• 876 引文
  • 15 h-指數
1990 …2020

每年研究成果

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研究成果

篩選
Conference contribution
2019

Effects of substrate structure on the warpage of flip chip IC packages

Lee, Y. S., Lin, P. Y., Wu, K. T., Lee, H. H. & Hwang, S. J., 2019 一月 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 66-70 5 p. 8625738. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2018-October).

研究成果: Conference contribution

Injection Molding Process Control of Servo-Hydraulic System

Lin, C. Y., Shen, F. C., Wu, K. T., Hwang, S. J. & Lee, H. H., 2019 十月, 2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019. Meen, T-H. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 242-245 4 p. 8942784. (2019 IEEE Eurasia Conference on IOT, Communication and Engineering, ECICE 2019).

研究成果: Conference contribution

Investigation on the P-V-T-C property characterization and its importance on IC encapsulation material application

Wang, C. C., Huang, C. T., Hsu, C. C., Chang, R. Y., Huang, R., Huang, M. F. & Hwang, S. J., 2019 二月 6, Proceedings of PPS-34: 34th International Conference of the Polymer Processing Society - Conference Papers. Liu, S-J. (編輯). American Institute of Physics Inc., 020006. (AIP Conference Proceedings; 卷 2065).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Observation of fiber orientation in injection molded long-fiber reinforced composites

Aditya, R., Hwang, S. J. & Lee, H. H., 2019 二月 6, Proceedings of PPS-34: 34th International Conference of the Polymer Processing Society - Conference Papers. Liu, S-J. (編輯). American Institute of Physics Inc., 030029. (AIP Conference Proceedings; 卷 2065).

研究成果: Conference contribution

Study on the influences on fiber micro-structure variations and the connection to final shrinkage/warpage on long fiber reinforced thermoplastics (FRT) parts

Huang, C. T., Hsu, C., Yeh, C. E., Chen, Y. S., Hwang, S. J., Peng, H. S., Wu, C. C. & Tu, C. I., 2019 二月 6, Proceedings of PPS-34: 34th International Conference of the Polymer Processing Society - Conference Papers. Liu, S-J. (編輯). American Institute of Physics Inc., 030023. (AIP Conference Proceedings; 卷 2065).

研究成果: Conference contribution

2017

Study on the micro-structures of long fiber through runner and cavity in injection molding for reinforced thermoplastics (FRT)

Huang, C. T., Peng, X. L., Hwang, S. J., Tseng, H. C. & Chang, R. Y., 2017 一月 1, 75th Annual Technical Conference and Exhibition of the Society of Plastics Engineers, SPE ANTEC Anaheim 2017. Society of Plastics Engineers, p. 766-771 6 p. (Annual Technical Conference - ANTEC, Conference Proceedings; 卷 2017-May).

研究成果: Conference contribution

2016

Investigation of fiber breakage phenomena for different fiber types in injection molding

Huang, C. T., Tseng, H. C., Chang, R. Y. & Hwang, S. J., 2016 一月 1, ANTEC 2016 - Proceedings of the Annual Technical Conference and Exhibition of the Society of Plastics Engineers. Society of Plastics Engineers, p. 1120-1125 6 p. (Annual Technical Conference - ANTEC, Conference Proceedings).

研究成果: Conference contribution

2015

Simulation of film structures for CMOS image sensors

Wu, K. T., Hwang, S. J. & Tsai, W. M., 2015 十二月 23, 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 365-368 4 p. 7365252. (2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings).

研究成果: Conference contribution

2014

The effect of humidification and temperature difference between PEMFC membrane to water transport phenomena

Huang, K. J., Hwang, S. J. & Lai, W. H., 2014 一月 1, 20th World Hydrogen Energy Conference, WHEC 2014. Committee of WHEC2014, p. 246-252 7 p. (20th World Hydrogen Energy Conference, WHEC 2014; 卷 1).

研究成果: Conference contribution

Thermal simulation of System in Package (SiP) in soak zone of reflow process

Deng, S. S., Hwang, S. J. & Lee, H. H., 2014 一月 1, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 238-241 4 p. 7048402. (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings).

研究成果: Conference contribution

2013

Design and development of oral appliance for obstructive sleep apnea

Lai, Y. B., Huang, D. Y., Hwang, S-J., Lee, H-H. & Chang, Y. S., 2013 二月 20, Innovation for Applied Science and Technology. p. 1540-1546 7 p. (Applied Mechanics and Materials; 卷 284-287).

