3D-IC BISR for stacked memories using cross-die spares

Chun Chuan Chi, Yung Fa Chou, Ding Ming Kwai, Yu Ying Hsiao, Cheng Wen Wu, Yu Tsao Hsing, Li Ming Denq, Tsung Hsiang Lin

研究成果: Conference contribution

11 引文 斯高帕斯（Scopus）

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Engineering & Materials Science