李 文熙

研究成果

每年研究成果 2000 2007 2008 2009 2012 2013 2014 2016 2017 2022

• 132 Article
• 33 Conference contribution
• 17 Patent
• 3 Conference article
• 2 更多
  • 1 Editorial
  • 1 Review article

每年研究成果

每年研究成果

搜尋結果

• 2022

  Improvements in the efficiency of p-type bifacial Si solar cells with a rear Cu electrode using galvanic replacement reactions

  Kuo, T. C., Kuo, C. R. & Lee, W. H., 2022 1月, 於: Solar Energy Materials and Solar Cells. 234, 111411.

  研究成果: Article › 同行評審

  • Solar cells 100%
  • Solar Cell 81%
  • Electrodes 72%
  • Thick films 57%
  • Behavior as Electrode 47%
  4 引文 斯高帕斯（Scopus）
• 2021

  Advanced low damage manufacturing processes to fabricate SOI FinFETs and measurement of electrical properties

  Kumar, A., Lee, W. H. & Wang, Y. L., 2021 5月, 於: Microelectronics Reliability. 120, 114115.

  研究成果: Article › 同行評審

  • FinFET 100%
  • SOI (semiconductors) 85%
  • Electric properties 83%
  • Annealing 77%
  • Microwaves 68%
  2 引文 斯高帕斯（Scopus）

• A Novel Fabricating a Thick Film Cu-Ni Alloy Resistor by Screen Printing an Al Electrode and Galvanic Replacement Reaction

  Kuo, C. R., Kuo, T. C. & Lee, W. H., 2021 11月 1, 於: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11, 11, p. 1997-2002 6 p.

  研究成果: Article › 同行評審

  • Screen printing 100%
  • Thick films 94%
  • Resistors 74%
  • Aluminum oxide 74%
  • Electrodes 59%
  4 引文 斯高帕斯（Scopus）

• A Novel Method to Fabricate a Thick-Film Cu Electrode Fired in Air through Printing Al Electrode and Reduction-Oxidation Substitution Reaction

  Kuo, T. C., Kuo, C. R. & Lee, W. H., 2021 3月, 於: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11, 3, p. 485-492 8 p., 9321716.

  研究成果: Article › 同行評審

  • Thick films 100%
  • Substitution reactions 80%
  • Printing 78%
  • Oxidation 72%
  • Electrodes 62%
  3 引文 斯高帕斯（Scopus）

• Fesicr alloy powder to carbonyl iron powder mixing ratio effects on the magnetic properties of the iron-based alloy powder cores prepared using screen printing

  Hsiang, H. I., Chuang, K. H. & Lee, W. H., 2021 2月 2, 於: Materials. 14, 4, p. 1-8 8 p., 1034.

  研究成果: Article › 同行評審

  開啟存取

  • Iron powder 100%
  • Screen printing 93%
  • Magnetic properties 87%
  • mixing ratios 87%
  • printing 71%
  15 引文 斯高帕斯（Scopus）

• Magnetic Properties of Iron-Based Alloy Powder Coils Prepared with Screen Printing Using High-Solid-Content Magnetic Pastes

  Hsiang, H. I., Chuang, K. H. & Lee, W. H., 2021 4月, 於: Journal of Electronic Materials. 50, 4, p. 2331-2338 8 p.

  研究成果: Article › 同行評審

  • Screen printing 100%
  • Magnetic properties 93%
  • Monomers 91%
  • Epoxy resins 82%
  • Molding 78%
  1 引文 斯高帕斯（Scopus）

• Optimizing the Isotropic Etching Nature and Etch Profile of Si, Ge and Si_0.8Ge_0.2by Controlling CF₄Atmosphere with Ar and O₂Additives in ICP

  Kumar, A., Lee, W. H. & Wang, Y. L., 2021 5月, 於: IEEE Transactions on Semiconductor Manufacturing. 34, 2, p. 177-184 8 p., 9347553.

  研究成果: Article › 同行評審

  開啟存取

  • Inductively coupled plasma 100%
  • Argon 75%
  • Etching 72%
  • Inductively Coupled Plasma 66%
  • germanium 59%
  12 引文 斯高帕斯（Scopus）

• Titanate coupling agent surface modification effect on the magnetic properties of iron-based alloy powder coil prepared using screen printing

  Hsiang, H. I., Chuang, K. H. & Lee, W. H., 2021 1月, 於: Journal of Materials Science: Materials in Electronics. 32, 2, p. 1800-1807 8 p.