研究成果: Conference contribution

Molded underfill for flip chip package

Chen, Y. K., Wu, G. T., Hwang, S-J., Lee, H-H. & Hwang, D. Y., 2013 十二月 1, 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013 - Proceedings. p. 310-314 5 p. 6706663. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)
2012

Design of induction heating module for uniform cavity surface heating

Sung, Y. T., Lin, Y. N., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2012 一月 1, 70th Annual Technical Conference of the Society of Plastics Engineers 2012, ANTEC 2012. Society of Plastics Engineers, p. 1427-1436 10 p. (Annual Technical Conference - ANTEC, Conference Proceedings; 卷 2).

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

Development of liquid spray process in a rapid prototyping machine

Huang, C. H., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2012 十一月 26, Advanced Manufacturing Focusing on Multi-Disciplinary Technologies. p. 365-375 11 p. (Advanced Materials Research; 卷 579).

研究成果: Conference contribution

Effects of compression distribution on PEMFC stacks using reformate as fuel

Huang, K. J., Chen, C. Y., Hwang, S. J. & Lai, W. H., 2012 一月 1, WHEC 2012 Conference Proceedings - 19th World Hydrogen Energy Conference. Elsevier Ltd, p. 234-243 10 p. (Energy Procedia; 卷 29).

研究成果: Conference contribution

2011

Characterization of fine-pitch solder bump joint and package warpage for low K high-pin-count flip-chip BGA through Shadow Moiré and Micro Moiré techniques

Liu, A. H., Wang, D. W., Huang, H. M., Sun, M., Lin, M. R., Zhong, C., Hwang, S. J. & Lu, H. H., 2011 七月 21, 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011. p. 431-440 10 p. 5898547. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

5 引文 斯高帕斯(Scopus)

Correlation between Shadow Moiré and Micro Moiré techniques through characterization of flip-chip BGA

Liu, A. H., Wang, D. W., Huang, H. M., Sun, M., Lin, M. R., Zhong, C., Hwang, S. J., Lu, H. H., Bui, H. T. & Deng, S. S., 2011 十二月 1, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. p. 269-272 4 p. 6117261. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

研究成果: Conference contribution

Design of induction heating module for uniform cavity surface heating

Sung, Y. T., Lin, Y. N., Hwang, S. J., Lee, H. H. & Huang, D. Y., 2011 一月 1, 69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011. Society of Plastics Engineers, p. 2054-2057 4 p. (Annual Technical Conference - ANTEC, Conference Proceedings; 卷 3).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

Development of an apparatus for measuring normal adhesion force during TPU injection molding process

Chen, J. Y., Hwang, S. J., Lee, H. H. & Huang, D. Y., 2011 八月 23, 69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011. p. 1512-1517 6 p. (Annual Technical Conference - ANTEC, Conference Proceedings; 卷 2).

研究成果: Conference contribution

On mold corner effects of EMC adhesion for IC encapsulation process

Yeh, C. H., Deng, C. H., Lee, H. H., Hwang, S. J. & Huang, D. Y., 2011 十二月 1, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011. p. 280-283 4 p. 6117263. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT).

研究成果: Conference contribution

2010

Copper plating process for through silicon via with high aspect ratio in advanced packaging

Huang, Y. H., Lee, H-H., Hwang, S-J. & Huang, D. Y., 2010 六月 25, Proceedings of the ASME InterPack Conference 2009, IPACK2009. p. 9-14 6 p. (Proceedings of the ASME InterPack Conference 2009, IPACK2009; 卷 1).

研究成果: Conference contribution

Warpage simulations with P-V-T-C equation and experiments of fan-out wafer level package after encapsulation process

Deng, S. S., Hwang, S-J., Lee, H-H., Huang, D. Y. & Shen, G. S., 2010 十二月 1, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699590. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2009

Simulation and analysis of fiber orientation in injection molded bipolar plates for fuel cell

Lin, Y. J., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2009, 67th Annual Technical Conference of the Society of Plastics Engineers 2009, ANTEC 2009. 卷 4. p. 2092-2097 6 p.

研究成果: Conference contribution

Simulation and experiments of fan-out wafer level package during encapsulation

Deng, S. S., Hwang, S-J., Lee, H-H., Huang, D. Y., Chen, Y. R. & Shen, G. S., 2009 十二月 1, IMPACT Conference 2009 International 3D IC Conference - Proceedings. p. 48-51 4 p. 5382306. (IMPACT Conference 2009 International 3D IC Conference - Proceedings).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)
2008

Application of dynamic masking on rapid prototyping

Chen, C. N., Hwang, S. J., Lee, H. H. & Huang, D. Y., 2008 一月 1, Advanced Manufacture: Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture. Trans Tech Publications Ltd, p. 261-272 12 p. (Materials Science Forum; 卷 594).

