• 1361 引文
  • 12 h-指數
19992020

每年研究成果

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個人檔案

學歷

  • 2000 美國里海大學機械工程博士

研究專長

  • 固體力學

經歷

  • 2011年8月 ~ 迄今 國立成功大學機械系副教授

指紋 查看啟用 Tz-Cheng Chiu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。

  • 2 類似的個人檔案

網路 國家層面的近期外部共同作業。通過按一下圓點深入探索詳細資料。

專案

研究成果

  • 1361 引文
  • 12 h-指數
  • 39 Conference contribution
  • 24 Article
  • 7 Conference article
  • 1 Review article

A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package

Chiu, T. C., Wu, J. Y., Liu, W. T., Liu, C. W., Chen, D. L., Shih, M. K. & Tarng, D., 2020 六月, Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020. Institute of Electrical and Electronics Engineers Inc., p. 1205-1211 7 p. 9159182. (Proceedings - Electronic Components and Technology Conference; 卷 2020-June).

研究成果: Conference contribution

  • A viscoplastic-based fatigue reliability model for the polyimide dielectric thin film

    Chang, Y. C., Chiu, T. C., Yang, Y. T., Tseng, Y. H. & Chen, X. H., 2019 五月, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1359-1365 7 p. 8811235. (Proceedings - Electronic Components and Technology Conference; 卷 2019-May).

    研究成果: Conference contribution

  • Coupled Hygro-Thermo-Mechanical Analysis of Moisture Induced Interfacial Stresses in Fan-Out Package

    Wu, J. Y., Chen, T. W., Chiu, T. C., Chen, D. L., Chen, T. Y. & Shih, M. K., 2019 十月, IMPACT 2019 - 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceeding. IEEE Computer Society, p. 76-79 4 p. 9024983. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2019-October).

    研究成果: Conference contribution

  • Fatigue crack growth on the interface of copper and epoxy molding compound under mixed-mode loading

    Chen, Y. J., Deng, Y. A. & Chiu, T. C., 2019 一月 24, 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2018. IEEE Computer Society, p. 139-142 4 p. 8625759. (Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT; 卷 2018-October).

    研究成果: Conference contribution