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查看啟用 Yu-Chen Liu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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Manufacturing of PEEK-PDMS Composite Materials for Intervertebral Disc Implants
Mie, H. C., Liu, Y-C. & Mizuno, J., 2024, 2024 International Conference on Electronics Packaging, ICEP 2024. Institute of Electrical and Electronics Engineers Inc., p. 23-24 2 p. (2024 International Conference on Electronics Packaging, ICEP 2024).研究成果: Conference contribution
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Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn–Bi low-temperature solders
Yang, C. H., Liu, Y. C., Nishikawa, H. & Lin, S. K., 2024 5月 1, 於: Journal of Materials Research and Technology. 30, p. 16-24 9 p.研究成果: Article › 同行評審
開啟存取2 引文 斯高帕斯（Scopus） -
A machine learning approach to explore tensile properties of low-temperature solders
Liu, Y. C., Kholik, A. & Lin, S. K., 2023, 2023 International Conference on Electronics Packaging, ICEP 2023. Institute of Electrical and Electronics Engineers Inc., p. 71-72 2 p. (2023 International Conference on Electronics Packaging, ICEP 2023).研究成果: Conference contribution
1 引文 斯高帕斯（Scopus） -
A machine learning model for flank wear prediction in face milling of Inconel 718
Banda, T., Liu, Y. C., Farid, A. A. & Lim, C. S., 2023 5月, 於: International Journal of Advanced Manufacturing Technology. 126, 3-4, p. 935-945 11 p.研究成果: Article › 同行評審
開啟存取4 引文 斯高帕斯（Scopus） -
Characterizing the flux effect on the irradiation embrittlement of reactor pressure vessel steels using machine learning
Liu, Y. C., Morgan, D., Yamamoto, T. & Odette, G. R., 2023 9月 1, 於: Acta Materialia. 256, 119144.研究成果: Article › 同行評審
7 引文 斯高帕斯（Scopus）