• 1278 引文
  • 11 h-指數
19992019
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個人檔案

學歷

  • 2000 美國里海大學機械工程博士

研究專長

  • 固體力學

經歷

  • 2011年8月 ~ 迄今 國立成功大學機械系副教授

指紋 查看啟用 Tz-Cheng Chiu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。

  • 2 類似的檔案
Soldering alloys Engineering & Materials Science
Sheet molding compounds Engineering & Materials Science
Ball grid arrays Engineering & Materials Science
Cracks Engineering & Materials Science
Constitutive models Engineering & Materials Science
Delamination Engineering & Materials Science
Energy release rate Engineering & Materials Science
Fatigue of materials Engineering & Materials Science

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研究計畫 2006 2018

研究成果 1999 2019

  • 1278 引文
  • 11 h-指數
  • 37 Conference contribution
  • 25 Article
  • 5 Conference article
  • 1 Review article

A viscoplastic-based fatigue reliability model for the polyimide dielectric thin film

Chang, Y. C., Chiu, T-C., Yang, Y. T., Tseng, Y. H. & Chen, X. H., 2019 五月 1, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1359-1365 7 p. 8811235. (Proceedings - Electronic Components and Technology Conference; 卷 2019-May).

研究成果: Conference contribution

Dielectric films
Polyimides
Fatigue of materials
Thin films
Stress relaxation

Fatigue crack growth on the interface of copper and epoxy molding compound under mixed-mode loading

Chen, Y. J., Deng, Y. A. & Chiu, T-C., 2019 一月 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 139-142 4 p. 8625759. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2018-October).

研究成果: Conference contribution

Sheet molding compounds
Fatigue crack propagation
Fatigue of materials
Copper
Cracks

Thermo-mechanical process emulation and sensitivity analysis of wafer warpage after reconstitution in fan-out packaging

Yang, C. Y., Chen, K-S., Yang, T-S., Chiu, T-C. & Ho, C-J., 2019 四月 1, 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., p. 355-360 6 p. 8733604. (2019 International Conference on Electronics Packaging, ICEP 2019).

研究成果: Conference contribution

Fans
Sensitivity analysis
Packaging
Processing
Sheet molding compounds
1 引文 (Scopus)
Debonding
Mixed Mode
Fatigue
Fatigue of materials
Angle
1 引文 (Scopus)

Interconversions between linear viscoelastic functions with a time-dependent bulk modulus

Chen, D. L., Chiu, T-C., Chen, T-C., Yang, P. F. & Jian, S. R., 2018 六月 1, 於 : Mathematics and Mechanics of Solids. 23, 6, p. 879-895 17 p.

研究成果: Article

Bulk Modulus
Elastic moduli
Modulus
Monotonic Function
Poisson's Ratio

論文

316L不鏽鋼之選擇性雷射熔融積層製程應力與變形分析

作者: 詠迪, 鐘., 2018 八月 22

監督員: Chiu, T. (Supervisor)

學生論文: Master's Thesis

皮秒雷射改質之超薄玻璃殘留應力分析

作者: 宗彥, 李., 2018 七月 6

監督員: Chiu, T. (Supervisor)

學生論文: Master's Thesis

材料界面受混合模式作用下疲勞裂紋成長特性量測系統之建立

作者: 献駿, 郭., 2014 八月 27

監督員: Chiu, T. (Supervisor)

學生論文: Master's Thesis

具可調整骨釘角?之創新骨板設計

作者: 秉翰, 張., 2016 八月 16

監督員: Chiu, T. (Supervisor)

學生論文: Master's Thesis

封膠黏彈特性分析及其於條形封裝翹曲模擬之應用

作者: 煒傑, 殷., 2017 八月 30

監督員: Chiu, T. (Supervisor)

學生論文: Master's Thesis