尋找研究成果

搜尋結果

• ³⁹K-NMR observation of temperature-dependent spin susceptibility in K₃C₆₀

  Sasaki, S., Matsuda, A. & Chu, C. W., 1998 7月 1, 於: Physica C: Superconductivity and its applications. 302, 4, p. 319-324 6 p.

  研究成果: Article › 同行評審
  5 引文 斯高帕斯（Scopus）

• 3D/2D model-to-image registration for quantitative dietary assessment

  Chen, H. C., Jia, W., Li, Z., Sun, Y. N. & Sun, M., 2012, 2012 38th Annual Northeast Bioengineering Conference, NEBEC 2012. p. 95-96 2 p. 6206979. (2012 38th Annual Northeast Bioengineering Conference, NEBEC 2012).

  研究成果: Conference contribution
  22 引文 斯高帕斯（Scopus）

• 3D-3D Registration of partial capitate bones using spin-images

  Breighner, R., Holmes, D. R., Leng, S., An, K. N., McCollough, C. & Zhao, K., 2013, Medical Imaging 2013: Image-Guided Procedures, Robotic Interventions, and Modeling. 867113. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 8671).

  研究成果: Conference contribution
  1 引文 斯高帕斯（Scopus）

• 3D83 - An easy-to-use software package for three-dimensional display from computed tomograms

  Chen, L. S., Herman, G. T., Meyer, C. R., Reynolds, R. A. & Udupa, J. K., 1984 8月 3, 於: Proceedings of SPIE - The International Society for Optical Engineering. 515, p. 309-316 8 p.

  研究成果: Article › 同行評審
  2 引文 斯高帕斯（Scopus）

• 3D 83 - AN EASY-TO-USE SOFTWARE PACKAGE FOR THREE-DIMENSIONAL DISPLAY FROM COMPUTED TOMOGRAMS.

  Chen, L-S., Herman, G. T., Meyer, C. R., Reynolds, R. A. & Udupa, J. K., 1984, Unknown Host Publication Title. IEEE, p. 309-316 8 p.

  研究成果: Conference contribution
  7 引文 斯高帕斯（Scopus）

• 3D analyses of buildings under vertical component of earthquakes

  Ju, S. H., Liu, C. W. & Wu, K. Z., 2000 10月, 於: Journal of structural engineering New York, N.Y.. 126, 10, p. 1196-1202 7 p.

  研究成果: Article › 同行評審
  9 引文 斯高帕斯（Scopus）

• 3D analyses of open trench barriers filled with water

  Ju, S-H. & Li, H. C., 2011 12月 16, 於: Journal of Geotechnical and Geoenvironmental Engineering. 137, 11, p. 1114-1120 7 p.

  研究成果: Article › 同行評審
  25 引文 斯高帕斯（Scopus）

• 3D analysis of high-speed trains moving on bridges with foundation settlements

  Ju, S-H., 2013 2月 1, 於: Archive of Applied Mechanics. 83, 2, p. 281-291 11 p.

  研究成果: Article › 同行評審
  27 引文 斯高帕斯（Scopus）

• 3D and 4D bioprinting of the myocardium: Current approaches, challenges, and future prospects

  Ong, C. S., Nam, L., Ong, K., Krishnan, A., Huang, C. Y., Fukunishi, T. & Hibino, N., 2018 4月 22, 於: BioMed research international. 2018, 6497242.

  研究成果: Review article › 同行評審

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  58 引文 斯高帕斯（Scopus）

• 3D apparel creation based on computer mannequin model. Part I: System kernel and formulas

  Fang, J. J. & Liao, C. K., 2005 10月 20, 於: International Journal of Clothing Science and Technology. 17, 5, p. 292-306 15 p.

  研究成果: Article › 同行評審
  4 引文 斯高帕斯（Scopus）

• 3D apparel creation based on computer mannequin model. Part II: Implementations

  Fang, J. J. & Liao, C. K., 2005 10月 20, 於: International Journal of Clothing Science and Technology. 17, 5, p. 307-319 13 p.

  研究成果: Article › 同行評審
  4 引文 斯高帕斯（Scopus）

• 3D bioprinting using stem cells

  Ong, C. S., Yesantharao, P., Huang, C. Y., Mattson, G., Boktor, J., Fukunishi, T., Zhang, H. & Hibino, N., 2018 1月 1, 於: Pediatric Research. 83, 1-2, p. 223-231 9 p.

  研究成果: Review article › 同行評審

  開啟存取
  157 引文 斯高帕斯（Scopus）

• 3D blood vessel mapping of adult zebrafish using high frequency ultrasound ultrafast doppler imaging

  Chang, C. C., Chen, P. Y. & Huang, C. C., 2017 10月 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8092419. (IEEE International Ultrasonics Symposium, IUS).

