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3D B-spline curve fitting with MMS image features of road lines

Li, R. Y., Hsieh, C. Y. & Tseng, Y. H., 2009 十二月 1, 30th Asian Conference on Remote Sensing 2009, ACRS 2009. p. 1895-1900 6 p. (30th Asian Conference on Remote Sensing 2009, ACRS 2009; 卷 3).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

3D buckling analysis of FGM sandwich plates under bi-axial compressive loads

Wu, C. P. & Liu, W. L., 2014 一月 1, 於 : Smart Structures and Systems. 13, 1, p. 111-135 25 p.

研究成果: Article

2 引文 斯高帕斯(Scopus)

3D building model retrieval for point cloud modeling

Hsu, P. C., Chen, J. Y. & Lin, C-H., 2011 十二月 1, 32nd Asian Conference on Remote Sensing 2011, ACRS 2011. p. 2243-2248 6 p. (32nd Asian Conference on Remote Sensing 2011, ACRS 2011; 卷 4).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

3D building model retrieval system based on LiDAR point cloud filling and encoding

Chen, J. Y., Hsu, P. C. & Lin, C-H., 2013 一月 1, 34th Asian Conference on Remote Sensing 2013, ACRS 2013. Asian Association on Remote Sensing, p. 261-268 8 p. (34th Asian Conference on Remote Sensing 2013, ACRS 2013; 卷 1).

研究成果: Conference contribution

3-D cellular systems for air-land communications

Su, S-L. & Pan, W. C., 1994 十二月 1, p. 485-489. 5 p.

研究成果: Paper

3-D cerebral vessel reconstruction from angiograms

Chen, C. H., Yu, Y. C., Guo, J. K., Chen, C. H., Sun, Y. N. & Yu, C. I., 1993 一月 1, Computer Analysis of Images and Patterns - 5th International Conference, CAIP 1993, Proceedings. Kropatsch, W. G. & Chetverikov, D. (編輯). Springer Verlag, p. 649-656 8 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); 卷 719 LNCS).

研究成果: Conference contribution

3D CFD simulation and parametric study of a flat plate deflector for vertical axis wind turbine

Wong, K. H., Chong, W. T., Poh, S. C., Shiah, Y. C., Sukiman, N. L. & Wang, C. T., 2018 十二月, 於 : Renewable Energy. 129, p. 32-55 24 p.

研究成果: Article

12 引文 斯高帕斯(Scopus)

3D collar design creation

Fang, J. J., 2003 四月 1, 於 : International Journal of Clothing Science and Technology. 15, 2, p. 88-106 19 p.

研究成果: Article

7 引文 斯高帕斯(Scopus)

3D CoMoSe4 Nanosheet Arrays Converted Directly from Hydrothermally Processed CoMoO4 Nanosheet Arrays by Plasma-Assisted Selenization Process Toward Excellent Anode Material in Sodium-Ion Battery

Zhang, S., Ai, Y., Wu, S. C., Liao, H. J., Su, T. Y., Chen, J. H., Wang, C. H., Lee, L., Chen, Y. Z., Xu, B., Tang, S. Y., Wu, D. C., Lee, S. S., Yin, J., Li, J., Kang, J. & Chueh, Y. L., 2019, 於 : Nanoscale Research Letters. 14, 213.

研究成果: Article

開啟存取
2 引文 斯高帕斯(Scopus)

3D computation of gray level co-occurrence in hyperspectral image cubes

Tsai, F., Chang, C. K., Rau, J-Y., Lin, T. H. & Liu, G. R., 2007, Energy Minimization Methods in Computer Vision and Pattern Recognition - 6th International Conference, EMMCVPR, 2007 Proceedings. 卷 4679 LNCS. p. 429-440 12 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); 卷 4679 LNCS).

研究成果: Conference contribution

36 引文 斯高帕斯(Scopus)

3-D corner delamination analysis for fan-out chip scale package

Chiu, T-C., Lin, H. C., Chen, S. & Shen, G. S., 2008 十二月 1, Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008. p. 687-693 7 p. (Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008).

研究成果: Conference contribution

3-D dielectrophoresis chip and the manufacturing method thereof

貢獻的翻譯標題: 立體式介電泳晶片與製造方法Chang, H-C., 1800, 專利號 I274159

研究成果: Patent

1 引文 斯高帕斯(Scopus)

3D Digital Simulation of Minnan Temple Architecture Caisson’s Craft Techniques

Hsu, M., Wu, T. C. & Lin, Y-C., 2013 九月, 24nd CIPA Symposium. Strasbourg, France

研究成果: Conference contribution

3D Dirac Plasmons in the Type-II Dirac Semimetal PtTe2

Politano, A., Chiarello, G., Ghosh, B., Sadhukhan, K., Kuo, C. N., Lue, C. S., Pellegrini, V. & Agarwal, A., 2018 八月 22, 於 : Physical review letters. 121, 8, 086804.

