Pei, C. C.,
Su, F.,
Hwang, S-J.,
Huang, D. Y. &
Lee, H-H.,
2002 1月 1,
2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc.,
p. 160-165 6 p. 990380. (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).
研究成果: Conference contribution