  研究成果: Conference contribution

• 3D blood vessel mapping of adult zebrafish using high frequency ultrasound ultrafast Doppler imaging

  Chang, C. C., Chen, P. Y. & Huang, C. C., 2017 10月 31, 2017 IEEE International Ultrasonics Symposium, IUS 2017. IEEE Computer Society, 8091546. (IEEE International Ultrasonics Symposium, IUS).

  研究成果: Conference contribution

• 3D B-spline curve fitting with MMS image features of road lines

  Li, R. Y., Hsieh, C. Y. & Tseng, Y. H., 2009 12月 1, 30th Asian Conference on Remote Sensing 2009, ACRS 2009. p. 1895-1900 6 p. (30th Asian Conference on Remote Sensing 2009, ACRS 2009; 卷 3).

  研究成果: Conference contribution
  1 引文 斯高帕斯（Scopus）

• 3D buckling analysis of FGM sandwich plates under bi-axial compressive loads

  Wu, C. P. & Liu, W. L., 2014 1月, 於: Smart Structures and Systems. 13, 1, p. 111-135 25 p.

  研究成果: Article › 同行評審
  6 引文 斯高帕斯（Scopus）

• 3D building model retrieval for point cloud modeling

  Hsu, P. C., Chen, J. Y. & Lin, C-H., 2011 12月 1, 32nd Asian Conference on Remote Sensing 2011, ACRS 2011. p. 2243-2248 6 p. (32nd Asian Conference on Remote Sensing 2011, ACRS 2011; 卷 4).

  研究成果: Conference contribution
  1 引文 斯高帕斯（Scopus）

• 3D building model retrieval system based on LiDAR point cloud filling and encoding

  Chen, J. Y., Hsu, P. C. & Lin, C. H., 2013, 34th Asian Conference on Remote Sensing 2013, ACRS 2013. Asian Association on Remote Sensing, p. 261-268 8 p. (34th Asian Conference on Remote Sensing 2013, ACRS 2013; 卷 1).

  研究成果: Conference contribution

• 3D cell capture and sensing array electrode (3D ECCSA) under extremely low frequency electromagnetic fields (ELF-EMF)

  Liu, C. Y., Chen, C. H., Jang, L. S. & Wang, M. H., 2020 10月 15, 於: Sensors and Actuators, B: Chemical. 321, 128444.

  研究成果: Article › 同行評審
  2 引文 斯高帕斯（Scopus）

• 3-D cellular systems for air-land communications

  Su, S-L. & Pan, W. C., 1994 12月 1, p. 485-489. 5 p.

  研究成果: Paper › 同行評審

• 3-D cerebral vessel reconstruction from angiograms

  Chen, C. H., Yu, Y. C., Guo, J. K., Chen, C. H., Sun, Y. N. & Yu, C. I., 1993 1月 1, Computer Analysis of Images and Patterns - 5th International Conference, CAIP 1993, Proceedings. Kropatsch, W. G. & Chetverikov, D. (編輯). Springer Verlag, p. 649-656 8 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); 卷 719 LNCS).

  研究成果: Conference contribution

• 3D CFD simulation and parametric study of a flat plate deflector for vertical axis wind turbine

  Wong, K. H., Chong, W. T., Poh, S. C., Shiah, Y. C., Sukiman, N. L. & Wang, C. T., 2018 12月, 於: Renewable Energy. 129, p. 32-55 24 p.

  研究成果: Article › 同行評審
  56 引文 斯高帕斯（Scopus）

• 3d-cnn based computer-aided diagnosis (cadx) for lung nodule diagnosis

  Tai, T. C., Tian, M., Cho, W. T. & Lai, C. F., 2020, Cognitive Cities - 2nd International Conference, IC3 2019, Revised Selected Papers. Shen, J., Chang, Y-C., Su, Y-S. & Ogata, H. (編輯). Springer, p. 35-43 9 p. (Communications in Computer and Information Science; 卷 1227 CCIS).

  研究成果: Conference contribution

• 3D collar design creation

  Fang, J. J., 2003 4月 1, 於: International Journal of Clothing Science and Technology. 15, 2, p. 88-106 19 p.

  研究成果: Article › 同行評審
  6 引文 斯高帕斯（Scopus）

• 3D CoMoSe₄ Nanosheet Arrays Converted Directly from Hydrothermally Processed CoMoO₄ Nanosheet Arrays by Plasma-Assisted Selenization Process Toward Excellent Anode Material in Sodium-Ion Battery

  Zhang, S., Ai, Y., Wu, S. C., Liao, H. J., Su, T. Y., Chen, J. H., Wang, C. H., Lee, L., Chen, Y. Z., Xu, B., Tang, S. Y., Wu, D. C., Lee, S. S., Yin, J., Li, J., Kang, J. & Chueh, Y. L., 2019, 於: Nanoscale Research Letters. 14, 213.

