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查看斯高帕斯 (Scopus) 概要
莊 婉君
助理教授
工程科學系
電子郵件
z11302002
ncku.edu
tw
h-index
294
引文
7
h-指數
按照存儲在普爾（Pure）的出版物數量及斯高帕斯（Scopus）引文計算。
2007
2023
每年研究成果
概覽
指紋
網路
研究成果
(20)
類似的個人檔案
(6)
指紋
查看啟用 Wan-Chun Chuang 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
排序方式
重量
按字母排序
Engineering & Materials Science
MEMS
88%
Taguchi methods
85%
Materials properties
75%
Residual stresses
66%
Electrostatics
62%
Capacitance
59%
Elastic moduli
52%
Molding
51%
Structural design
49%
Electric potential
48%
Muscle
47%
Finite element method
46%
Soldering alloys
45%
Temperature
40%
Tapes
39%
Testing
33%
Sheet molding compounds
33%
Ball grid arrays
32%
Analytical models
32%
Curve fitting
28%
Cantilever beams
28%
Strain gages
25%
Extrusion
24%
Fans
23%
Sensors
23%
Fatigue of materials
23%
Packaging
22%
Aluminum alloys
22%
Thin films
21%
Product development
21%
Thermoelectricity
20%
Skin
19%
Wire
18%
Electromagnetism
17%
Cracks
17%
Microstructure
17%
Crystals
16%
Mechanical properties
16%
Monitoring
14%
Mountings
13%
Thermal expansion
12%
Substrates
12%
Curing
11%
Microelectromechanical devices
11%
Parameter extraction
10%
Creep
10%
Numerical models
10%
Single crystals
9%
Damping
9%
Silicones
9%
Chemical Compounds
Simulation
100%
Voltage
82%
Solder
62%
Electromechanics
47%
Young's Modulus
44%
Electromagnetism
44%
Cantilever Beam
40%
Error
34%
Models (Physical)
34%
Length
30%
Electricity
28%
Thermoelectricity
28%
Aluminium Alloy
27%
Dimension
27%
Thermal Expansion
26%
Extrusion
24%
Curing
23%
Energy
21%
Reaction Yield
20%
Microstructure
17%
Resistance
15%
Creep
15%
Reduction
13%
Amount
12%
Electrical Circuit
12%
Thermal Expansion Coefficient
9%
Force
8%
Residual Stress
8%
Surface
8%
Substitution Reaction
7%
Modification
7%
Industry
6%
Liquid Film
6%
Single Crystalline Solid
6%
Flexibility
5%
Physics & Astronomy
wafers
82%
warpage
75%
microelectromechanical systems
67%
CMOS
45%
cantilever beams
29%
fans
27%
muscles
26%
packaging
26%
education
24%
residual stress
23%
Taguchi methods
23%
strip
21%
electrostatics
21%
modules
20%
chips
20%
electromechanics
19%
cracks
19%
thermoelectricity
17%
modulus of elasticity
17%
mechanical properties
16%
expansion
15%
sensors
15%
electricity
14%
electric potential
13%
dynamic characteristics
12%
trends
11%
damping
10%
tapes
9%
electromagnetism
9%
energy methods
8%
fabrication
7%
air
7%
muscular function
7%
posture
7%
death
7%
structural design
6%
experimentation
5%
manufacturing
5%
