Wan-Chun Chuang

查看斯高帕斯 (Scopus) 概要

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每年研究成果

14 Article
5 Conference contribution
1 Review article

14結果

篩選

2023
Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging
Chuang, W. C., Huang, Y. & Chen, P. E., 2023 5月, 於: Materials. 16, 9, 3482.
研究成果: Article › 同行評審

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3 引文斯高帕斯（Scopus）
2022
Study on the Strip Warpage Issues Encountered in the Flip-Chip Process
Chuang, W. C. & Chen, W. L., 2022 1月 1, 於: Materials. 15, 1, 323.
研究成果: Article › 同行評審

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9 引文斯高帕斯（Scopus）
2020
Fatigue prediction for molded wafer-level package during temperature cycling
Chuang, W. C. & Chen, W. L., 2020 3月, 於: Journal of Electronic Packaging, Transactions of the ASME. 142, 1, 011007.
研究成果: Article › 同行評審
3 引文斯高帕斯（Scopus）
Investigation of strip warpage Behavior in wire bonding process
Chuang, W. C. & Chen, W. L., 2020 6月, 於: Journal of Electronic Packaging, Transactions of the ASME. 142, 2, 021002-1.
研究成果: Article › 同行評審
1 引文斯高帕斯（Scopus）
2019
Real-Time Monitoring for Knee Extensor Muscle Training with Flexible Sensors
Chuang, W. C. & Chen, W. L., 2019 12月, 於: Journal of Microelectromechanical Systems. 28, 6, p. 1005-1012 8 p., 8869923.
研究成果: Article › 同行評審
1 引文斯高帕斯（Scopus）
Using Taguchi method to identify the key factors of increasing spacing between the dies during dicing tape expansion
Chuang, W. C. & Chen, W. L., 2019 5月 19, 於: Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A. 42, 4, p. 290-296 7 p.
研究成果: Article › 同行評審
1 引文斯高帕斯（Scopus）
2016
The robustness of an algorithm applied in wafer-level material property extraction
Chuang, W. C., 2016 3月 1, 於: Microsystem Technologies. 22, 3, p. 531-536 6 p.
研究成果: Article › 同行評審
2015
Strengthening of back muscles using a module of flexible strain sensors
Chuang, W. C., Lin, H. T. & Chen, W. L., 2015 2月 9, 於: Sensors (Switzerland). 15, 2, p. 3975-3987 13 p.
研究成果: Article › 同行評審

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4 引文斯高帕斯（Scopus）
2014
A method integrating optimal algorithm and FEM on CMOS residual stress
Chuang, W. C., Lin, D. T. W., Hu, Y. C., Lee, H. L., Cheng, C. H., Chang, P. Z. & Quyen, N. B., 2014 4月, 於: Journal of Mechanics. 30, 2, p. 123-128 6 p.
研究成果: Article › 同行評審

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12 引文斯高帕斯（Scopus）
2012
CMOS-MEMS test-key for extracting wafer-level mechanical properties
Chuang, W. C., Hu, Y. C. & Chang, P. Z., 2012 12月, 於: Sensors (Switzerland). 12, 12, p. 17094-17111 18 p.
研究成果: Article › 同行評審

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6 引文斯高帕斯（Scopus）
The fringe capacitance formula of microstructures
Chuang, W. C., Wang, C. W., Chu, W. C., Chang, P. Z. & Hu, Y. C., 2012 2月, 於: Journal of Micromechanics and Microengineering. 22, 2, 025015.
研究成果: Article › 同行評審
27 引文斯高帕斯（Scopus）
2009
Electromechanical behavior of the curled cantilever beam
Chuang, W. C., Hu, Y. C., Lee, C. Y., Shih, W. P. & Chang, P. Z., 2009, 於: Journal of Micro/Nanolithography, MEMS, and MOEMS. 8, 3, 033020.
研究成果: Article › 同行評審

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13 引文斯高帕斯（Scopus）
2008
Finite element analysis of multi-hole extrusion of aluminum-alloy tubes
Chen, F. K., Chuang, W. C. & Torng, S., 2008 5月 26, 於: Journal of Materials Processing Technology. 201, 1-3, p. 150-155 6 p.
研究成果: Article › 同行評審

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41 引文斯高帕斯（Scopus）
2007
An approximate analytical solution to the pull-in voltage of a micro bridge with an elastic boundary
Hu, Y. C., Chang, P. Z. & Chuang, W. C., 2007 9月 1, 於: Journal of Micromechanics and Microengineering. 17, 9, p. 1870-1876 7 p.
研究成果: Article › 同行評審
19 引文斯高帕斯（Scopus）

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