Kwang-Lung Lin - 研究成果 - 國立成功大學

查看斯高帕斯 (Scopus) 概要

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每年研究成果

233 Article
32 Conference contribution
6 Conference article
4 Chapter
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6結果

篩選

2005
The bonding of Sn-Zn-Ag-Al-Ga lead-free solder balls on Cu/Ni-P/Au BGA substrate
Lin, K-L. & Chiu, Y. T., 2005 9月 19, 於: Proceedings - Electronic Components and Technology Conference. 1, p. 692-695 4 p.
研究成果: Conference article › 同行評審
3 引文斯高帕斯（Scopus）
2004
Wetting interaction between Pb-free Sn-Zn series solders and Cu, Ag substrates
Lin, K. L., Liu, P. C. & Song, J. M., 2004, 於: Proceedings - Electronic Components and Technology Conference. 2, p. 1310-1313 4 p.
研究成果: Conference article › 同行評審
12 引文斯高帕斯（Scopus）
2003
Improvement in the properties of Sn-Zn eutectic based Pb-free solder
Lin, K. L., Chen, K. I., Hsu, H. M. & Shi, C. L., 2003, 於: Proceedings - Electronic Components and Technology Conference. p. 658-663 6 p.
研究成果: Conference article › 同行評審
18 引文斯高帕斯（Scopus）
2000
Fabrication and adhesion of low stress electroless Ni-Cu-P bump on copper pad
Chen, C. J. & Lin, K. L., 2000 12月 1, 於: Proceedings - Electronic Components and Technology Conference. p. 874-877 4 p.
研究成果: Conference article › 同行評審
4 引文斯高帕斯（Scopus）
1999
Shearing strength and materials interaction during reflow of Al/Cu/electroless nickel/solder bump
Lin, K. L. & Liu, Y. C., 1999, 於: Proceedings - Electronic Components and Technology Conference. p. 607-612 6 p.
研究成果: Conference article › 同行評審
12 引文斯高帕斯（Scopus）
1985
EFFECTS OF PLATING VARIABLES AND ADDITIVES ON THE INITIAL STAGE OF GOLD ELECTRODEPOSITION.
Lin, K., Weil, R. & Desai, K., 1985, 於: Electrochemical Society Extended Abstracts. 85-2, p. 348-349 2 p.
研究成果: Conference article › 同行評審