  研究成果: Article › 同行評審

  • Magnetic Powder 100%
  • Coupling agents 82%
  • Screen printing 81%
  • Magnetic properties 76%
  • titanates 73%
  3 引文 斯高帕斯（Scopus）
• 2020

  Fabrication of Vertically Stacked Nanosheet Junctionless Field-Effect Transistors and Applications for the CMOS and CFET Inverters

  Sung, P. J., Chang, S. W., Kao, K. H., Wu, C. T., Su, C. J., Cho, T. C., Hsueh, F. K., Lee, W. H., Lee, Y. J. & Chao, T. S., 2020 9月, 於: IEEE Transactions on Electron Devices. 67, 9, p. 3504-3509 6 p., 9146737.

  研究成果: Article › 同行評審

  • Nanosheets 100%
  • Field effect transistors 70%
  • Field Effect 65%
  • Nanosheet 54%
  • Etching 47%
  43 引文 斯高帕斯（Scopus）

• Investigation of a copper–nickel alloy resistor using co-electrodeposition

  Lee, W. H. & Chung, K. C., 2020 5月 1, 於: Journal of Applied Electrochemistry. 50, 5, p. 535-547 13 p.

  研究成果: Article › 同行評審

  • Electrodeposition 100%
  • Resistors 75%
  • Alloy 54%
  • Annealing 38%
  • Lattice constants 28%
  8 引文 斯高帕斯（Scopus）
• 2019

  Characteristic of high frequency Fe-Si-Cr material for motor application by selective laser melting

  Jhong, K. J., Chang, T. W., Lee, W. H., Tsai, M. C. & Jiang, I. H., 2019 3月 1, 於: AIP Advances. 9, 3, 035317.

  研究成果: Article › 同行評審

  開啟存取

  • electric motors 100%
  • melting 53%
  • electromagnetic properties 40%
  • eddy currents 37%
  • printing 33%
  18 引文 斯高帕斯（Scopus）

• Effect of annealing conditions on dopants activation and stress conservation in silicon-germanium

  Kuo, T. C., Jhong, K. J., Lin, C. W. & Lee, W. H., 2019 1月 1, 於: AIP Advances. 9, 1, 015110.

  研究成果: Article › 同行評審

  開啟存取

  • conservation 100%
  • germanium 94%
  • activation 85%
  • annealing 64%
  • silicon 57%
  3 引文 斯高帕斯（Scopus）

• Effect of pretreatment on Al₂O₃ substrate by depositing Al₂O₃ film on the properties of Ni–Cr–Si based thin film resistor

  Chung, K. C. & Lee, W. H., 2019 5月 15, 於: Materials Chemistry and Physics. 234, p. 311-317 7 p.

  研究成果: Article › 同行評審

  • pretreatment 100%
  • resistors 93%
  • Resistors 88%
  • Aluminum oxide 87%
  • Thin films 86%
  6 引文 斯高帕斯（Scopus）

• Hierarchical Nanoparticle Assemblies Formed via One-Step Catalytic Stamp Pattern Transfer

  Hung, T. Y., Liu, J. A. C., Lee, W. H. & Li, J. R., 2019 1月 30, 於: ACS Applied Materials and Interfaces. 11, 4, p. 4667-4677 11 p.

  研究成果: Article › 同行評審

  • Nanoparticles 100%
  • Nanoparticle 50%
  • Geometry 16%
  • Raman scattering 13%
  • Polydimethylsiloxane 11%
  8 引文 斯高帕斯（Scopus）
• 2018

  Neutral beam and ICP etching of HKMG MOS capacitors: Observations and a plasma-induced damage model

  Kuo, T. C., Shih, T. L., Su, Y. H., Lee, W. H., Current, M. I. & Samukawa, S., 2018 4月 28, 於: Journal of Applied Physics. 123, 16, 161517.

  研究成果: Article › 同行評審

  • neutral beams 100%
  • metal oxide semiconductors 90%
  • capacitors 76%
  • etching 66%
  • damage 62%
  4 引文 斯高帕斯（Scopus）
• 2017

  A study on Cu particles coated with nano-silver by a replacement reaction between silver nitrate and copper particles

  Lee, T. K., Chiang, C. S. & Lee, W. H., 2017 1月 1, 於: Journal of Nanoscience and Nanotechnology. 17, 6, p. 4157-4161 5 p.

