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• 3D CFD simulation and parametric study of a flat plate deflector for vertical axis wind turbine

  Wong, K. H., Chong, W. T., Poh, S. C., Shiah, Y. C., Sukiman, N. L. & Wang, C. T., 2018 12月, 於: Renewable Energy. 129, p. 32-55 24 p.

  研究成果: Article › 同行評審
  43 引文 斯高帕斯（Scopus）

• 3d-cnn based computer-aided diagnosis (cadx) for lung nodule diagnosis

  Tai, T. C., Tian, M., Cho, W. T. & Lai, C. F., 2020, Cognitive Cities - 2nd International Conference, IC3 2019, Revised Selected Papers. Shen, J., Chang, Y-C., Su, Y-S. & Ogata, H. (編輯). Springer, p. 35-43 9 p. (Communications in Computer and Information Science; 卷 1227 CCIS).

  研究成果: Conference contribution

• 3D collar design creation

  Fang, J. J., 2003 4月 1, 於: International Journal of Clothing Science and Technology. 15, 2, p. 88-106 19 p.

  研究成果: Article › 同行評審
  7 引文 斯高帕斯（Scopus）

• 3D CoMoSe₄ Nanosheet Arrays Converted Directly from Hydrothermally Processed CoMoO₄ Nanosheet Arrays by Plasma-Assisted Selenization Process Toward Excellent Anode Material in Sodium-Ion Battery

  Zhang, S., Ai, Y., Wu, S. C., Liao, H. J., Su, T. Y., Chen, J. H., Wang, C. H., Lee, L., Chen, Y. Z., Xu, B., Tang, S. Y., Wu, D. C., Lee, S. S., Yin, J., Li, J., Kang, J. & Chueh, Y. L., 2019, 於: Nanoscale Research Letters. 14, 213.

  研究成果: Article › 同行評審

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  10 引文 斯高帕斯（Scopus）

• 3D computation of gray level co-occurrence in hyperspectral image cubes

  Tsai, F., Chang, C. K., Rau, J-Y., Lin, T. H. & Liu, G. R., 2007, Energy Minimization Methods in Computer Vision and Pattern Recognition - 6th International Conference, EMMCVPR, 2007 Proceedings. 卷 4679 LNCS. p. 429-440 12 p. (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); 卷 4679 LNCS).

  研究成果: Conference contribution
  41 引文 斯高帕斯（Scopus）

• 3-D corner delamination analysis for fan-out chip scale package

  Chiu, T-C., Lin, H. C., Chen, S. & Shen, G. S., 2008 12月 1, Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008. p. 687-693 7 p. (Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008).

  研究成果: Conference contribution

• 3-D dielectrophoresis chip and the manufacturing method thereof

  貢獻的翻譯標題: 立體式介電泳晶片與製造方法Chang, H-C., 1800, 專利號 I274159

  研究成果: Patent

• 3D digital simulation of minnan temple architecture Caisson's craft techniques

  Lin, Y. C., Wu, T. C. & Hsu, M., 2013, 於: International Archives of the Photogrammetry, Remote Sensing and Spatial Information Sciences - ISPRS Archives. 40, 5W2, p. 403-408 6 p.

  研究成果: Article › 同行評審
  1 引文 斯高帕斯（Scopus）

• 3D Digital Simulation of Minnan Temple Architecture Caisson’s Craft Techniques

  Hsu, M., Wu, T. C. & Lin, Y-C., 2013 9月, 24nd CIPA Symposium. Strasbourg, France

  研究成果: Conference contribution

• 3D Dirac Plasmons in the Type-II Dirac Semimetal PtTe2

  Politano, A., Chiarello, G., Ghosh, B., Sadhukhan, K., Kuo, C. N., Lue, C. S., Pellegrini, V. & Agarwal, A., 2018 8月 22, 於: Physical review letters. 121, 8, 086804.

  研究成果: Article › 同行評審
  66 引文 斯高帕斯（Scopus）

• 3D dynamic thermal and thermomechanical stress analysis of a hot blast stove

  Gan, Y. F., Jang, J. Y. & Wu, T. Y., 2020 10月, 於: Ironmaking and Steelmaking. 47, 9, p. 959-972 14 p.

  研究成果: Article › 同行評審
  1 引文 斯高帕斯（Scopus）

• 3-D EHD enhanced natural convection over a horizontal plate flow with optimal design of a needle electrode system

  Jang, J. Y. & Chen, C. C., 2018, 於: Energies. 11, 7, 1670.

  研究成果: Article › 同行評審

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  5 引文 斯高帕斯（Scopus）

• 3D Elastostatic Boundary Element Analysis of thin bodies by Integral Regularizations

  Shiah, Y. C., 2015 10月 1, 於: Journal of Mechanics. 31, 5, p. 533-543 11 p.

