3D-IC BISR for stacked memories using cross-die spares

Chun Chuan Chi, Yung Fa Chou, Ding Ming Kwai, Yu Ying Hsiao, Cheng Wen Wu, Yu Tsao Hsing, Li Ming Denq, Tsung Hsiang Lin

研究成果: Conference contribution

9 引文 斯高帕斯(Scopus)

摘要

3D ICs based on Through-Silicon-Vias (TSVs) enable the stacking of logic and memory dies to manufacture chips with higher performance, lower power, and smaller form factor. To improve the yield of the memory dies in 3D ICs, this paper proposes aBuilt-In Self-Repair (BISR) architecture which allows the sharing of spares between different layers of dies. The corresponding pre-bond (before the memory dies are bonded together) and post-bond (after the memory dies are bonded together) test flow is presented as well. In order to maximize the yield gain introduced by the cross-die spares, a die matching algorithm is proposed to determine which dies should be stacked together, so that the spare sharing can be most ef~cient. Experimental results show that the area overhead of the proposed BISR circuit is only 2.43%, which can be smaller if larger logic and memory dies are adopted, and the yield gain achieved by cross-die spare sharing can be up to 23%.

原文English
主出版物標題2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers
DOIs
出版狀態Published - 2012 七月 25
事件2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Hsinchu, Taiwan
持續時間: 2012 四月 232012 四月 25

出版系列

名字2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers

Other

Other2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012
國家Taiwan
城市Hsinchu
期間12-04-2312-04-25

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture

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