  研究成果: Article › 同行評審

  • silver nitrates 100%
  • Nitrates 83%
  • Silver 72%
  • silver 54%
  • Copper powder 54%
  4 引文 斯高帕斯（Scopus）

• Contrasting conduction mechanisms of two internal barrier layer capacitors: (Mn, Nb)-doped SrTiO₃ and CaCu₃Ti₄O₁₂

  Tsuji, K., Chen, W. T., Guo, H., Lee, W. H., Guillemet-Fritsch, S. & Randall, C. A., 2017 2月 14, 於: Journal of Applied Physics. 121, 6, 064107.

  研究成果: Article › 同行評審

  開啟存取

  • barrier layers 100%
  • capacitors 80%
  • conduction 61%
  • traps 34%
  • grain boundaries 34%
  16 引文 斯高帕斯（Scopus）

• Cu-Induced Dielectric Breakdown of Porous Low-Dielectric-Constant Film

  Cheng, Y. L., Lee, C. Y., Huang, Y. L., Sun, C. R., Lee, W. H., Chen, G. S., Fang, J. S. & Phan, B. T., 2017 6月 1, 於: Journal of Electronic Materials. 46, 6, p. 3627-3633 7 p.

  研究成果: Article › 同行評審

  • Dielectric films 100%
  • Dielectric Film 98%
  • Electric breakdown 76%
  • Permittivity 67%
  • Low-k dielectric 66%
  2 引文 斯高帕斯（Scopus）

• Effect of microwave annealing on electrical characteristics of TiN/Al/TiN/HfO₂/Si MOS capacitors

  Shih, T. L., Su, Y. H., Kuo, T. C., Lee, W. H. & Current, M. I., 2017 7月 3, 於: Applied Physics Letters. 111, 1, 012101.

  研究成果: Article › 同行評審

  • capacitors 100%
  • microwaves 77%
  • annealing 68%
  • oxides 28%
  • traps 25%
  14 引文 斯高帕斯（Scopus）

• Effect of tungsten incorporation in cobalt tungsten alloys as seedless diffusion barrier materials

  Su, Y. H., Kuo, T. C., Lee, W. H., Wang, Y. S., Hung, C. C., Tseng, W. H., Wei, K. H. & Wang, Y. L., 2017 3月 5, 於: Microelectronic Engineering. 171, p. 25-30 6 p.

  研究成果: Article › 同行評審

  • Tungsten alloys 100%
  • Cobalt alloys 97%
  • Diffusion barriers 95%
  • tungsten alloys 88%
  • cobalt alloys 88%
  8 引文 斯高帕斯（Scopus）

• Effects of annealing pressure on microstructure and conversion efficiency for electrodeposited CuInSe₂ absorbers

  Lee, W. H., Chang, T. W. & Su, Y. H., 2017, 於: Journal of Nanoscience and Nanotechnology. 17, 1, p. 773-779 7 p.

  研究成果: Article › 同行評審

  • Conversion efficiency 100%
  • Annealing 94%
  • absorbers 78%
  • Solar Cell 65%
  • Microstructure 64%

• Fabrication of In_0.75Zn_1.5Sn_1.0 (IZTO) thin-film transistors using solution-processable materials and PZT inkjet-printing

  Lee, T. K., Liuand, C. T. & Lee, W. H., 2017, 於: Journal of Nanoscience and Nanotechnology. 17, 1, p. 363-369 7 p.

  研究成果: Article › 同行評審

  • Thin film transistors 100%
  • Lead zirconate titanate 95%
  • printing 76%
  • Printing 75%
  • transistors 62%
• 2016

  A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization

  Kuo, T. C., Su, Y. H., Lee, W. H., Liao, W. H., Wang, Y. S., Hung, C. C. & Wang, Y. L., 2016 8月 16, 於: Microelectronic Engineering. 162, p. 27-33 7 p.

  研究成果: Article › 同行評審

  • Ruthenium 100%
  • ruthenium 81%
  • Metallizing 76%
  • Plating 74%
  • plating 73%
  11 引文 斯高帕斯（Scopus）

• Effect of annealing temperature on electrical and reliability characteristics of HfO₂/porous low-k dielectric stacks

  Cheng, Y. L., Kao, K. C., Chen, G. S., Fang, J. S., Sun, C. R. & Lee, W. H., 2016 8月 16, 於: Microelectronic Engineering. 162, p. 34-39 6 p.