  研究成果: Article › 同行評審

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  10 引文 斯高帕斯（Scopus）

• 3D computation of gray level co-occurrence in hyperspectral image cubes

  Tsai, F., Chang, C. K., Rau, J-Y., Lin, T. H. & Liu, G. R., 2007, Energy Minimization Methods in Computer Vision and Pattern Recognition - 6th International Conference, EMMCVPR, 2007 Proceedings. 卷 4679 LNCS. p. 429-440 12 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); 卷 4679 LNCS).

  研究成果: Conference contribution
  44 引文 斯高帕斯（Scopus）

• 3-D corner delamination analysis for fan-out chip scale package

  Chiu, T-C., Lin, H. C., Chen, S. & Shen, G. S., 2008 12月 1, Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008. p. 687-693 7 p. (Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008).

  研究成果: Conference contribution

• 3-D dielectrophoresis chip and the manufacturing method thereof

  貢獻的翻譯標題: 立體式介電泳晶片與製造方法Chang, H-C., 1800, 專利號 I274159

  研究成果: Patent

• 3D digital simulation of minnan temple architecture Caisson's craft techniques

  Lin, Y. C., Wu, T. C. & Hsu, M., 2013, 於: International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences - ISPRS Archives. 40, 5W2, p. 403-408 6 p.

  研究成果: Article › 同行評審
  1 引文 斯高帕斯（Scopus）

• 3D Digital Simulation of Minnan Temple Architecture Caisson’s Craft Techniques

  Hsu, M., Wu, T. C. & Lin, Y-C., 2013 9月, 24nd CIPA Symposium. Strasbourg, France

  研究成果: Conference contribution

• 3D Dirac Plasmons in the Type-II Dirac Semimetal PtTe2

  Politano, A., Chiarello, G., Ghosh, B., Sadhukhan, K., Kuo, C. N., Lue, C. S., Pellegrini, V. & Agarwal, A., 2018 8月 22, 於: Physical review letters. 121, 8, 086804.

  研究成果: Article › 同行評審
  84 引文 斯高帕斯（Scopus）

• 3D dynamic thermal and thermomechanical stress analysis of a hot blast stove

  Gan, Y. F., Jang, J. Y. & Wu, T. Y., 2020 10月, 於: Ironmaking and Steelmaking. 47, 9, p. 959-972 14 p.

  研究成果: Article › 同行評審
  3 引文 斯高帕斯（Scopus）

• 3-D EHD enhanced natural convection over a horizontal plate flow with optimal design of a needle electrode system

  Jang, J. Y. & Chen, C. C., 2018, 於: Energies. 11, 7, 1670.

  研究成果: Article › 同行評審

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  5 引文 斯高帕斯（Scopus）

• 3D Elastostatic Boundary Element Analysis of thin bodies by Integral Regularizations

  Shiah, Y. C., 2015 10月 1, 於: Journal of Mechanics. 31, 5, p. 533-543 11 p.

  研究成果: Article › 同行評審
  4 引文 斯高帕斯（Scopus）

• 3D face point cloud reconstruction and recognition using depth sensor

  Wang, C. W. & Peng, C. C., 2021 4月 2, 於: Sensors. 21, 8, 2587.

  研究成果: Article › 同行評審

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  8 引文 斯高帕斯（Scopus）

• 3D facial surface reconstruction using integrated orthographic models to approximate perspective projection model

  Wu, J. Y. & Lien, J. J. J., 2012 1月 1, 於: International Journal of Innovative Computing, Information and Control. 8, 1 B, p. 807-825 19 p.

  研究成果: Article › 同行評審

• 3-D FDTD design analysis of a 2.4-GHz polarization-diversity printed dipole antenna with integrated balun and polarization-switching circuit for WLAN and wireless communication applications

  Chuang, H. R. & Kuo, L. C., 2003 2月, 於: IEEE Transactions on Microwave Theory and Techniques. 51, 2 I, p. 374-381 8 p.

  研究成果: Article › 同行評審
  91 引文 斯高帕斯（Scopus）

• 3-D FDTD design simulation and experimental measurement of a Ka-band planar antipodal linearly-tapered slot antenna (ALTSA)

  Kuo, L. C., Tsai, M. C. & Chuang, H. R., 2001, Asia-Pacific Microwave Conference Proceedings, APMC. Institute of Electrical and Electronics Engineers Inc., p. 1271-1274 4 p. (Asia-Pacific Microwave Conference Proceedings, APMC; 卷 3).