  研究成果: Article › 同行評審
  4 引文 斯高帕斯（Scopus）

• 3D face point cloud reconstruction and recognition using depth sensor

  Wang, C. W. & Peng, C. C., 2021 4月 2, 於: Sensors. 21, 8, 2587.

  研究成果: Article › 同行評審

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  6 引文 斯高帕斯（Scopus）

• 3D facial surface reconstruction using integrated orthographic models to approximate perspective projection model

  Wu, J. Y. & Lien, J. J. J., 2012 1月 1, 於: International Journal of Innovative Computing, Information and Control. 8, 1 B, p. 807-825 19 p.

  研究成果: Article › 同行評審

• 3-D FDTD design analysis of a 2.4-GHz polarization-diversity printed dipole antenna with integrated balun and polarization-switching circuit for WLAN and wireless communication applications

  Chuang, H. R. & Kuo, L. C., 2003 2月, 於: IEEE Transactions on Microwave Theory and Techniques. 51, 2 I, p. 374-381 8 p.

  研究成果: Article › 同行評審
  136 引文 斯高帕斯（Scopus）

• 3-D FDTD design simulation and experimental measurement of a Ka-band planar antipodal linearly-tapered slot antenna (ALTSA)

  Kuo, L. C., Tsai, M. C. & Chuang, H. R., 2001 9月, 於: IEEE Microwave and Wireless Components Letters. 11, 9, p. 382-384 3 p.

  研究成果: Article › 同行評審
  5 引文 斯高帕斯（Scopus）

• 3-D FDTD design simulation and experimental measurement of a Ka-band planar antipodal linearly-tapered slot antenna (ALTSA)

  Kuo, L. C., Tsai, M. C. & Chuang, H. R., 2001, Asia-Pacific Microwave Conference Proceedings, APMC. Institute of Electrical and Electronics Engineers Inc., p. 1271-1274 4 p. (Asia-Pacific Microwave Conference Proceedings, APMC; 卷 3).

  研究成果: Conference contribution

• 3D FEM simulation and experimental measurements of microwave microstrip dielectric‐resonator filters

  Chuang, H-R., Huang, J. W., Wei, C. C. & Chang, J. L. C., 1995 1月 1, 於: Microwave and Optical Technology Letters. 8, 4, p. 196-200 5 p.

  研究成果: Article › 同行評審
  4 引文 斯高帕斯（Scopus）

• 3D Finite Element Complex Domain Numerical Models of Electric Fields in Blood and Myocardium

  Wei, C. L., Valvano, J. W., Feldman, M. D., Nahrendorf, M. & Pearce, J. A., 2003, 於: Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings. 1, p. 62-65 4 p.

  研究成果: Conference article › 同行評審
  7 引文 斯高帕斯（Scopus）

• 3-D Finite element simulation for flat-die thread rolling of stainless steel

  Chen, C. H., Wang, S. T. & Lee, R-S., 2005 12月 1, 於: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao. 26, 4, p. 617-622 6 p.

  研究成果: Article › 同行評審
  12 引文 斯高帕斯（Scopus）

• 3D foot model construction from photos, model segmentation, and model alignment

  Chu, W. T. & Lin, C. H., 2019 10月, 2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019. Institute of Electrical and Electronics Engineers Inc., p. 349-353 5 p. 9015322. (2019 IEEE 8th Global Conference on Consumer Electronics, GCCE 2019).

  研究成果: Conference contribution
  1 引文 斯高帕斯（Scopus）

• 3-D force-balanced magnetospheric configurations

  Zaharia, S., Cheng, C. Z. & Maezawa, K., 2004, 於: Annales Geophysicae. 22, 1, p. 251-265 15 p.

  研究成果: Article › 同行評審

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  48 引文 斯高帕斯（Scopus）

• 3D Fractal reconstruction of terrain profile data based on digital elevation model

  Huang, Y. M. & Chen, C. J., 2009 5月 30, 於: Chaos, solitons and fractals. 40, 4, p. 1741-1749 9 p.

  研究成果: Article › 同行評審
  17 引文 斯高帕斯（Scopus）

• 3D geometry of the Chelungpu thrust system in central Taiwan: Its implications for active tectonics

  Yang, K. M., Huang, S. T., Wu, J. C., Ting, H. H., Mei, W. W., Lee, M., Hsu, H. H. & Lee, C. J., 2007 6月, 於: Terrestrial, Atmospheric and Oceanic Sciences. 18, 2, p. 143-181 39 p.