  研究成果: Article › 同行評審

  • Low-k dielectric 100%
  • Annealing 66%
  • Dielectric Material 59%
  • annealing 40%
  • Porosity 39%
  3 引文 斯高帕斯（Scopus）

• Effect of H₂/He plasma treatment on porous low dielectric constant materials

  Cheng, Y. L., Haung, C. W., Hung, W. J., Sun, C. R. & Lee, W. H., 2016 12月 25, 於: Surface and Coatings Technology. 308, p. 182-188 7 p.

  研究成果: Article › 同行評審

  • Permittivity 100%
  • Plasmas 91%
  • Dielectric Constant 91%
  • permittivity 69%
  • Plasma 61%
  6 引文 斯高帕斯（Scopus）

• Environmentally-friendly, Pb-free Cu front electrode for Si-based solar cell applications

  Lee, W. H., Lee, T. K. & Lo, C. Y., 2016 11月 25, 於: Journal of Alloys and Compounds. 686, p. 339-346 8 p.

  研究成果: Article › 同行評審

  • Solar cells 100%
  • Solar Cell 81%
  • Glass 75%
  • Electrodes 72%
  • Ohmic contacts 71%
  9 引文 斯高帕斯（Scopus）

• High dopant activation of phosphorus in Ge crystal with high-temperature implantation and two-step microwave annealing

  Shih, T. L., Su, Y. H. & Lee, W. H., 2016 9月 19, 於: Applied Physics Letters. 109, 12, 122103.

  研究成果: Article › 同行評審

  • phosphorus 100%
  • implantation 91%
  • activation 81%
  • microwaves 69%
  • annealing 61%
  8 引文 斯高帕斯（Scopus）

• Valence and electronic trap states of manganese in SrTiO₃-based colossal permittivity barrier layer capacitors

  Tsuji, K., Chen, W. T., Guo, H., Chen, X. M., Lee, T. K., Lee, W. H. & Randall, C. A., 2016, 於: RSC Advances. 6, 94, p. 92127-92133 7 p.

  研究成果: Article › 同行評審

  • Electron energy loss spectroscopy 100%
  • Manganese 99%
  • Deep level transient spectroscopy 98%
  • Permittivity 92%
  • Capacitor 85%
  12 引文 斯高帕斯（Scopus）
• 2015

  A study on the diffuse mechanism and the barrier property of copper manganese alloy on tantalum

  Su, Y. S., Lee, W. H., Chang, S. C. & Wang, Y. L., 2015 5月 1, 於: IEEE Journal of the Electron Devices Society. 3, 3, p. 284-290 7 p., 6912929.

  研究成果: Article › 同行評審

  開啟存取

  • Manganese alloys 100%
  • Tantalum 87%
  • Copper alloys 73%
  • Manganese 71%
  • Atoms 38%
  1 引文 斯高帕斯（Scopus）

• Endurance of NiCuZn ferrite chip inductors

  Chiang, C. S., Chai, Y. L., Chien, S. F. & Lee, W. H., 2015 12月, 於: Japanese journal of applied physics. 54, 12, 123001.

  研究成果: Article › 同行評審

  • endurance 100%
  • inductors 99%
  • Plating 93%
  • plating 92%
  • Ferrite 81%
  1 引文 斯高帕斯（Scopus）

• Improving conversion efficiency of co-electrodeposited CuInSe₂ thin film solar cells with substrate and solution heating

  Chiang, C. S., Lee, W. H., Chang, T. W. & Su, Y. H., 2015 6月 1, 於: Journal of Applied Electrochemistry. 45, 6, p. 549-556 8 p.

  研究成果: Article › 同行評審

  • Thin film solar cells 100%
  • Conversion efficiency 69%
  • Solar Cell 56%
  • Heating 47%
  • Substrates 46%
  6 引文 斯高帕斯（Scopus）

• Investigation of barrier property of copper manganese alloy on ruthenium

  Su, Y. H., Wu, S. A., Wu, C. Y., Wang, Y. L. & Lee, W. H., 2015 3月 1, 於: IEEE Transactions on Device and Materials Reliability. 15, 1, p. 47-53 7 p., 6998936.

