3-D corner delamination analysis for fan-out chip scale package

Tz-Cheng Chiu, Huang Chun Lin, Stoke Chen, G. S. Shen

研究成果: Conference contribution

摘要

The problem of a corner delamination in a fan-out chip scale package under thermomechanical load is investigated. The fracture mechanics parameters, including the stress intensity factors and the strain energy release rate, for a quarter-circular corner delamination between silicon die and fan-out redistribution polyimide layer are obtained by using numerical finite element approach with 3-D virtual crack closure technique (VCCT). Results of the analysis indicated that contact between crack faces occurs under temperature cycling condition. The delamination driving forces are mode-II and - III dominant. In addition, the strain energy release rate is highest near the location where the delamination crack front intersects die-to-molding compound interface. Parametric study is also conducted to investigate the effects of material properties and geometrical dimensions on the delamination driving forces. The calculated fracture mechanics parameters may be combined with the experimental data on the resistance to interface fracture for predicting reliability of the package.

原文English
主出版物標題Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008
頁面687-693
頁數7
出版狀態Published - 2008 十二月 1
事件41st Annual International Symposium on Microelectronics, IMAPS 2008 - Providence, RI, United States
持續時間: 2008 十一月 22008 十一月 6

出版系列

名字Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008

Other

Other41st Annual International Symposium on Microelectronics, IMAPS 2008
國家/地區United States
城市Providence, RI
期間08-11-0208-11-06

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程

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