  研究成果: Article › 同行評審

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  25 引文 斯高帕斯（Scopus）

• 3D-IC BISR for stacked memories using cross-die spares

  Chi, C. C., Chou, Y. F., Kwai, D. M., Hsiao, Y. Y., Wu, C. W., Hsing, Y. T., Denq, L. M. & Lin, T. H., 2012 7月 25, 2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers. 6212621. (2012 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2012 - Proceedings of Technical Papers).

  研究成果: Conference contribution
  11 引文 斯高帕斯（Scopus）

• 3D-IC interconnect test, diagnosis, and repair

  Chi, C. C., Wu, C. W., Wang, M. J. & Lin, H. C., 2013 8月 14, Proceedings - 2013 IEEE 31st VLSI Test Symposium, VTS 2013. 6548905. (Proceedings of the IEEE VLSI Test Symposium).

  研究成果: Conference contribution
  39 引文 斯高帕斯（Scopus）

• 3D-IC test architecture for TSVs with different impact ranges of crosstalk faults

  Hsu, W. H., Kochte, M. A. & Lee, K. J., 2016 5月 31, 2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016. Institute of Electrical and Electronics Engineers Inc., 7482554. (2016 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2016).

  研究成果: Conference contribution
  3 引文 斯高帕斯（Scopus）

• 3D image display of fetal ultrasonic image by thin shell

  Wang, S. R., Sun, Y. N., Chang, F. M. & Jiang, C. F., 1999 1月 1, 於: Proceedings of SPIE - The International Society for Optical Engineering. 3661, II, p. 1478-1488 11 p.

  研究成果: Conference article › 同行評審
  3 引文 斯高帕斯（Scopus）

• 3-D image-forming apparatus

  貢獻的翻譯標題: 立體成像裝置Cheng, K-S., 1800, 專利號 I325096

  研究成果: Patent

• 3D image reconstruction of bladder by nonlinear interpolation

  Chin-Hsing, C., Ann-Shu, L., Jiann-Der, L. & Yang, W. H., 1995 10月, 於: Mathematical and Computer Modelling. 22, 8, p. 61-72 12 p.

  研究成果: Article › 同行評審
  10 引文 斯高帕斯（Scopus）

• 3-D image reconstruction of brain blood vessels from angiograms

  Guo, J. K., Chen, C. H., Lee, J. D. & Tsai, J. M., 1998 4月, 於: Computers and Mathematics with Applications. 35, 8, p. 79-94 16 p.

  研究成果: Article › 同行評審
  7 引文 斯高帕斯（Scopus）

• 3-D Image reconstruction of brain vessels from angiograms

  Lee, J. Y., Chen, C. H., Tasai, J. M., Sun, Y-N. & Mao, C. W., 1996 12月 1, p. 547-552. 6 p.

  研究成果: Paper › 同行評審
  4 引文 斯高帕斯（Scopus）

• 3-Dimensional representation for PC12 cell growth characterization

  Lu, Y. Y., Huang, Y. J. & Cheng, K-S., 2012 12月 1, 2012 5th International Conference on Biomedical Engineering and Informatics, BMEI 2012. p. 688-691 4 p. 6513001. (2012 5th International Conference on Biomedical Engineering and Informatics, BMEI 2012).

  研究成果: Conference contribution

• 3D integration of vertical-stacking of MoS₂and Si CMOS featuring embedded 2T1R configuration demonstrated on full wafers

  Su, C. J., Huang, M. K., Lee, K. S., Hu, V. P. H., Huang, Y. F., Zheng, B. C., Yao, C. H., Lin, N. C., Kao, K. H., Hong, T. C., Sung, P. J., Wu, C. T., Yu, T. Y., Lin, K. L., Tseng, Y. C., Lin, C. L., Lee, Y. J., Chao, T. S., Li, J. Y., Wu, W. F., 及其他3Shieh, J. M., Wang, Y. H. & Yeh, W. K., 2020 12月 12, 2020 IEEE International Electron Devices Meeting, IEDM 2020. Institute of Electrical and Electronics Engineers Inc., p. 12.2.1-12.2.4 9371988. (Technical Digest - International Electron Devices Meeting, IEDM; 卷 2020-December).

  研究成果: Conference contribution
  2 引文 斯高帕斯（Scopus）

• 3D integration opportunities, issues, and solutions: A designer's perspective

  Kwai, D. M. & Wu, C. W., 2009 12月 1, Lithography Asia 2009. 752003. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 7520).

  研究成果: Conference contribution
  8 引文 斯高帕斯（Scopus）

• 3D laminated graphitic carbon nitride decorating with 2D/2D Bi₂WO₆/rGO nanosheets for selective photoreduction of CO₂ to CO

  Chen, I. T., Zheng, M. W., Pu, Y. C. & Liu, S. H., 2022, (Accepted/In press) 於: International Journal of Energy Research.

