尋找研究成果

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已選取的篩選器

出版年份

  • 2020
  • 2019
  • 2018
  • 2017
  • 2016
  • 2015
  • 2014
  • 2013
  • 2012
  • 2011

作者

  • Fei-Yi Hung
2014

Microstructure and electrical mechanism of Sn-xAg-Cu PV-ribbon for solar cells

Chen, K. J., Hung, F. Y., Lui, T. S., Chen, L. H., Qiu, D. W. & Chou, T. L., 2014 三月 25, 於 : Microelectronic Engineering. 116, p. 33-39 7 p.

研究成果: Article

9 引文 斯高帕斯(Scopus)
4 引文 斯高帕斯(Scopus)
2012
2015
3 引文 斯高帕斯(Scopus)
2020
開啟存取
2014
11 引文 斯高帕斯(Scopus)
3 引文 斯高帕斯(Scopus)
2011
5 引文 斯高帕斯(Scopus)
2014
2011

Embrittlement mechanism on tensile fracture of 7075 Al alloy with friction stir process (FSP)

Ku, M. H., Hung, F. Y., Lui, T. S. & Chen, L. H., 2011 一月 1, 於 : Materials Transactions. 52, 1, p. 112-117 6 p.

研究成果: Article

7 引文 斯高帕斯(Scopus)
2013

Tensile mechanical properties and brittle effect of austempered Cr-Mo alloy steel

Chen, C. Y., Hung, F-Y., Lui, T-S. & Chen, L. H., 2013 四月 26, 4th International Symposium on High-Temperature Metallurgical Processing - Held During the TMS 2013 Annual Meeting and Exhibition. p. 299-306 8 p. (TMS Annual Meeting).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2019
2013

Microstructure and chargedischarge characteristics of Ag-AgCl coated natural bamboo carbon

Wang, C. H., Hung, F. Y., Lui, T. S. & Chen, L. H., 2013 六月 18, 於 : Materials Transactions. 54, 6, p. 1018-1024 7 p.

研究成果: Article

4 引文 斯高帕斯(Scopus)
2012

Annealing effect and tensile interface fracture mechanism of pure silver bonding wires

Hsueh, H. W., Hung, F. Y., Lui, T. S. & Chen, L. H., 2012 五月 15, Extraction and Processing Division - 2012 EPD Congress - Held During the TMS 2012 Annual Meeting and Exhibition. p. 145-152 8 p. (TMS Annual Meeting).

研究成果: Conference contribution

2016

Electrical tensile test

Hsueh, H. W., Hung, F. Y., Lui, T. S. & Chen, L. H., 2016 一月 25, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 7390694. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).

研究成果: Conference contribution

2012

Effects of friction stir process on the tensile properties of AZ61 magnesium alloy at room temperature to 200°C

Chen, H. C., Lui, T-S., Chen, L. H. & Hung, F-Y., 2012 五月 15, Magnesium Technology 2012 - Held During TMS 2012 Annual Meeting and Exhibition. p. 525-529 5 p. (Magnesium Technology).

研究成果: Conference contribution

2016

Microstructures and mechanical properties of austempering SUS440 steel thin plates

Chen, C. Y., Hung, F. Y., Lui, T. S. & Chen, L. H., 2016 二月 15, 於 : Metals. 6, 2, 35.

研究成果: Article

1 引文 斯高帕斯(Scopus)
3 引文 斯高帕斯(Scopus)
2014
1 引文 斯高帕斯(Scopus)
2019
2013
4 引文 斯高帕斯(Scopus)
2018
2016

Wire bonding of Au-coated Ag wire: Bondwire properties, bondability and IMCs formation

Tseng, Y. W., Hung, F-Y. & Lui, T-S., 2016 一月 25, 20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015. Institute of Electrical and Electronics Engineers Inc., 7390675. (20th European Microelectronics and Packaging Conference and Exhibition: Enabling Technologies for a Better Life and Future, EMPC 2015).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2012
3 引文 斯高帕斯(Scopus)
2011
22 引文 斯高帕斯(Scopus)

Si nanowire-based humidity sensors prepared on glass substrate

Hsueh, H. T., Hsueh, T. J., Chang, S. J., Hung, F. Y., Weng, W. Y., Hsu, C. L. & Dai, B. T., 2011 十一月 2, 於 : IEEE Sensors Journal. 11, 11, p. 3036-3041 6 p., 5771029.

