• 876 引文
  • 15 h-指數
1990 …2020

每年研究成果

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研究成果

篩選
Article
2020
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Injection molding process control of servo-hydraulic system

Lin, C. Y., Shen, F. C., Wu, K. T., Lee, H. H. & Hwang, S. J., 2020 一月 1, 於 : Applied Sciences (Switzerland). 10, 1, 71.

研究成果: Article

開啟存取
2019

Adaptive process control of the changeover point for injection molding process

Chen, Y. S., Wu, K. T., Tsai, M. H., Hwang, S. J., Lee, H. H., Peng, H. S. & Chu, H. Y., 2019 一月 1, (Accepted/In press) 於 : Journal of Low Frequency Noise Vibration and Active Control.

研究成果: Article

開啟存取
1 引文 斯高帕斯(Scopus)
3 引文 斯高帕斯(Scopus)
開啟存取
1 引文 斯高帕斯(Scopus)
2018
2 引文 斯高帕斯(Scopus)

Finite element analysis of multi-level interconnection under cyclic thermomechanical loads

Wu, K. T., Hwang, S. J., Lee, H. H. & Lin, B. Y., 2018 二月 1, 於 : Microsystem Technologies. 24, 2, p. 1003-1016 14 p.

研究成果: Article

2 引文 斯高帕斯(Scopus)
4 引文 斯高帕斯(Scopus)

Mechanism of Void Prediction in Flip Chip Packages with Molded Underfill

Wu, K. T., Hwang, S. J. & Lee, H. H., 2017 八月 1, 於 : Journal of Electronic Materials. 46, 8, p. 5094-5106 13 p.

研究成果: Article

1 引文 斯高帕斯(Scopus)
2016

Design with white light-emitting diodes for an automotive low-beam projector headlamp

Chiang, Y. Y., Hwang, S. J., Lee, H. H., Hwang, D. Y. & Liao, C. C., 2016 一月 1, 於 : Sensors and Materials. 28, 9, p. 1035-1042 8 p.

研究成果: Article

1 引文 斯高帕斯(Scopus)
27 引文 斯高帕斯(Scopus)
5 引文 斯高帕斯(Scopus)
4 引文 斯高帕斯(Scopus)
2015
3 引文 斯高帕斯(Scopus)
2 引文 斯高帕斯(Scopus)
3 引文 斯高帕斯(Scopus)
29 引文 斯高帕斯(Scopus)
8 引文 斯高帕斯(Scopus)
7 引文 斯高帕斯(Scopus)
2014
2 引文 斯高帕斯(Scopus)
11 引文 斯高帕斯(Scopus)

Study on induction heating coil for uniform mold cavity surface heating

Sung, Y. T., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2014 二月 14, 於 : Advances in Mechanical Engineering. 2014, 349078.

研究成果: Article

4 引文 斯高帕斯(Scopus)
2013

Design and fabrication of an adhesion force tester for the injection moulding process

Chen, J. Y. & Hwang, S. J., 2013 一月 1, 於 : Polymer Testing. 32, 1, p. 22-31 10 p.

研究成果: Article

9 引文 斯高帕斯(Scopus)
42 引文 斯高帕斯(Scopus)
2012
9 引文 斯高帕斯(Scopus)
2011

Modeling of viscoelastic behavior of an epoxy molding compound during and after curing

Lin, Y. J., Hwang, S. J., Lee, H. H. & Huang, D. Y., 2011 十一月 1, 於 : IEEE Transactions on Components, Packaging and Manufacturing Technology. 1, 11, p. 1755-1760 6 p., 6036160.

研究成果: Article

12 引文 斯高帕斯(Scopus)

Volume shrinkage characterization of underfill materials

Deng, S. S., Ho, C. Y., Lee, H-H., Hwang, S-J. & Hwang, D. Y., 2011 十二月 1, 於 : IEEE Transactions on Components, Packaging and Manufacturing Technology. 1, 1, p. 76-82 7 p., 5674109.

研究成果: Article

3 引文 斯高帕斯(Scopus)
2009

Effects of defrosting period on mold adhesion force of epoxy molding compound

Chen, H. Z., Lee, W. H., Lee, H-H., Huang, D. Y., Chang, S. J. & Hwang, S-J., 2009 三月 1, 於 : Asia-Pacific Journal of Chemical Engineering. 4, 2, p. 161-168 8 p.

研究成果: Article

2008
1 引文 斯高帕斯(Scopus)

Simulations and experiments of three-dimensional paddle shift for IC packaging

Teng, S. Y. & Hwang, S-J., 2008 一月 1, 於 : Microelectronic Engineering. 85, 1, p. 115-125 11 p.

研究成果: Article

27 引文 斯高帕斯(Scopus)
2007

Development of an external-type microinjection molding module for thermoplastic polymer

Chang, P. C., Hwang, S. J., Lee, H. H. & Huang, D. Y., 2007 四月 12, 於 : Journal of Materials Processing Technology. 184, 1-3, p. 163-172 10 p.

研究成果: Article

21 引文 斯高帕斯(Scopus)

Inversion for acoustic impedance of a wall by using artificial neural network

Too, G. P. J., Chen, S. R. & Hwang, S., 2007 四月 1, 於 : Applied Acoustics. 68, 4, p. 377-389 13 p.

研究成果: Article

6 引文 斯高帕斯(Scopus)
7 引文 斯高帕斯(Scopus)
10 引文 斯高帕斯(Scopus)
2006

Design and verification of a clamping system for micro-injection molding machine

Change, P. C., Hwang, S-J., Lee, H-H. & Huang, D. Y., 2006 十二月 1, 於 : Transactions of the Canadian Society for Mechanical Engineering. 30, 3, p. 413-428 16 p.

研究成果: Article

1 引文 斯高帕斯(Scopus)

Experimental investigation of infrared rapid surface heating for injection molding

Chang, P. C. & Hwang, S-J., 2006 十一月 15, 於 : Journal of Applied Polymer Science. 102, 4, p. 3704-3713 10 p.

研究成果: Article

75 引文 斯高帕斯(Scopus)

Injection molding of microprobe array parts

Chang, P. C. & Hwang, S-J., 2006 二月 1, 於 : Journal of Polymer Research. 13, 1, p. 25-32 8 p.

研究成果: Article

3 引文 斯高帕斯(Scopus)

P-V-T-C equation for epoxy molding compound

Hwang, S-J. & Chang, Y. S., 2006 三月 1, 於 : IEEE Transactions on Components and Packaging Technologies. 29, 1, p. 112-117 6 p.

研究成果: Article

27 引文 斯高帕斯(Scopus)

Simulation of infrared rapid surface heating for injection molding

Chang, P. C. & Hwang, S-J., 2006 十月 1, 於 : International Journal of Heat and Mass Transfer. 49, 21-22, p. 3846-3854 9 p.

研究成果: Article

66 引文 斯高帕斯(Scopus)