• 876 引文
  • 15 h-指數
1990 …2020

每年研究成果

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研究成果

2020
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Injection molding process control of servo-hydraulic system

Lin, C. Y., Shen, F. C., Wu, K. T., Lee, H. H. & Hwang, S. J., 2020 一月 1, 於 : Applied Sciences (Switzerland). 10, 1, 71.

研究成果: Article

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2019

Adaptive process control of the changeover point for injection molding process

Chen, Y. S., Wu, K. T., Tsai, M. H., Hwang, S. J., Lee, H. H., Peng, H. S. & Chu, H. Y., 2019 一月 1, (Accepted/In press) 於 : Journal of Low Frequency Noise Vibration and Active Control.

研究成果: Article

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1 引文 斯高帕斯(Scopus)
3 引文 斯高帕斯(Scopus)

Effects of substrate structure on the warpage of flip chip IC packages

Lee, Y. S., Lin, P. Y., Wu, K. T., Lee, H. H. & Hwang, S. J., 2019 一月 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 66-70 5 p. 8625738. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2018-October).

研究成果: Conference contribution

Injection Molding Process Control of Servo-Hydraulic System

Lin, C. Y., Shen, F. C., Wu, K. T., Hwang, S. J. & Lee, H. H., 2019 十月, 2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019. Meen, T-H. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 242-245 4 p. 8942784. (2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019).

研究成果: Conference contribution

Investigation on the P-V-T-C property characterization and its importance on IC encapsulation material application

Wang, C. C., Huang, C. T., Hsu, C. C., Chang, R. Y., Huang, R., Huang, M. F. & Hwang, S. J., 2019 二月 6, Proceedings of PPS-34: 34th International Conference of the Polymer Processing Society - Conference Papers. Liu, S-J. (編輯). American Institute of Physics Inc., 020006. (AIP Conference Proceedings; 卷 2065).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Observation of fiber orientation in injection molded long-fiber reinforced composites

Aditya, R., Hwang, S. J. & Lee, H. H., 2019 二月 6, Proceedings of PPS-34: 34th International Conference of the Polymer Processing Society - Conference Papers. Liu, S-J. (編輯). American Institute of Physics Inc., 030029. (AIP Conference Proceedings; 卷 2065).

研究成果: Conference contribution

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1 引文 斯高帕斯(Scopus)

Study of the effect of process parameters on fiber length, fiber orientation and tensile strength of long glass fiber reinforced polypropylene molding

Huang, P. W., Peng, H. S., Hwang, S. J., Huang, C. T., Chen, P. C., Ke, Y. Y., Pan, P. S., Wu, C. C. & Tu, C. I., 2019 一月 1.

研究成果: Paper

Study on the influences on fiber micro-structure variations and the connection to final shrinkage/warpage on long fiber reinforced thermoplastics (FRT) parts

Huang, C. T., Hsu, C., Yeh, C. E., Chen, Y. S., Hwang, S. J., Peng, H. S., Wu, C. C. & Tu, C. I., 2019 二月 6, Proceedings of PPS-34: 34th International Conference of the Polymer Processing Society - Conference Papers. Liu, S-J. (編輯). American Institute of Physics Inc., 030023. (AIP Conference Proceedings; 卷 2065).

研究成果: Conference contribution

2018
2 引文 斯高帕斯(Scopus)

Finite element analysis of multi-level interconnection under cyclic thermomechanical loads

Wu, K. T., Hwang, S. J., Lee, H. H. & Lin, B. Y., 2018 二月 1, 於 : Microsystem Technologies. 24, 2, p. 1003-1016 14 p.

研究成果: Article

Geometrical effects on fiber micro-structure variations and the influences on long Fiber Reinforced Thermoplastics (FRT) parts

Huang, C. T., Hsu, C., Chen, Y. S., Hwang, S. J., Peng, H. S., Wu, C. C. & Tu, C. I., 2018 一月 1.

研究成果: Paper

2 引文 斯高帕斯(Scopus)
4 引文 斯高帕斯(Scopus)

Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

Wu, K. T., Hwang, S. J. & Lee, H. H., 2017 八月 1, 於 : Journal of Electronic Materials. 46, 8, p. 5094-5106 13 p.

