3D printing of low melting temperature alloys by fused deposition modeling

P. C. Hsieh, C. H. Tsai, B. H. Liu, W. C.J. Wei, A. B. Wang, R. C. Luo

研究成果: Conference contribution

6 引文 斯高帕斯(Scopus)

摘要

Fused deposition modeling (FDM) is the most commonly used 3D printing technique that directly extrudes molten materials layer by layer and overcomes the constraints of fabricating complicate geometries. This technique is fast, relatively easy to perform, thus more economical compared to other 3D printing methods. However, the materials that can be extruded by FDM are limited to polymers at the present time. This study aimed to develop a fused deposition modeling for metals (FDMm) system that can deposit metallic structures directly on a platform. An extruding nozzle designed by the researchers was connected to a commercial fused deposition machine to extend the materials selection from polymers to low melting temperature metals. Continuous Sn99.3Cu0.7 lead free solder and Sn60Pb40 lead free solder were successfully extruded in a linear shape and showed that the fabrication parameters for metals are significantly different from those for polymers. Controlling the fabrication parameters also allowed the deposition of metal at a uniform geometry. Optical microscopy and scanning electron microscopy were used to analyze the FDMm-fabricated samples. Good layer to layer bonding and overall material strength can be achieved by fine-tuning of process parameters.

原文English
主出版物標題Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1138-1142
頁數5
ISBN(電子)9781467380751
DOIs
出版狀態Published - 2016 五月 19
事件IEEE International Conference on Industrial Technology, ICIT 2016 - Taipei, Taiwan
持續時間: 2016 三月 142016 三月 17

出版系列

名字Proceedings of the IEEE International Conference on Industrial Technology
2016-May

Other

OtherIEEE International Conference on Industrial Technology, ICIT 2016
國家Taiwan
城市Taipei
期間16-03-1416-03-17

    指紋

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering

引用此

Hsieh, P. C., Tsai, C. H., Liu, B. H., Wei, W. C. J., Wang, A. B., & Luo, R. C. (2016). 3D printing of low melting temperature alloys by fused deposition modeling. 於 Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016 (頁 1138-1142). [7474915] (Proceedings of the IEEE International Conference on Industrial Technology; 卷 2016-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICIT.2016.7474915