Hsieh, Y. Y.,
Hsu, H. T.,
Lin, M. T.,
Lai, Y. S. &
Chen, S-H.,
2007 12月 1,
Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT. p. 181-183 3 p. 4433596. (Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT).
研究成果: Conference contribution