研究成果: Article

17 引文 斯高帕斯(Scopus)
2 引文 斯高帕斯(Scopus)

Growth mechanism and field emission characteristics of GaO/GaN nanotips using iodine-assisted enhanced focused ion beam etching

Hu, Z. S., Hung, F. Y., Chang, S. J., Huang, B. R., Lin, B. C., Chen, K. J., Chen, T. P. & Hsu, W. I., 2011 八月 1, 於 : Current Nanoscience. 7, 4, p. 594-597 4 p.

研究成果: Article

2 引文 斯高帕斯(Scopus)
2012

The crystallization characteristics and photoluminescence properties of ZnO/Ag nanoflower arrays

Hu, Z. S., Hung, F. Y., Chang, S. J. & Chen, K. J., 2012 十一月 19, Technical Digest - 25th International Vacuum Nanoelectronics Conference, IVNC 2012Om. p. 176-180 5 p. 6316893. (Technical Digest - 25th International Vacuum Nanoelectronics Conference, IVNC 2012).

研究成果: Conference contribution

2011

Nanostructural characteristics of oxide-cap GaN nanotips by iodine-gallium ions etching

Hu, Z. S., Hung, F. Y., Chang, S. J., Huang, B. R., Lin, B. C., Chen, K. J. & Hsu, W. I., 2011 二月 3, 於 : Journal of Alloys and Compounds. 509, 5, p. 2360-2363 4 p.

研究成果: Article

6 引文 斯高帕斯(Scopus)
2016
2 引文 斯高帕斯(Scopus)
2011

CuO nanowire-based humidity sensors prepared on glass substrate

Hsueh, H. T., Hsueh, T. J., Chang, S-J., Hung, F-Y., Tsai, T. Y., Weng, W. Y., Hsu, C. L. & Dai, B. T., 2011 八月 1, 於 : Sensors and Actuators, B: Chemical. 156, 2, p. 906-911 6 p.

研究成果: Article

71 引文 斯高帕斯(Scopus)
2017
4 引文 斯高帕斯(Scopus)
5 引文 斯高帕斯(Scopus)
2018
4 引文 斯高帕斯(Scopus)
2019
開啟存取
開啟存取
1 引文 斯高帕斯(Scopus)
2017
10 引文 斯高帕斯(Scopus)
4 引文 斯高帕斯(Scopus)
2012

Building materials effects of al content and physical properties on the electromagnetic interference shielding of sn based coating thin layers

Hung, F. S., Hung, F-Y., Chiang, C. M. & Lui, T-S., 2012 一月 1, Intelligent Materials, Applied Mechanics and Design Science, IMAMD2011. 3 編輯 p. 142-151 10 p. (Applied Mechanics and Materials; 卷 142, 編號 3).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)
2020
2012

Charge-discharge mechanism of MgC powders and Mg-Li Alloy thin film materials

Chen, Y. T., Hung, F. Y., Lui, T. S., Xiao, R. S., Tseng, Y. W. & Wang, C. H., 2012 五月 15, Magnesium Technology 2012 - Held During TMS 2012 Annual Meeting and Exhibition. p. 493-497 5 p. (Magnesium Technology).

研究成果: Conference contribution

2017
2011
7 引文 斯高帕斯(Scopus)
2019
開啟存取
2012
4 引文 斯高帕斯(Scopus)
2014
5 引文 斯高帕斯(Scopus)
2017