  研究成果: Conference contribution

• 3-D FDTD design simulation and experimental measurement of a Ka-band planar antipodal linearly-tapered slot antenna (ALTSA)

  Kuo, L. C., Tsai, M. C. & Chuang, H. R., 2001 9月, 於: IEEE Microwave and Wireless Components Letters. 11, 9, p. 382-384 3 p.

  研究成果: Article › 同行評審
  5 引文 斯高帕斯（Scopus）

• 3D FEM simulation and experimental measurements of microwave microstrip dielectric‐resonator filters

  Chuang, H-R., Huang, J. W., Wei, C. C. & Chang, J. L. C., 1995 1月 1, 於: Microwave and Optical Technology Letters. 8, 4, p. 196-200 5 p.

  研究成果: Article › 同行評審

• 3D Finite Element Complex Domain Numerical Models of Electric Fields in Blood and Myocardium

  Wei, C. L., Valvano, J. W., Feldman, M. D., Nahrendorf, M. & Pearce, J. A., 2003, 於: Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings. 1, p. 62-65 4 p.

  研究成果: Conference article › 同行評審
  7 引文 斯高帕斯（Scopus）

• 3-D Finite element simulation for flat-die thread rolling of stainless steel

  Chen, C. H., Wang, S. T. & Lee, R-S., 2005 12月 1, 於: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao. 26, 4, p. 617-622 6 p.

  研究成果: Article › 同行評審
  14 引文 斯高帕斯（Scopus）

• 3D foot model construction from photos, model segmentation, and model alignment

  Chu, W. T. & Lin, C. H., 2019 10月, 2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019. Institute of Electrical and Electronics Engineers Inc., p. 349-353 5 p. 9015322. (2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019).

  研究成果: Conference contribution
  1 引文 斯高帕斯（Scopus）

• 3-D force-balanced magnetospheric configurations

  Zaharia, S., Cheng, C. Z. & Maezawa, K., 2004, 於: Annales Geophysicae. 22, 1, p. 251-265 15 p.

  研究成果: Article › 同行評審

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  49 引文 斯高帕斯（Scopus）

• 3D Fractal reconstruction of terrain profile data based on digital elevation model

  Huang, Y. M. & Chen, C. J., 2009 5月 30, 於: Chaos, solitons and fractals. 40, 4, p. 1741-1749 9 p.

  研究成果: Article › 同行評審
  16 引文 斯高帕斯（Scopus）

• 3D geometry of the Chelungpu thrust system in central Taiwan: Its implications for active tectonics

  Yang, K. M., Huang, S. T., Wu, J. C., Ting, H. H., Mei, W. W., Lee, M., Hsu, H. H. & Lee, C. J., 2007 6月, 於: Terrestrial, Atmospheric and Oceanic Sciences. 18, 2, p. 143-181 39 p.

  研究成果: Article › 同行評審

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  25 引文 斯高帕斯（Scopus）

• 3D hierarchical cobalt vanadate nanosheet arrays on Ni foam coupled with redox additive for enhanced supercapacitor performance

  Nguyen, V. T., Sari, F. N. I. & Ting, J. M., 2022 10月 12, 於: RSC Advances. 12, 45, p. 29170-29176 7 p.

  研究成果: Article › 同行評審

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  1 引文 斯高帕斯（Scopus）

• 3D-IC BISR for stacked memories using cross-die spares

  Chi, C. C., Chou, Y. F., Kwai, D. M., Hsiao, Y. Y., Wu, C. W., Hsing, Y. T., Denq, L. M. & Lin, T. H., 2012 7月 25, 2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers. 6212621. (2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers).

  研究成果: Conference contribution
  11 引文 斯高帕斯（Scopus）

• 3D-IC interconnect test, diagnosis, and repair

  Chi, C. C., Wu, C. W., Wang, M. J. & Lin, H. C., 2013 8月 14, Proceedings - 2013 IEEE 31st VLSI Test Symposium, VTS 2013. 6548905. (Proceedings of the IEEE VLSI Test Symposium).

  研究成果: Conference contribution
  42 引文 斯高帕斯（Scopus）

• 3D-IC test architecture for TSVs with different impact ranges of crosstalk faults

  Hsu, W. H., Kochte, M. A. & Lee, K. J., 2016 5月 31, 2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016. Institute of Electrical and Electronics Engineers Inc., 7482554. (2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016).

  研究成果: Conference contribution
  3 引文 斯高帕斯（Scopus）