3D integration opportunities, issues, and solutions: A designer's perspective

Ding Ming Kwai, Cheng Wen Wu

研究成果: Conference contribution

8 引文 斯高帕斯(Scopus)

摘要

As the development cost of a typical system-on-chip (SOC) using state-of-the-art technology soars, more and more people turn to three-dimensional (3D) integration for possible alternatives that provide better or equal performance with lower cost. Stacking dies using the through-silicon-via (TSV) technology has been considered one of the most promising solutions to extending the life of Moore's law in semiconductor industry, but of course there are problems to be solved before the infrastructure can be set up to support the industry for manufacturing TSV-based 3D integrated devices. In this paper we will discuss the opportunities, design and manufacturing issues, and possible solutions for 3D integrated devices, from a designer's perspective.

原文English
主出版物標題Lithography Asia 2009
DOIs
出版狀態Published - 2009 十二月 1
事件2009 Lithography Asia Conference - Taipei, Taiwan
持續時間: 2009 十一月 182009 十一月 19

出版系列

名字Proceedings of SPIE - The International Society for Optical Engineering
7520
ISSN(列印)0277-786X

Other

Other2009 Lithography Asia Conference
國家Taiwan
城市Taipei
期間09-11-1809-11-19

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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