Wen-Bin Young

2024

Forming of bamboo fibers and fabrication of a bamboo fiber composite with a complicated shape

Hsu, C. H. & Young, W. B., 2024 7月, 於: Cellulose. 31, 11, p. 6761-6777 17 p.

研究成果: Article › 同行評審

2023

Complex angle part fabricated by vacuum bag only process with interleaved dry fiber and prepreg

Wu, K. J. & Young, W. B., 2023 1月, 於: Journal of Composite Materials. 57, 2, p. 199-211 13 p.

研究成果: Article › 同行評審

3 引文斯高帕斯（Scopus）

Study on the Characteristics of Vacuum-Bag-Only Processed Composites by Prepreg/Fiber Interleaved Layup

Chang, Y. Y. & Young, W. B., 2023 2月, 於: Fibers and Polymers. 24, 2, p. 653-670 18 p.

研究成果: Article › 同行評審

1 引文斯高帕斯（Scopus）

The effect of densification on bamboo fiber and bamboo fiber composites

Chan, C. H., Wu, K. J. & Young, W. B., 2023 5月, 於: Cellulose. 30, 7, p. 4575-4585 11 p.

研究成果: Article › 同行評審

18 引文斯高帕斯（Scopus）

The Effects of Process Parameters on the Porosity of a VBO Prepreg/Fiber-Interleaved Layup Composite

Sheu, Y. W. & Young, W. B., 2023 10月, 於: Journal of Composites Science. 7, 10, 412.

研究成果: Article › 同行評審

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2022

Fabrication and quality analysis of angle composite part by vacuum-bag-only process with interleaved woven fiber/prepreg layup

Wu, K. J. & Young, W. B., 2022 10月, 於: International Journal of Advanced Manufacturing Technology. 122, 7-8, p. 3281-3297 17 p.

研究成果: Article › 同行評審

2 引文斯高帕斯（Scopus）

Internal characteristics analysis of woven/unidirectional composite angle part by VBO process

Wu, K. J. & Young, W. B., 2022 8月, 於: Composites Communications. 33, 101215.

研究成果: Article › 同行評審

2 引文斯高帕斯（Scopus）

Study on the Mechanical and Creep Properties of the Bamboo Fiber Under Thermal or Hygro Conditions

Shih, Z. T. & Young, W. B., 2022, 於: Journal of Natural Fibers. 19, 15, p. 11481-11491 11 p.

研究成果: Article › 同行評審

4 引文斯高帕斯（Scopus）

The Effects of Compression Pressure on Injection Compression Molding

Chen, C. M. & Young, W. B., 2022 2月 23, 於: International Polymer Processing. 15, 2, p. 176-179 4 p.

研究成果: Article › 同行評審

The Natural Fiber Reinforced Thermoplastic Composite Made of Woven Bamboo Fiber and Polypropylene

Wang, B. J. & Young, W. B., 2022 1月, 於: Fibers and Polymers. 23, 1, p. 155-163 9 p.

研究成果: Article › 同行評審

18 引文斯高帕斯（Scopus）

2021

Carbon/Epoxy Composites Fabricated by Vacuum Consolidation of the Interleaved Layup of Prepregs and Dry Fibers

Yang, Y. H. & Young, W. B., 2021 2月, 於: Fibers and Polymers. 22, 2, p. 460-468 9 p.

研究成果: Article › 同行評審

7 引文斯高帕斯（Scopus）

2020

Characteristic study of bamboo fibers in preforming

Chiu, H. H. & Young, W. B., 2020 1月 1, (Accepted/In press) 於: Journal of Composite Materials.

研究成果: Article › 同行評審

14 引文斯高帕斯（Scopus）

The Longitudinal and Transverse Tensile Properties of Unidirectional and Bidirectional Bamboo Fiber Reinforced Composites

Chiu, H. H. & Young, W. B., 2020 12月, 於: Fibers and Polymers. 21, 12, p. 2938-2948 11 p.

研究成果: Article › 同行評審

21 引文斯高帕斯（Scopus）

2019

Simulation of the Resin Infiltration in Fiber Bundles Using the Lattice Boltzmann Method

Yang, W. K., Chang, S. C. & Young, W. B., 2019 9月 1, 於: Journal of Aeronautics, Astronautics and Aviation. 51, 3, p. 321-334 14 p.

研究成果: Article › 同行評審

1 引文斯高帕斯（Scopus）

The mechanical, hygral, and interfacial strength of continuous bamboo fiber reinforced epoxy composites

Huang, J. K. & Young, W. B., 2019 6月 1, 於: Composites Part B: Engineering. 166, p. 272-283 12 p.

研究成果: Article › 同行評審

191 引文斯高帕斯（Scopus）

2018

Application of lattice Boltzmann method in free surface flow simulation of micro injection molding

Chen, Y. X., Chang, S. C. & Young, W. B., 2018 4月 1, 於: Computers and Mathematics with Applications. 75, 7, p. 2374-2386 13 p.