  研究成果: Article › 同行評審

• 3D localization of clustered microcalcifications using cranio-caudal and medio-lateral oblique views

  Yang, S. C., Hsu, H. H., Hsu, G. C., Chung, P. C., Guo, S. M., Lo, C. S., Yang, C. W., Lee, S. K. & Chang, C. I., 2005 10月, 於: Computerized Medical Imaging and Graphics. 29, 7, p. 521-532 12 p.

  研究成果: Article › 同行評審
  9 引文 斯高帕斯（Scopus）

• 3-D magnetic tweezers for investigation of mechanical properties of single DNA molecules

  Chiou, C. H., Huang, Y. Y., Chiang, M. H., Lee, H. H. & Lee, G. B., 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems. p. 142-145 4 p. 1627756. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2006).

  研究成果: Conference contribution
  1 引文 斯高帕斯（Scopus）

• 3D mapping of somatotopic reorganization with small animal functional MRI

  Yu, X., Wang, S., Chen, D. Y., Dodd, S., Goloshevsky, A. & Koretsky, A. P., 2010 1月 15, 於: NeuroImage. 49, 2, p. 1667-1676 10 p.

  研究成果: Article › 同行評審
  30 引文 斯高帕斯（Scopus）

• 3-D MICRO/NANO STRUCTURE AND MANUFACTURING METHOD THEREOF

  貢獻的翻譯標題: 三維形狀微奈米結構及其製造方法Lee, Y-C., 1800, 專利號 I413177

  研究成果: Patent

• 3D microstructures array single-cell-based DEP chip for studying apoptosis of U937 & A431 cells

  Chuang, C. H., Lee, Y. C., Huang, H. S., Hsiao, F. B., Hsu, Y. M., Wang, K. H., Ding, L. & Hsu, H. J., 2006, Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS. p. 1207-1210 4 p. 4135163. (Proceedings of 1st IEEE International Conference on Nano Micro Engineered and Molecular Systems, 1st IEEE-NEMS).

  研究成果: Conference contribution
  2 引文 斯高帕斯（Scopus）

• 3D model retrieval and assessment for point cloud modeling

  Hsu, P. C., Chen, J. Y. & Lin, C. H., 2010, 31st Asian Conference on Remote Sensing 2010, ACRS 2010. p. 1578-1583 6 p. (31st Asian Conference on Remote Sensing 2010, ACRS 2010; 卷 2).

  研究成果: Conference contribution

• 3D multi-track and multi-layer epitaxy grain growth simulations of selective laser melting

  Dezfoli, A. R. A., Lo, Y. L. & Raza, M. M., 2021 12月 1, 於: Materials. 14, 23, 7346.

  研究成果: Article › 同行評審

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  4 引文 斯高帕斯（Scopus）

• 3D nano-scale cutting model for nickel material

  Lin, Z. C., Huang, J. C. & Jeng, Y. R., 2007 10月 1, 於: Journal of Materials Processing Technology. 192-193, p. 27-36 10 p.

  研究成果: Article › 同行評審
  39 引文 斯高帕斯（Scopus）

• 3-D numerical analysis for fluid flow and heat transfer in a micro chip by using an electrohydrodynamic micro-pump

  Lin, C. W. & Jang, J. Y., 2005, Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005. American Society of Mechanical Engineers, p. 215-221 7 p. ICMM2005-75078. (Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005; 卷 PART B).

  研究成果: Conference contribution

• 3-D numerical and experimental analysis for airflow within a passenger compartment

  Chien, C. H., Jang, J-Y., Chen, Y. H. & Wu, S. C., 2008 8月 1, 於: International Journal of Automotive Technology. 9, 4, p. 437-445 9 p.

  研究成果: Article › 同行評審
  35 引文 斯高帕斯（Scopus）

• 3D numerical and experimental analysis for thermal-hydraulic characteristics of air flow inside a circular tube with different tube inserts

  Chiu, Y. W. & Jang, J. Y., 2009 2月, 於: Applied Thermal Engineering. 29, 2-3, p. 250-258 9 p.

  研究成果: Article › 同行評審
  68 引文 斯高帕斯（Scopus）

• 3-D numerical and experimental analysis of a built-in motorized high-speed spindle with helical water cooling channel

  Chien, C. H. & Jang, J-Y., 2008 12月 1, 於: Applied Thermal Engineering. 28, 17-18, p. 2327-2336 10 p.

  研究成果: Article › 同行評審
  58 引文 斯高帕斯（Scopus）

• 3D numerical definition with vectors for human smiles

  Li, S. R., Chen, K. & Ma, M. Y., 2011 9月 9, 於: International Journal of Physical Sciences. 6, 18, p. 4419-4427 9 p.

  研究成果: Article › 同行評審