研究成果: Article

25 引文 斯高帕斯(Scopus)

3D dynamic thermal and thermomechanical stress analysis of a hot blast stove

Gan, Y. F., Jang, J-Y. & Wu, T. Y., 2019 一月 1, (Accepted/In press) 於 : Ironmaking and Steelmaking.

研究成果: Article

1 引文 斯高帕斯(Scopus)
4 引文 斯高帕斯(Scopus)
127 引文 斯高帕斯(Scopus)
3 引文 斯高帕斯(Scopus)

3-D FDTD design simulation and experimental measurement of a Ka-band planar antipodal linearly-tapered slot antenna (ALTSA)

Kuo, L. C., Tsai, M. C. & Chuang, H. R., 2001, Asia-Pacific Microwave Conference Proceedings, APMC. Institute of Electrical and Electronics Engineers Inc., p. 1271-1274 4 p. (Asia-Pacific Microwave Conference Proceedings, APMC; 卷 3).

研究成果: Conference contribution

3D FEM simulation and experimental measurements of microwave microstrip dielectric‐resonator filters

Chuang, H-R., Huang, J. W., Wei, C. C. & Chang, J. L. C., 1995 一月 1, 於 : Microwave and Optical Technology Letters. 8, 4, p. 196-200 5 p.

研究成果: Article

4 引文 斯高帕斯(Scopus)

3D Finite Element Complex Domain Numerical Models of Electric Fields in Blood and Myocardium

Wei, C. L., Valvano, J. W., Feldman, M. D., Nahrendorf, M. & Pearce, J. A., 2003 十二月 1, 於 : Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings. 1, p. 62-65 4 p.

研究成果: Conference article

7 引文 斯高帕斯(Scopus)
9 引文 斯高帕斯(Scopus)

3D foot model construction from photos, model segmentation, and model alignment

Chu, W. T. & Lin, C. H., 2019 十月, 2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019. Institute of Electrical and Electronics Engineers Inc., p. 349-353 5 p. 9015322. (2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019).

研究成果: Conference contribution

3-D force-balanced magnetospheric configurations

Zaharia, S., Cheng, C. Z. & Maezawa, K., 2004 一月 1, 於 : Annales Geophysicae. 22, 1, p. 251-265 15 p.

研究成果: Article

開啟存取
42 引文 斯高帕斯(Scopus)

3D Fractal reconstruction of terrain profile data based on digital elevation model

Huang, Y. M. & Chen, C. J., 2009 五月 30, 於 : Chaos, solitons and fractals. 40, 4, p. 1741-1749 9 p.

研究成果: Article

15 引文 斯高帕斯(Scopus)

3D geometry of the Chelungpu thrust system in central Taiwan: Its implications for active tectonics

Yang, K. M., Huang, S. T., Wu, J. C., Ting, H. H., Mei, W. W., Lee, M., Hsu, H. H. & Lee, C. J., 2007 六月 1, 於 : Terrestrial, Atmospheric and Oceanic Sciences. 18, 2, p. 143-181 39 p.

研究成果: Article

21 引文 斯高帕斯(Scopus)

3D-IC BISR for stacked memories using cross-die spares

Chi, C. C., Chou, Y. F., Kwai, D. M., Hsiao, Y. Y., Wu, C. W., Hsing, Y. T., Denq, L. M. & Lin, T. H., 2012 七月 25, 2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers. 6212621. (2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers).

研究成果: Conference contribution

9 引文 斯高帕斯(Scopus)

3D-IC interconnect test, diagnosis, and repair

Chi, C. C., Wu, C. W., Wang, M. J. & Lin, H. C., 2013 八月 14, Proceedings - 2013 IEEE 31st VLSI Test Symposium, VTS 2013. 6548905. (Proceedings of the IEEE VLSI Test Symposium).

研究成果: Conference contribution

34 引文 斯高帕斯(Scopus)

3D-IC test architecture for TSVs with different impact ranges of crosstalk faults

Hsu, W. H., Kochte, M. A. & Lee, K. J., 2016 五月 31, 2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016. Institute of Electrical and Electronics Engineers Inc., 7482554. (2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

3D image display of fetal ultrasonic image by thin shell

Wang, S. R., Sun, Y-N., Chang, F. M. & Jiang, C. F., 1999 一月 1, 於 : Proceedings of SPIE - The International Society for Optical Engineering. 3661, II, p. 1478-1488 11 p.

