Wan-Chun Chuang

查看斯高帕斯 (Scopus) 概要

電子郵件z11302002ncku.edutw

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每年研究成果

14 Article
5 Conference contribution
1 Review article

5結果

篩選

2017
Reliability of ball grid array subjected to temperature cycling
Chuang, W. C., Tsai, B., Chen, W. L. & Su, J., 2017 7月 18, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017. Charlot, B., Nouet, P., Pellet, C., Mita, Y., Pressecq, F., Schneider, P. & Smith, S. (編輯). Institute of Electrical and Electronics Engineers Inc., 7984491. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017).
研究成果: Conference contribution
3 引文斯高帕斯（Scopus）
2016
Analysis for the spacing between the separated dies during the dicing wafer expanding
Chuang, W. C., Chen, W. L., Tsai, B. & Wu, R., 2016 7月 15, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016. Mita, Y., Rencz, M., Charlot, B., Schneider, P., Tas, N., Nouet, P. & Pressecq, F. (編輯). Institute of Electrical and Electronics Engineers Inc., 7514864. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2016).
研究成果: Conference contribution
2015
Fracture mechanism analysis for stealth dicing applied in wafer expansion
Chuang, W. C., Tu, W. H., Lin, G. S., Hwang, J. Y. & Lee, C. S., 2015 7月 16, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015. Schropfer, G., Pressecq, F., Rencz, M., Schneider, P., Mita, Y., Charlot, B. & Nouet, P. (編輯). Institute of Electrical and Electronics Engineers Inc., 7161040. (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2015).
研究成果: Conference contribution
2014
The robustness of an algorithm applied in wafer-level material property extraction
Chuang, W. C. & Lin, Y. R., 2014 3月 9, DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Institute of Electrical and Electronics Engineers Inc., 7056634. (DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS).
研究成果: Conference contribution
2008
An electrical testing method of the structural material of micro devices
Hu, Y. C., Lin, J. H., Huang, K. Y. & Chuang, W. C., 2008, 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008. p. 69-73 5 p. 4484288. (3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS).
研究成果: Conference contribution
2 引文斯高帕斯（Scopus）

莊 婉君

研究成果

搜尋結果

Reliability of ball grid array subjected to temperature cycling

Analysis for the spacing between the separated dies during the dicing wafer expanding

Fracture mechanism analysis for stealth dicing applied in wafer expansion

The robustness of an algorithm applied in wafer-level material property extraction

An electrical testing method of the structural material of micro devices

莊婉君