  研究成果: Article › 同行評審

  • Manganese alloys 100%
  • Ruthenium 89%
  • Copper alloys 73%
  • Electric properties 31%
  • Atoms 30%
  3 引文 斯高帕斯（Scopus）

• Stable temperature dielectrics of (Ba,Ca)(Ti,Zr)O₃-based MLCCs with Non-core-shell structure by novel sintering approach

  Wang, S. H., Lee, W. H., Tsai, Y. L. & Lee, Y. C., 2015 1月 1, 於: International Journal of Applied Ceramic Technology. 12, S1, p. E25-E31

  研究成果: Article › 同行評審

  • Ceramic Capacitor 100%
  • Ceramic capacitors 92%
  • Shell 65%
  • Multilayers 60%
  • Temperature 59%
  4 引文 斯高帕斯（Scopus）

• Ultra low-temperature microwave annealing for ultra-shallow junctions and P-MOS devices

  Tsai, M. H., Wu, C. T., Hu, S. Y. & Lee, W. H., 2015, 於: International Journal of Nanotechnology. 12, 1-2, p. 27-37 11 p.

  研究成果: Article › 同行評審

  • MOS devices 100%
  • cryogenic temperature 77%
  • Annealing 71%
  • Microwaves 63%
  • Microwave 58%
• 2014

  Activation of boron and recrystallization in Ge preamorphization implant structure of ultra shallow junctions by microwave annealing

  Tsai, M. H., Wu, C. T. & Lee, W. H., 2014 4月, 於: Japanese journal of applied physics. 53, 4, 041302.

  研究成果: Article › 同行評審

  • Boron 100%
  • Annealing 87%
  • Chemical activation 79%
  • Microwaves 77%
  • boron 75%
  11 引文 斯高帕斯（Scopus）

• A study of back electrode stacked with low cost reflective layers for high-efficiency thin-film silicon solar cell

  Chang, T. W., Liu, C. T., Lee, W. H. & Hsiao, Y. J., 2014 8月 1, 於: Journal of Solar Energy Engineering, Transactions of the ASME. 136, 3, 031002-1.

  研究成果: Article › 同行評審

  • Thin film solar cells 100%
  • Silicon solar cells 89%
  • Electrodes 50%
  • Paint 43%
  • Quantum efficiency 40%
  2 引文 斯高帕斯（Scopus）

• A study of Cu/CuMn barrier for 22-nm semiconductor manufacturing

  Wu, S. A., Cheng, Y. L., Wu, C. Y. & Lee, W. H., 2014 3月, 於: IEEE Transactions on Device and Materials Reliability. 14, 1, p. 286-290 5 p., 6515175.

  研究成果: Article › 同行評審

  • Semiconductor materials 100%
  • Annealing 89%
  • Semiconductor 85%
  • Atoms 70%
  • Liquid Film 54%
  7 引文 斯高帕斯（Scopus）

• Effects of photo-assisted electrodeposited on CuInSe₂ thin films

  Chang, T. W., Lee, W. H., Su, Y. H. & Hsiao, Y. J., 2014 12月 1, 於: Nanoscale Research Letters. 9, 1, 660.

  研究成果: Article › 同行評審

  開啟存取

  • Electrodeposition 100%
  • electrodeposition 81%
  • Thin films 73%
  • Crystalline materials 54%
  • thin films 40%
  9 引文 斯高帕斯（Scopus）

• Improvement on conversion efficiency of CIGS thin film solar cell using electrochemical depleting

  Chang, T. W., Su, Y. H. & Lee, W. H., 2014 1月 1, 於: Journal of the Electrochemical Society. 161, 12, p. E167-E172

  研究成果: Article › 同行評審

  • Thin film solar cells 100%
  • Conversion efficiency 69%
  • Solar Cell 56%
  • Light absorption 33%
  • Raman spectroscopy 29%
  2 引文 斯高帕斯（Scopus）

• Study on (Ba,Ca)(Ti,Zr)O₃ dielectric cofired with copper electrode

  Wang, S. H., Tsai, Y. L. & Lee, W. H., 2014 6月, 於: Japanese journal of applied physics. 53, 6, 061501.

  研究成果: Article › 同行評審

  • Copper 100%
  • Electrodes 94%
  • copper 87%
  • electrodes 76%
  • Dielectric losses 44%
  4 引文 斯高帕斯（Scopus）

• Synthesis of cuinse₂ thin films from electrodeposited Cu₁₁ in₉ precursors by two-step annealing

  Chang, T. W., Hu, S. Y. & Lee, W. H., 2014 1月 25, 於: Journal of Electrochemical Science and Engineering. 4, 1, p. 27-35 9 p.

