• 525 引文
  • 13 h-指數
1990 …2019
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研究成果 1990 2019

  • 525 引文
  • 13 h-指數
  • 44 Article
  • 8 Conference contribution
  • 1 Paper
  • 1 Review article
篩選
Conference contribution
Conference contribution
1 引文 (Scopus)

A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

Ou, K. S., Chen, K-S., Yang, T-S. & Lee, S-Y., 2009 十二月 1, ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. p. 597-606 10 p. (Proceedings of the ASME Design Engineering Technical Conference; 卷 6).

研究成果: Conference contribution

Residual Stress
Electrostatics
Loads (forces)
Residual stresses
Actuators

Effects of wafer carrier design on contact stress uniformity in CMP

Hu, I., Yang, T-S. & Chen, K-S., 2010 十二月 1, Advances in Abrasive Technology XIII. p. 305-310 6 p. (Advanced Materials Research; 卷 126-128).

研究成果: Conference contribution

Rigidity
Contacts (fluid mechanics)
Fluids
Pressure distribution
Lubrication
1 引文 (Scopus)

Identification of curing kinetics of epoxy molding compounds and mold flow analysis for assessment of die-shift defects

Hsiao, C. L., Yang, C. Y., Chen, H. C., Yang, T-S., Chen, K-S., Wu, T. H., Wang, Y. C. & Lee, S., 2017 七月 1, IMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings. IEEE Computer Society, p. 42-45 4 p. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2017-October).

研究成果: Conference contribution

Sheet molding compounds
Curing
Defects
Kinetics
Molding
2 引文 (Scopus)

Optimal prechirping for dispersion-managed transmission of return-To-zero pulses

Yang, T-S., Kath, W. L. & Evangelides, S. G., 1999 一月 1, OFC/IOOC 1999 - Optical Fiber Communication Conference and the International Conference on Integrated Optics and Optical Fiber Communication. Institute of Electrical and Electronics Engineers Inc., p. 249-251 3 p. 768124. (OFC/IOOC 1999 - Optical Fiber Communication Conference and the International Conference on Integrated Optics and Optical Fiber Communication; 卷 3).

研究成果: Conference contribution

fibers
Fibers
pulses
2 引文 (Scopus)

Process emulation for predicting die shift and wafer warpage in wafer reconstitution

Yang, C. Y., Liu, Y. C., Chen, K-S., Yang, T-S., Wang, Y. C. & Lee, S. S., 2017 九月 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (編輯). Institute of Electrical and Electronics Engineers Inc., p. 215-220 6 p. 8046441. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

研究成果: Conference contribution

Curing
Molding
Processing
Sheet molding compounds
Electronics packaging
3 引文 (Scopus)

Thermal analysis of a laser peeling technique for removing micro edge cracks of ultrathin glass substrates for web processing

Yang, T. S., Chen, G. D., Chen, K. S., Hong, R. C., Chiu, T. C., Wen, C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2015 一月 1, Micro- and Nano-Systems Engineering and Packaging. American Society of Mechanical Engineers (ASME), (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); 卷 10-2015).

研究成果: Conference contribution

Peeling
Thermoanalysis
Cracks
Glass
Lasers
1 引文 (Scopus)

Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications

Chen, K. S., Yang, T. S., Hong, R. C., Chiu, T. C., Wen, A. C. D., Li, C. H., Huang, C. J., Chen, K. T. & Lin, M. C., 2016 七月 15, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Mita, Y., Rencz, M., Charlot, B., Schneider, P., Tas, N., Nouet, P. & Pressecq, F. (編輯). Institute of Electrical and Electronics Engineers Inc., 7514879. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016).

研究成果: Conference contribution

Peeling
Glass
Defects
Lasers
Processing

Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

Yang, C. Y., Chen, K-S., Yang, T-S., Chiu, T-C. & Ho, C-J., 2019 四月 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

Fans
Sensitivity analysis
Packaging
Processing
Sheet molding compounds