3D analyses of buildings under vertical component of earthquakes

S. H. Ju, C. W. Liu, K. Z. Wu

研究成果: Article同行評審

6 引文 斯高帕斯(Scopus)

指紋 深入研究「3D analyses of buildings under vertical component of earthquakes」主題。共同形成了獨特的指紋。

Chemical Compounds

Engineering & Materials Science