3D integration opportunities, issues, and solutions: A designer's perspective

Ding Ming Kwai; Cheng Wen Wu

doi:10.1117/12.845747

3D integration opportunities, issues, and solutions: A designer's perspective

Ding Ming Kwai, Cheng Wen Wu

電機工程學系

研究成果: Conference contribution

8 引文斯高帕斯（Scopus）

摘要

As the development cost of a typical system-on-chip (SOC) using state-of-the-art technology soars, more and more people turn to three-dimensional (3D) integration for possible alternatives that provide better or equal performance with lower cost. Stacking dies using the through-silicon-via (TSV) technology has been considered one of the most promising solutions to extending the life of Moore's law in semiconductor industry, but of course there are problems to be solved before the infrastructure can be set up to support the industry for manufacturing TSV-based 3D integrated devices. In this paper we will discuss the opportunities, design and manufacturing issues, and possible solutions for 3D integrated devices, from a designer's perspective.

原文	English
主出版物標題	Lithography Asia 2009
DOIs	https://doi.org/10.1117/12.845747
出版狀態	Published - 2009 十二月 1
事件	2009 Lithography Asia Conference - Taipei, Taiwan 持續時間: 2009 十一月 18 → 2009 十一月 19

出版系列

名字	Proceedings of SPIE - The International Society for Optical Engineering
卷	7520
ISSN（列印）	0277-786X

Other

Other	2009 Lithography Asia Conference
國家	Taiwan
城市	Taipei
期間	09-11-18 → 09-11-19

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.845747

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引用此

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