3D printed high-entropy plasmonic structures for cutting-edge 6G modulation components on silicon wafers via electromagnetically induced reflection

In the field of high-frequency signal transmission, reducing signal absorption is crucial for efficient long-distance communication. The traditional metamaterial manufacturing technology has disadvantages such as long processing time and expensive consumables in the terahertz (THz) frequency band. To overcome these challenges, we propose a solution based on electromagnetically induced reflection (EIR) and plasma simulation using 3D printing techniques. In traditional metamaterial fabrication, gold is often used as a thin-film material. However, the high cost of the gold manufacturing process has prompted us to explore alternative materials. Compared with traditional metals, we chose a high-entropy alloy film composed of niobium, molybdenum, tantalum, and tungsten in a certain proportion, and then combined with silver. At 0.375 THz, the absorption rate is 15% higher than that of the gold film, highlighting the superiority of the silver-HEA combination. To simplify the manufacturing process, we use 3D printing technology with the aim of reducing processing time, increasing design freedom and reducing manufacturing costs. In the terahertz frequency range, the silver-high-entropy alloy combination has excellent performance for the structures designed in this paper. Exhibits strong resonances at 0.375 THz and 0.64 THz. The absorption rates are about 99% and 90%, respectively. In addition, the frequency band between the absorption peaks exhibits an excellent reflectivity of about 99%.Using EIR-based plasma simulation and 3D printing techniques, we developed a solution to mitigate high-frequency signal absorption. Our thin films exhibit strong resonance, high absorptivity, and excellent reflectivity in this structure, surpassing the performance of gold-based conventional metamaterials. This advance holds great promise for optimizing signal transmission and facilitating efficient long-distance communications in the future.