• 523 引文
  • 13 h-指數
1990 …2019
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研究成果 1990 2019

  • 523 引文
  • 13 h-指數
  • 44 Article
  • 9 Conference contribution
  • 1 Review article
篩選
Conference contribution
2019

Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

Yang, C. Y., Chen, K-S., Yang, T-S., Chiu, T-C. & Ho, C-J., 2019 四月 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

Fans
Sensitivity analysis
Packaging
Processing
Sheet molding compounds
2017
1 引文 (Scopus)

Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects

Hsiao, C. L., Yang, C. Y., Chen, H. C., Yang, T-S., Chen, K-S., Wu, T. H., Wang, Y. C. & Lee, S., 2017 七月 1, IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, p. 42-45 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2017-October).

研究成果: Conference contribution

Sheet molding compounds
Curing
Defects
Kinetics
Molding
2 引文 (Scopus)

Process emulation for predicting die shift and wafer warpage in wafer reconstitution

Yang, C. Y., Liu, Y. C., Chen, K-S., Yang, T-S., Wang, Y. C. & Lee, S. S., 2017 九月 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 215-220 6 p. 8046441. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

研究成果: Conference contribution

Curing
Molding
Processing
Sheet molding compounds
Electronics packaging
2016
1 引文 (Scopus)

Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

Chen, K-S., Yang, T-S., Hong, R. C., Chiu, T-C., Wen, A. C-D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2016 七月 15, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Mita, Y., Rencz, M., Charlot, B., Schneider, P., Tas, N., Nouet, P. & Pressecq, F. (編輯). Institute of Electrical and Electronics Engineers Inc., 7514879. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016).

研究成果: Conference contribution

Peeling
Glass
Defects
Lasers
Processing
2015
3 引文 (Scopus)

Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing

Yang, T-S., Chen, G. D., Chen, K-S., Hong, R. C., Chiu, T-C., Wen, A. C-D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2015 一月 1, Micro- and Nano-Systems Engineering and Packaging. American Society of Mechanical Engineers (ASME), (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); 卷 10-2015).

研究成果: Conference contribution

Peeling
Thermoanalysis
Cracks
Glass
Lasers
2010

Effects of wafer carrier design on contact stress uniformity in CMP

Hu, I., Yang, T-S. & Chen, K-S., 2010 十二月 1, Advances in Abrasive Technology XIII. p. 305-310 6 p. (Advanced Materials Research; 卷 126-128).

研究成果: Conference contribution

Rigidity
Contacts (fluid mechanics)
Fluids
Pressure distribution
Lubrication
2009
1 引文 (Scopus)

A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

Ou, K. S., Chen, K-S., Yang, T-S. & Lee, S-Y., 2009 十二月 1, ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. p. 597-606 10 p. (Proceedings of the ASME Design Engineering Technical Conference; 卷 6).

研究成果: Conference contribution

Residual Stress
Electrostatics
Loads (forces)
Residual stresses
Actuators
1999
2 引文 (Scopus)

Optimal prechirping for dispersion-managed transmission of return-To-zero pulses

Yang, T-S., Kath, W. L. & Evangelides, S. G., 1999 一月 1, OFC/IOOC 1999 - Optical Fiber Communication Conference and the International Conference on Integrated Optics and Optical Fiber Communication. Institute of Electrical and Electronics Engineers Inc., p. 249-251 3 p. 768124. (OFC/IOOC 1999 - Optical Fiber Communication Conference and the International Conference on Integrated Optics and Optical Fiber Communication; 卷 3).

研究成果: Conference contribution

fibers
Fibers
pulses
1998

Optimal dispersion maps for wavelength-division multiplexed soliton transmission systems

Yang, T-S., Kath, W. L. & Turitsyn, S. K., 1998, Proceedings - Optical Fiber Communication Conference, OFC 1998. Institute of Electrical and Electronics Engineers Inc., 卷 1998-January. p. 124-125 2 p.

研究成果: Conference contribution

Electromagnetic dispersion
Frequency division multiplexing
Light amplifiers
Wave transmission
Fiber optic networks