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A machine learning model for flank wear prediction in face milling of Inconel 718
Banda, T., Liu, Y. C., Farid, A. A. & Lim, C. S., 2023 5月, 於: International Journal of Advanced Manufacturing Technology. 126, 3-4, p. 935-945 11 p.研究成果: Article › 同行評審
1 引文 斯高帕斯（Scopus） -
B2-strengthened Al-Co-Cr-Fe-Ni high entropy alloy with high ductility
Yen, S. Y., Liu, Y. C., Chu, S. H., Chang, C. W., Lin, S. K. & Tsai, M. H., 2022 10月 15, 於: Materials Letters. 325, 132828.研究成果: Article › 同行評審
7 引文 斯高帕斯（Scopus） -
Computational thermodynamics-assisted design of nitrate-based phase change materials for waste heat recovery
Huang, W. Y., Liu, Y. C., Lin, S. K. & Chen, W. H., 2022 8月, 於: International Journal of Energy Research. 46, 10, p. 14452-14461 10 p.研究成果: Article › 同行評審
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High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling1
Yang, C. H., Liu, Y. C., Hirata, Y., Nishikawa, H. & Lin, S. K., 2022, 於: Science and Technology of Welding and Joining. 27, 7, p. 572-578 7 p.研究成果: Article › 同行評審
1 引文 斯高帕斯（Scopus） -
High thermal stability Cu-to-Cu joints fabricated by using Ga-based paste
Huang, T. H., Liu, Y. C., Cheng, C. E., Huang, C. W., Yang, C. H., Lin, C. F., Wang, C. C. & Lin, S. K., 2022, 2022 International Conference on Electronics Packaging, ICEP 2022. Institute of Electrical and Electronics Engineers Inc., p. 127-128 2 p. (2022 International Conference on Electronics Packaging, ICEP 2022).研究成果: Conference contribution