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查看斯高帕斯 (Scopus) 概要
黃 聖杰
教授
機械工程學系
電話
886 6 2757575 ext 62184
電子郵件
jimppl
mail.ncku.edu
tw
網站
http://www.me.ncku.edu.tw/~pplweb/
h-index
1879
引文
23
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
1990 …
2026
每年研究成果
概覽
指紋
網路
專案
(39)
研究成果
(164)
類似的個人檔案
(6)
監製作品
(25)
指紋
查看啟用 Sheng-Jye Hwang 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Engineering
Injection Moulding
100%
Injection Moulding Process
57%
Process Parameter
54%
Molding Machine
53%
Fiber Orientation
46%
Integrated Circuit
46%
Sheet Molding Compounds
45%
Simulation Result
40%
Fiber Length
35%
Induction Heating
33%
Ultimate Tensile Strength
32%
Underfill
30%
Mold Filling
30%
Nozzle Pressure
30%
Fluid Viscosity
27%
Process Control
26%
Ball Grid Arrays
23%
Cure Shrinkage
22%
Reinforced Plastic
22%
Coupling Effect
22%
System-in-Package
22%
Clamping Force
20%
Fiber Orientation Distribution
20%
Heating Surface
20%
Product Quality
19%
Heating System
18%
Magnetic Flux Concentrator
18%
Product Weight
18%
Deposition Process
17%
Experimental Result
17%
Injection Molded Part
16%
Flow Direction
16%
Moulded Part
15%
Long Fiber
15%
Control System
15%
Image Sensor
15%
Proton-Exchange Membrane Fuel Cells
15%
Humidification
15%
Turbine
15%
Core Motor
15%
Servomotors
15%
Experimental Investigation
15%
Hydraulic System
15%
Hydrokinetic Turbine
15%
Microstructure
15%
Quality Control
15%
Moulding Process
15%
Compression Molding
15%
Thin Films
14%
Injection Speed
14%
Material Science
Sheet Molding Compounds
75%
Thermoplastics
66%
Fiber Reinforced Material
64%
Thermal Expansion
63%
Injection Molding
55%
Electronic Circuit
52%
Composite Material
46%
Glass Fiber
35%
Ultimate Tensile Strength
33%
Thin Films
30%
Polypropylene
30%
Finite Element Method
28%
Cure Process
23%
Microstructure
22%
Residual Stress
22%
Flow Analysis
20%
Film
18%
Surface (Surface Science)
18%
Tensile Property
16%
Taguchi Method
15%
Compressibility
15%
Reinforced Plastic
15%
Three Dimensional Printing
15%
Compression Molding
15%
Fatigue of Materials
12%
Elastic Moduli
12%
Differential Scanning Calorimetry
11%
Fiber-Reinforced Composite
11%
Viscoelastic Behavior
11%
Density
11%
Stress Analysis
11%
Thermal Stress
11%
Carbon Fiber
11%
Liquid Crystal Display
10%
Material Processing
9%
Surface Energy
8%
Process Simulation
7%
Directed Energy Deposition
7%
Matrix Composite
7%
Amorphous Silicon
7%
Energy Density
7%
Metal Hydride
7%
Tumor
7%
Fiber Type
7%
Nitride Compound
7%
Thin-Film Transistor
7%
Thermomechanical Loads
7%
Thermal Analysis
7%
Metal Oxide
7%
304 Stainless Steel
7%
Keyphrases
Warpage
40%
Injection Molding Process
30%
Epoxy Molding Compound
27%
IC Packaging
26%
Servo-hydraulic System
22%
Adhesion Force
22%
PV-T
19%
Volume Shrinkage
16%
Encapsulation Techniques
15%
Process Control
15%
Wire Sweep
15%
Flip chip Ball Grid Array
15%
Polyurethane Injection
15%
Injection Molding Machine
15%
Underfill Flow
15%
Filling Process
14%
Isobaric
13%
Capillary Underfill
12%
Pressure Curve
12%
Numerical Simulation
12%
Adhesion
12%
Underfill Process
11%
Cure Shrinkage
10%
Clamping System
10%
Moldex3D
9%
Shift Factor
9%
Spiral Flow
9%
Injection Parts
9%
Chromium Nitride Coating
9%
Materials Processing
9%
Pressure Distribution
9%
Long Fiber Thermoplastic
9%
Process Simulation
9%
Injection Molding
8%
Microstructure
8%
Warpage Analysis
8%
Adhesion Mechanism
8%
Fiber Orientation Distribution
8%
Flip-chip Package
8%
Microstructure Fiber
7%
Configuration Synthesis
7%
Bipolar Plate
7%
Gas-atomized
7%
Metal Additive Manufacturing
7%
Atomization Pressure
7%
Design Requirements
7%
Additive Manufacturing Process
7%
Savonius
7%
Placement Angle
7%
Blade Arc Angle
7%