研究成果: Conference article

3 引文 斯高帕斯(Scopus)

3-D image-forming apparatus

貢獻的翻譯標題: 立體成像裝置Cheng, K-S., 1800, 專利號 I325096

研究成果: Patent

3D image reconstruction of bladder by nonlinear interpolation

Chin-Hsing, C., Ann-Shu, L., Jiann-Der, L. & Yang, W. H., 1995 十月, 於 : Mathematical and Computer Modelling. 22, 8, p. 61-72 12 p.

研究成果: Article

10 引文 斯高帕斯(Scopus)

3-D image reconstruction of brain blood vessels from angiograms

Guo, J. K., Chen, C. H., Lee, J. D. & Tsai, J. M., 1998 四月, 於 : Computers and Mathematics with Applications. 35, 8, p. 79-94 16 p.

研究成果: Article

5 引文 斯高帕斯(Scopus)

3-D Image reconstruction of brain vessels from angiograms

Lee, J. Y., Chen, C. H., Tasai, J. M., Sun, Y-N. & Mao, C. W., 1996 十二月 1, p. 547-552. 6 p.

研究成果: Paper

4 引文 斯高帕斯(Scopus)

3-Dimensional representation for PC12 cell growth characterization

Lu, Y. Y., Huang, Y. J. & Cheng, K-S., 2012 十二月 1, 2012 5th International Conference on Biomedical Engineering and Informatics, BMEI 2012. p. 688-691 4 p. 6513001. (2012 5th International Conference on Biomedical Engineering and Informatics, BMEI 2012).

研究成果: Conference contribution

3D integration opportunities, issues, and solutions: A designer's perspective

Kwai, D. M. & Wu, C. W., 2009 十二月 1, Lithography Asia 2009. 752003. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 7520).

研究成果: Conference contribution

8 引文 斯高帕斯(Scopus)

3D localization of clustered microcalcifications using cranio-caudal and medio-lateral oblique views

Yang, S. C., Hsu, H. H., Hsu, G. C., Chung, P. C., Guo, S. M., Lo, C. S., Yang, C. W., Lee, S. K. & Chang, C. I., 2005 十月 1, 於 : Computerized Medical Imaging and Graphics. 29, 7, p. 521-532 12 p.

研究成果: Article

8 引文 斯高帕斯(Scopus)

3-D magnetic tweezers for investigation of mechanical properties of single DNA molecules

Chiou, C. H., Huang, Y. Y., Chiang, M. H., Lee, H. H. & Lee, G. B., 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems. p. 142-145 4 p. 1627756. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2006).

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

3D mapping of somatotopic reorganization with small animal functional MRI

Yu, X., Wang, S., Chen, D. Y., Dodd, S., Goloshevsky, A. & Koretsky, A. P., 2010 一月 15, 於 : NeuroImage. 49, 2, p. 1667-1676 10 p.

研究成果: Article

28 引文 斯高帕斯(Scopus)

3-D MICRO/NANO STRUCTURE AND MANUFACTURING METHOD THEREOF

貢獻的翻譯標題: 三維形狀微奈米結構及其製造方法Lee, Y-C., 1800, 專利號 I413177

研究成果: Patent

3D microstructures array single-cell-based DEP chip for studying apoptosis of U937 & A431 cells

Chuang, C. H., Lee, Y. C., Huang, H. S., Hsiao, F. B., Hsu, Y. M., Wang, K. H., Ding, L. & Hsu, H. J., 2006, Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS. p. 1207-1210 4 p. 4135163. (Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS).

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

3D model retrieval and assessment for point cloud modeling

Hsu, P. C., Chen, J. Y. & Lin, C-H., 2010 十二月 1, 31st Asian Conference on Remote Sensing 2010, ACRS 2010. p. 1578-1583 6 p. (31st Asian Conference on Remote Sensing 2010, ACRS 2010; 卷 2).

研究成果: Conference contribution

3D nano-scale cutting model for nickel material

Lin, Z. C., Huang, J. C. & Jeng, Y. R., 2007 十月 1, 於 : Journal of Materials Processing Technology. 192-193, p. 27-36 10 p.

研究成果: Article

34 引文 斯高帕斯(Scopus)

3-D numerical analysis for fluid flow and heat transfer in a micro chip by using an electrohydrodynamic micro-pump

Lin, C. W. & Jang, J. Y., 2005 一月 1, Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005. American Society of Mechanical Engineers, p. 215-221 7 p. ICMM2005-75078. (Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005; 卷 PART B).

研究成果: Conference contribution

3-D numerical and experimental analysis for airflow within a passenger compartment

Chien, C. H., Jang, J-Y., Chen, Y. H. & Wu, S. C., 2008 八月 1, 於 : International Journal of Automotive Technology. 9, 4, p. 437-445 9 p.

研究成果: Article

29 引文 斯高帕斯(Scopus)
56 引文 斯高帕斯(Scopus)