研究成果: Article

1 引文 斯高帕斯(Scopus)

Study on the micro-structures of long fiber through runner and cavity in injection molding for reinforced thermoplastics (FRT)

Huang, C. T., Peng, X. L., Hwang, S. J., Tseng, H. C. & Chang, R. Y., 2017 一月 1, 75th Annual Technical Conference and Exhibition of the Society of Plastics Engineers, SPE ANTEC Anaheim 2017. Society of Plastics Engineers, p. 766-771 6 p. (Annual Technical Conference - ANTEC, Conference Proceedings; 卷 2017-May).

研究成果: Conference contribution

2016

Design with white light-emitting diodes for an automotive low-beam projector headlamp

Chiang, Y. Y., Hwang, S. J., Lee, H. H., Hwang, D. Y. & Liao, C. C., 2016 一月 1, 於 : Sensors and Materials. 28, 9, p. 1035-1042 8 p.

研究成果: Article

1 引文 斯高帕斯(Scopus)
27 引文 斯高帕斯(Scopus)
5 引文 斯高帕斯(Scopus)

Investigation of fiber breakage phenomena for different fiber types in injection molding

Huang, C. T., Tseng, H. C., Chang, R. Y. & Hwang, S. J., 2016 一月 1, ANTEC 2016 - Proceedings of the Annual Technical Conference and Exhibition of the Society of Plastics Engineers. Society of Plastics Engineers, p. 1120-1125 6 p. (Annual Technical Conference - ANTEC, Conference Proceedings).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)
2015
3 引文 斯高帕斯(Scopus)
2 引文 斯高帕斯(Scopus)
3 引文 斯高帕斯(Scopus)
29 引文 斯高帕斯(Scopus)

Simulation of film structures for CMOS image sensors

Wu, K. T., Hwang, S. J. & Tsai, W. M., 2015 十二月 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 365-368 4 p. 7365252. (2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings).

研究成果: Conference contribution

8 引文 斯高帕斯(Scopus)
7 引文 斯高帕斯(Scopus)
2014
2 引文 斯高帕斯(Scopus)
11 引文 斯高帕斯(Scopus)

Study on induction heating coil for uniform mold cavity surface heating

Sung, Y. T., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2014 二月 14, 於 : Advances in Mechanical Engineering. 2014, 349078.

研究成果: Article

4 引文 斯高帕斯(Scopus)

The effect of humidification and temperature difference between PEMFC membrane to water transport phenomena

Huang, K. J., Hwang, S. J. & Lai, W. H., 2014 一月 1, 20th World Hydrogen Energy Conference, WHEC 2014. Committee of WHEC2014, p. 246-252 7 p. (20th World Hydrogen Energy Conference, WHEC 2014; 卷 1).

研究成果: Conference contribution

Thermal simulation of System in Package (SiP) in soak zone of reflow process

Deng, S. S., Hwang, S. J. & Lee, H. H., 2014 一月 1, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 238-241 4 p. 7048402. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

研究成果: Conference contribution

2013

Design and development of oral appliance for obstructive sleep apnea

Lai, Y. B., Huang, D. Y., Hwang, S-J., Lee, H-H. & Chang, Y. S., 2013 二月 20, Innovation for Applied Science and Technology. p. 1540-1546 7 p. (Applied Mechanics and Materials; 卷 284-287).

研究成果: Conference contribution

Design and fabrication of an adhesion force tester for the injection moulding process

Chen, J. Y. & Hwang, S. J., 2013 一月 1, 於 : Polymer Testing. 32, 1, p. 22-31 10 p.

研究成果: Article

9 引文 斯高帕斯(Scopus)

Molded underfill for flip chip package

Chen, Y. K., Wu, G. T., Hwang, S-J., Lee, H-H. & Hwang, D. Y., 2013 十二月 1, 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013 - Proceedings. p. 310-314 5 p. 6706663. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)
42 引文 斯高帕斯(Scopus)
2012

Design of induction heating module for uniform cavity surface heating

Sung, Y. T., Lin, Y. N., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2012 一月 1, 70th Annual Technical Conference of the Society of Plastics Engineers 2012, ANTEC 2012. Society of Plastics Engineers, p. 1427-1436 10 p. (Annual Technical Conference - ANTEC, Conference Proceedings; 卷 2).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)