研究成果: Article › 同行評審

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6 引文斯高帕斯（Scopus）

Design of the printing pattern on film for three-dimensional molded interconnect devices

Liu, R. H., Young, W. B. & Ming, H. P., 2018 10月, 於: Advances in Polymer Technology. 37, 6, p. 1722-1731 10 p.

研究成果: Article › 同行評審

4 引文斯高帕斯（Scopus）

Strength of Untreated and Alkali-treated Bamboo Fibers and Reinforcing Effects for Short Fiber Composites

Chou, T. N. & Young, W. B., 2018 9月 1, 於: Journal of Aeronautics, Astronautics and Aviation. 50, 3, p. 237-246 10 p.

研究成果: Article › 同行評審

11 引文斯高帕斯（Scopus）

Study of radiation heating and heat transfer of a concentrating solar power system with cavity receiver

Yu, C. W. & Young, W. B., 2018 3月 1, 於: Journal of Aeronautics, Astronautics and Aviation. 50, 1, p. 81-94 14 p.

研究成果: Article › 同行評審

1 引文斯高帕斯（Scopus）

Theoretical approach to simulate efficient selective solar absorbers with micro or nano structured arrays

Chiu, J. S. & Young, W. B., 2018, 於: Materials Research. 21, 3, e20171026.

研究成果: Article › 同行評審

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3 引文斯高帕斯（Scopus）

2017

Lattice Boltzmann simulation of polymer melt flow with a low Reynolds number

Young, W. B., 2017, 於: International Journal of Heat and Mass Transfer. 115, p. 784-792 9 p.

研究成果: Article › 同行評審

8 引文斯高帕斯（Scopus）

2015

A two-dimensional simulation model for the molded underfill process in flip chip packaging

Guo, X. R. & Young, W. B., 2015 7月 23, 於: Journal of Mechanical Science and Technology. 29, 7, p. 2967-2974 8 p.

研究成果: Article › 同行評審

4 引文斯高帕斯（Scopus）

The mechanical and fire safety properties of bamboo fiber reinforced polylactide biocomposites fabricated by injection molding

Young, W. B. & Tsao, Y. C., 2015 1月 1, 於: Journal of Composite Materials. 49, 22, p. 2803-2813 11 p.

研究成果: Article › 同行評審

17 引文斯高帕斯（Scopus）

Vacuum effect on the void formation of the molded underfill process in flip chip packaging

Guo, X. R. & Young, W. B., 2015 2月 1, 於: Microelectronics Reliability. 55, 3-4, p. 613-622 10 p.

研究成果: Article › 同行評審

14 引文斯高帕斯（Scopus）

2014

Modeling and numerical study of thermal-compression bonding in the packaging process using NCA

Chang, C. H. & Young, W. B., 2014, 於: Applied Mathematical Modelling. 38, 11-12, p. 3016-3030 15 p.

研究成果: Article › 同行評審

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4 引文斯高帕斯（Scopus）

The application of carbon black and printing ink technology in molded interconnect devices

Liu, R. H. & Young, W. B., 2014 7月 1, 於: Journal of Polymer Engineering. 34, 5, p. 395-403 9 p.

研究成果: Article › 同行評審

5 引文斯高帕斯（Scopus）

2013

A two-layer model for the simulation of the vartm process with resin distribution layer

Young, W. B., 2013 12月 1, 於: Applied Composite Materials. 20, 6, p. 1305-1319 15 p.

研究成果: Article › 同行評審

15 引文斯高帕斯（Scopus）

Study on bump arrangement to accelerate the underfill flow in flip-chip packaging

Lin, S. W. & Young, W. B., 2013, 於: IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 1, p. 40-45 6 p., 6363586.

研究成果: Article › 同行評審

10 引文斯高帕斯（Scopus）

The effective permeability of the underfill flow domain in flip-chip packaging

Yang, C. & Young, W. B., 2013 2月 1, 於: Applied Mathematical Modelling. 37, 3, p. 1177-1186 10 p.

研究成果: Article › 同行評審

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15 引文斯高帕斯（Scopus）

Three-dimensional modeling of the advanced grid stiffened structures in the co-curing process

Young, W. B., 2013, 於: Composites Part A: Applied Science and Manufacturing. 46, 1, p. 19-25 7 p.

研究成果: Article › 同行評審

10 引文斯高帕斯（Scopus）

2012

Structural analysis and design of the composite wind turbine blade

Wu, W. H. & Young, W. B., 2012 6月, 於: Applied Composite Materials. 19, 3-4, p. 247-257 11 p.

研究成果: Article › 同行評審

23 引文斯高帕斯（Scopus）

2011

Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA

Chang, C. H. & Young, W-B., 2011 4月 1, 於: Microelectronics Reliability. 51, 4, p. 860-865 6 p.

研究成果: Article › 同行評審

1 引文斯高帕斯（Scopus）

Effect on filling time for a non-newtonian flow during the underfilling of a flip chip

Young, W-B., 2011 12月 1, 於: IEEE Transactions on Components, Packaging and Manufacturing Technology. 1, 7, p. 1048-1053 6 p., 5929543.