研究成果: Conference contribution

Post-mold cure process simulation of IC packaging

Shue, C. H., Hwang, S. J., Lee, H. H., Huang, D. Y. & Lee, Y. J., 2008 十二月 1, 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008. p. 106-110 5 p. 4784241. (2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

The 3D printer design and model formation by a commercial inkjet printing module

Cheng, C. I., Chen, C. H., Lai, W. H., Hwang, S. J. & Lee, S. Y., 2008 一月 1, Advanced Manufacture: Focusing on New and Emerging Technologies - Selected, peer Reviewed Papers from the 2007 International Conference on Advanced Manufacture. Trans Tech Publications Ltd, p. 500-506 7 p. (Materials Science Forum; 卷 594).

研究成果: Conference contribution

2007

Control of hot runner type micro injection molding module

Yang, C. C., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2007 十二月 1, Proceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON. p. 2928-2933 6 p. 4460054. (IECON Proceedings (Industrial Electronics Conference)).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

Mold adhesion force measurement

Lee, H-H., Hwang, S-J., Huang, D. Y. & Lin, Y. J., 2007 十二月 1, 2007 Proceedings of the ASME InterPack Conference, IPACK 2007. p. 51-58 8 p. (2007 Proceedings of the ASME InterPack Conference, IPACK 2007; 卷 1).

研究成果: Conference contribution

Prediction of flow induced lead deflection of leadframe assemblies in plastic encapsulation during molding

Chen, J. Y., Teng, S. Y., Hwang, S. J., Lee, H. H., Huang, D. Y., Lin, Y. J., Chen, S., Shen, G. S. & Wu, L., 2007 十二月 1, Proceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT. 4441395. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

研究成果: Conference contribution

Structure deformation of leadframe in plastic encapsulation

Shen, G. S., Lee, Y. J., Lin, Y. J., Chen, J. Y. & Hwang, S-J., 2007 十二月 1, Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. p. 83-87 5 p. 4433573. (Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

The development of paddle shift analysis for IC packaging processing

Chen, S., Shen, G. S., Chen, J. Y., Teng, S. Y., Hwang, S-J., Lin, Y. J., Lee, H-H. & Huang, D. Y., 2007 十二月 1, Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07. 4283565. (Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)
2006

Geometry influence of reflectors for infrared rapid heating on micro-injection molding

Chang, P. C. & Hwang, S. J., 2006 一月 1, Progress on Advanced Manufacture for Micro/Nano Technology 2005 - Proceedings of the 2005 International Conference on Advanced Manufacture. PART 2 編輯 Trans Tech Publications Ltd, p. 1261-1266 6 p. (Materials Science Forum; 卷 505-507, 編號 PART 2).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

Prediction of process induced warpage of electronic package by P-V-T-C equation and Taguchi method

Chen, J. Y., Teng, S. Y., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2006 十二月 1, 2006 International Conference on Electronic Materials and Packaging, EMAP. 4430640. (2006 International Conference on Electronic Materials and Packaging, EMAP).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)
2005

Design and fabrication of an all-electric tiebarless injection molding machine

Wang, Y. D., Chang, P. Q., Wu, Y. F., Hwang, S. J., Hwang, D. Y. & Cheng, R. W., 2005 十二月 1, Proceedings of the 2005 IEEE International Conference on Mechatronics, ICM '05. p. 783-787 5 p. 1529361. (Proceedings of the 2005 IEEE International Conference on Mechatronics, ICM '05; 卷 2005).

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging

Teng, S. Y. & Hwang, S-J., 2005 十二月 1, Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. p. 867-872 6 p. (Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005; 卷 PART B).

研究成果: Conference contribution

2004

Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging

Hong, L. C., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2004 十二月 1, 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics. p. 78-84 7 p. (2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics).

研究成果: Conference contribution

6 引文 斯高帕斯(Scopus)
2002

Effects of process parameters on the mold adhesion force in IC encapsulation process

Hwang, S-J., Lee, H-H., Chuang, C. H. & Huang, D. Y., 2002 一月 1, 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., p. 166-171 6 p. 990381. (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

Wire density effect on wire sweep analysis for IC packaging

Pei, C. C., Su, F., Hwang, S-J., Huang, D. Y. & Lee, H-H., 2002 一月 1, 2002 Proceedings - 8th International Advanced Packaging Materials Symposium. Institute of Electrical and Electronics Engineers Inc., p. 160-165 6 p. 990380. (2002 Proceedings - 8th International Advanced Packaging Materials Symposium).

研究成果: Conference contribution

5 引文 斯高帕斯(Scopus)