  研究成果: Article › 同行評審

  開啟存取

  • Selenide 88%
  • Annealing 76%
  • Thin films 72%
  • Copper 62%
  • Raman scattering 18%
  3 引文 斯高帕斯（Scopus）
• 2013

  An electroplating method for copper plane twin boundary manufacturing

  Wang, Y. S., Lee, W. H., Chang, S. C., Nian, J. N. & Wang, Y. L., 2013 10月 1, 於: Thin Solid Films. 544, p. 157-161 5 p.

  研究成果: Article › 同行評審

  • Twin Boundary 100%
  • electroplating 75%
  • Electrons 63%
  • Electrodeposition 52%
  • manufacturing 52%
  23 引文 斯高帕斯（Scopus）

• A study of reducing the residual stresses for multilayer chip inductors

  Chien, S. F., Tsai, Y. L., Lee, Y. C. & Lee, W. H., 2013 6月, 於: Japanese journal of applied physics. 52, 6 PART 1, 063002.

  研究成果: Article › 同行評審

  • inductors 100%
  • Silver 91%
  • Multilayers 81%
  • residual stress 77%
  • Residual stresses 73%

• Characterization of CuInSe₂ thin films grown by photo-assisted electrodeposition

  Su, Y. H., Chang, T. W., Lee, W. H. & Tseng, B. H., 2013 5月 15, 於: Thin Solid Films. 535, 1, p. 343-347 5 p.

  研究成果: Article › 同行評審

  • Electrodeposition 100%
  • electrodeposition 81%
  • Thin films 73%
  • Crystalline materials 61%
  • Atomic force microscopy 49%
  11 引文 斯高帕斯（Scopus）

• Effects of (002) β-Ta barrier on copper chemical mechanical polishing behavior

  Wang, Y. S., Chen, K. W., Cheng, M. Y., Lee, W-S. & Wang, Y. L., 2013 2月 1, 於: Thin Solid Films. 529, p. 435-438 4 p.

  研究成果: Article › 同行評審

  • Chemical mechanical polishing 100%
  • Polishing 88%
  • polishing 80%
  • Copper 62%
  • copper 54%
  4 引文 斯高帕斯（Scopus）

• High efficiency of dye-sensitized solar cells based on ruthenium and metal-free dyes

  Lee, C. L., Lee, W. H. & Yang, C. H., 2013, 於: International Journal of Photoenergy. 2013, 250397.

  研究成果: Article › 同行評審

  開啟存取

  • Ruthenium 100%
  • adsorbents 84%
  • ruthenium 81%
  • Adsorbents 79%
  • dyes 57%
  10 引文 斯高帕斯（Scopus）

• Investigation the electroplating behavior of self formed cumn barrier

  Wu, C. Y., Lee, W. H., Chang, S. C. & Wang, Y. L., 2013 8月 1, 於: Journal of Nanoscience and Nanotechnology. 13, 8, p. 5800-5806 7 p.

  研究成果: Article › 同行評審

  • electroplating 98%
  • Manganese 97%
  • manganese 82%
  • Electrodeposition 68%
  • Copper 40%
  2 引文 斯高帕斯（Scopus）

• StSt/TiO₂ compact layer/TiO₂ triple-layered conducting substrates for large active area dye-sensitized solar cells

  Lee, C. L., Lee, W. H., Li, W. T., Yang, C. H. & Kao, P. C., 2013 7月, 於: Materials Research Bulletin. 48, 7, p. 2625-2629 5 p.

  研究成果: Article › 同行評審

  • stainless steels 61%
  • dyes 60%
  • Stainless steel 60%
  • solar cells 51%
  • Substrates 48%
  4 引文 斯高帕斯（Scopus）

• The effects of co-sensitization in dye-sensitized solar cells

  Lee, C. L., Lee, W. H. & Yang, C. H., 2013 5月, 於: Journal of Materials Science. 48, 9, p. 3448-3453 6 p.

  研究成果: Article › 同行評審

  • Ruthenium 78%
  • Colorant 77%
  • Conversion efficiency 72%
  • Photons 40%
  • Electrons 34%
  21 引文 斯高帕斯（Scopus）

• Triazoloisoquinoline-based/ruthenium-hybrid sensitizer for efficient dye-sensitized solar cells

  Lee, C. L., Lee, W. H. & Yang, C. H., 2013, 於: International Journal of Photoenergy. 2013, 984516.

  研究成果: Article › 同行評審

  開啟存取

  • Ruthenium 100%
  • ruthenium 81%
  • Colorant 74%
  • Conversion efficiency 69%
  • dyes 57%
  1 引文 斯高帕斯（Scopus）