研究成果: Article › 同行評審

10 引文斯高帕斯（Scopus）

Experimental study on the filling of nano structures with infrared mold surface heating

Lin, H. Y., Chang, C. H. & Young, W. B., 2011, 於: International Polymer Processing. 26, 1, p. 73-81 9 p.

研究成果: Article › 同行評審

17 引文斯高帕斯（Scopus）

Non-newtonian flow formulation of the underfill process in flip-chip packaging

Young, W-B., 2011 12月 1, 於: IEEE Transactions on Components, Packaging and Manufacturing Technology. 1, 12, p. 2033-2037 5 p., 6119116.

研究成果: Article › 同行評審

6 引文斯高帕斯（Scopus）

2010

Application of the underfill model to bump arrangement and dispensing process design

Peng, S. W. & Young, W-B., 2010 4月 1, 於: IEEE Transactions on Electronics Packaging Manufacturing. 33, 2, p. 122-128 7 p.

研究成果: Article › 同行評審

11 引文斯高帕斯（Scopus）

Experimental and analytical study on filling of nano structures in micro injection molding

Lin, H. Y., Chang, C. H. & Young, W-B., 2010 12月 1, 於: International Communications in Heat and Mass Transfer. 37, 10, p. 1477-1486 10 p.

研究成果: Article › 同行評審

55 引文斯高帕斯（Scopus）

Fabrication of the plastic component for photonic crystal using micro injection molding

Chang, C. H. & Young, W. B., 2010 6月, 於: Microsystem Technologies. 16, 6, p. 941-946 6 p.

研究成果: Article › 同行評審

5 引文斯高帕斯（Scopus）

Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation

Young, W. B., 2010 7月, 於: Microelectronics Reliability. 50, 7, p. 995-999 5 p.

研究成果: Article › 同行評審

20 引文斯高帕斯（Scopus）

The filling behavior of reinforcing glass fiber in micro injection molding

Liou, G. L. & Young, W. B., 2010, 於: International Polymer Processing. 25, 4, p. 264-269 6 p.

研究成果: Article › 同行評審

4 引文斯高帕斯（Scopus）

2009

Analysis of the filling capability to the microstructures in micro-injection molding

Lin, H. Y. & Young, W. B., 2009 9月, 於: Applied Mathematical Modelling. 33, 9, p. 3746-3755 10 p.

研究成果: Article › 同行評審

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61 引文斯高帕斯（Scopus）

Development of a helicopter landing gear prototype using resin infusion molding

Young, W-B., 2009 4月 1, 於: Journal of Reinforced Plastics and Composites. 28, 7, p. 833-849 17 p.

研究成果: Article › 同行評審

14 引文斯高帕斯（Scopus）

Experimental study of filling behaviors in the underfill encapsulation of a flip-chip

Shih, M. F. & Young, W-B., 2009 12月 1, 於: Microelectronics Reliability. 49, 12, p. 1555-1562 8 p.

研究成果: Article › 同行評審

19 引文斯高帕斯（Scopus）

Study on mold filling behaviors of micro channels in injection molding

Li, J. H. & Young, W. B., 2009, 於: International Polymer Processing. 24, 5, p. 421-427 7 p.

研究成果: Article › 同行評審

3 引文斯高帕斯（Scopus）

Study on Mold Filling Behaviors of Micro Channels in Injection Molding

Li, J. & Young, W., 2009 11月 1, 於: International Polymer Processing. 24, 5, p. 421-427

研究成果: Article › 同行評審

2008

Analysis of the isothermal compression in nanoimprint lithography assuming a power-law fluid

Hsin, I. C. & Young, W. B., 2008 3月, 於: International Polymer Processing. 23, 1, p. 24-29 6 p.

研究成果: Article › 同行評審

1 引文斯高帕斯（Scopus）

2007

Analysis of filling distance in cylindrical microfeatures for microinjection molding

Young, W. B., 2007 9月, 於: Applied Mathematical Modelling. 31, 9, p. 1798-1806 9 p.

研究成果: Article › 同行評審

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32 引文斯高帕斯（Scopus）

Micro-injection molding with the infrared assisted mold heating system

Yu, M. C., Young, W. B. & Hsu, P. M., 2007 7月 15, 於: Materials Science and Engineering A. 460-461, p. 288-295 8 p.

研究成果: Article › 同行評審

105 引文斯高帕斯（Scopus）

2006

Analysis of the residual stresses in the process of nanoimprint lithography

Young, W. B., 2006 7月, 於: International Polymer Processing. 21, 3, p. 290-294 5 p.

研究成果: Article › 同行評審

2 引文斯高帕斯（Scopus）

The thrust and lift of an ornithopter's membrane wings with simple flapping motion

Lin, C. S., Hwu, C. & Young, W. B., 2006 3月, 於: Aerospace Science and Technology. 10, 2, p. 111-119 9 p.

研究成果: Article › 同行評審

79 引文斯高帕斯（Scopus）

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