個人檔案
與 UN SDG 相關的專業知識
聯合國會員國於 2015 年同意 17 項全球永續發展目標 (SDG)，以終結貧困、保護地球並確保全體的興盛繁榮。此人的作品有助於以下永續發展目標：
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SDG 3 良好的健康和福祉 -
SDG 7 經濟實惠的清潔能源 -
SDG 9 產業、創新與基礎設施
指紋
查看啟用 Yu-Chen Liu 的研究主題。這些主題標籤來自此人的作品。共同形成了獨特的指紋。
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過去五年中的合作和熱門研究領域
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Lattice-Matched InAlN/GaN D-Mode MIS-HEMT on SiC for High-Current Operation and Low-Loss 100-V Double-Pulse Switching
Huang, S. J., Shen, T. Y., Liu, Y. C., Chen, Y. W., Chen, J. K., Lin, C. Y., Wang, Z. H., Yoda, T., Ohba, T., Wu, M. C. & Su, Y. K., 2026, (Accepted/In press) 於: IEEE Access.研究成果: Article › 同行評審
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Microstructure and thermal stability of 316 stainless steel in nitrate-based phase change materials for thermal energy storage
Kung, K. C., Chen, H. C., Liu, Y. C., Lin, S. K. & Chen, W.-H., 2026 3月, 於: Materials Characterization. 233, 116104.研究成果: Article › 同行評審
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A Machine Learning Model for Vickers Hardness of Sn-In-X Low-Temperature Solder
Kuo, H. W. & Liu, Y. C., 2025, 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025. Institute of Electrical and Electronics Engineers Inc., p. 49-50 2 p. (2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025).研究成果: Conference contribution
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Critical lattice strain for electromigration - revisiting the Blech critical product
Liu, Y. C., Lin, K. H., Chiu, S. J., Lee, J. J., Lin, Y. G. & Lin, S. K., 2025 10月, 於: Materials Characterization. 228, 115384.研究成果: Article › 同行評審
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Design High Shear Strength Sn-Bi-X Low-Temperature Solders on Cu Substrate using a Machine Learning Approach
Wu, P. Z. & Liu, Y. C., 2025, 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025. Institute of Electrical and Electronics Engineers Inc., p. 31-32 2 p. (2025 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025).研究成果: Conference contribution