016

Disruption of crystalline structure of Sn3.5Ag induced by electric current

Huang, H. C., Lin, K. L. & Wu, A. T., 2016 3月 21, 於: Journal of Applied Physics. 119, 11, 115102.

研究成果: Article › 同行評審

21 引文斯高帕斯（Scopus）

Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu

Huang, W. C. & Lin, K. L., 2016 12月 1, 於: Journal of Electronic Materials. 45, 12, p. 6137-6142 6 p.

研究成果: Article › 同行評審

9 引文斯高帕斯（Scopus）

The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing

Hsiao, Y. H. & Lin, K. L., 2016 3月 1, 於: Journal of Materials Science: Materials in Electronics. 27, 3, p. 2201-2205 5 p.

研究成果: Article › 同行評審

17 引文斯高帕斯（Scopus）

The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Huang, W. H., Lin, K. L., Lin, Y. W. & Cheng, Y. K., 2016 12月 1, 於: Journal of Electronic Materials. 45, 12, p. 6130-6136 7 p.

研究成果: Article › 同行評審

11 引文斯高帕斯（Scopus）

The microstructure and mechanical properties of Zn-25Sn-XAl (X=0–0.09 wt%) high temperature lead free solder

Niu, X. & Lin, K. L., 2016 11月 20, 於: Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing. 677, p. 384-392 9 p.

研究成果: Article › 同行評審

23 引文斯高帕斯（Scopus）

2015

Electro-dissolution of the Bi second phase in Sn5Bi solder alloy

Chiu, T. C., Chiu, Y. T. & Lin, K. L., 2015 12月 1, 於: Materials Letters. 160, p. 309-313 5 p.

研究成果: Article › 同行評審

10 引文斯高帕斯（Scopus）

Exothermic low temperature sintering of Cu nanoparticles

Mittal, J. & Lin, K. L., 2015 11月 1, 於: Materials Characterization. 109, p. 19-24 6 p.

研究成果: Article › 同行評審

30 引文斯高帕斯（Scopus）

High dislocation density of tin induced by electric current

Liao, Y. H., Liang, C. L., Lin, K. L. & Wu, A. T., 2015 12月 1, 於: AIP Advances. 5, 12, 127210.

研究成果: Article › 同行評審

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31 引文斯高帕斯（Scopus）

Investigations of the wetting behaviors of Zn-25Sn, Zn-25Sn-XPr and Zn-25Sn-YAl high temperature lead free solders in air and Ar ambient

Niu, X. & Lin, K. L., 2015 7月 6, 於: Journal of Alloys and Compounds. 646, p. 852-858 7 p., 34592.

研究成果: Article › 同行評審

17 引文斯高帕斯（Scopus）

Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints

Liang, C. L., Lin, K. L. & Peng, J. W., 2015 9月 30, (Accepted/In press) 於: Journal of Electronic Materials.

研究成果: Article › 同行評審

Synthesis and Characterization of Sn Coating on MWCNT Using DBA as a Capping Agent

Frischa, M. W. & Lin, K. L., 2015 10月 28, (Accepted/In press) 於: Journal of Electronic Materials.

研究成果: Article › 同行評審

The atomic behavior during heating in the amorphous diffusion nanolayer between Cu and solder

Pan, C. C., Lin, Y. W., Lin, C. I., Mittal, J. & Lin, K. L., 2015 12月 15, 於: Journal of Non-Crystalline Solids. 430, p. 38-42 5 p., 17594.

研究成果: Article › 同行評審

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